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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 温度系数 | 电阻 | 子类别 | 额定功率 | 电阻器类型 | 工作电源电压 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 产品类别 | 电阻公差 | 主要属性 | 闪光大小 | 产品类别 | 产品长度 | 产品宽度 | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCVE2002-2HSISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | Xilinx | + 110 C | - 40 C | 1 | SOC - Systems on a Chip | 250 mW | Industrial | 880 mV | System-On-Modules - SOM | 1 | SoC FPGA | ||||||||||||||||||||||||||
| XCVE2302-2LSESFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | Xilinx | + 110 C | 0 C | 1 | 100.0000 ppm/°C | 15.4 MOhm | SOC - Systems on a Chip | 0.5 W | Industrial | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | 2.29 | 6.1 | ||||||||||||||||||||||
| XQVP1202-1LLIVSQA2785 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 40 C | 1 | Xilinx | Xilinx | AEC-Q200 | + 110 C | 100 ppm/K | 330 kOhm | SOC - Systems on a Chip | 1 W | 通用型 | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | 6.3 mm | 3.15 mm | |||||||||||||||||||||
| XQVC1802-1LLIVIQA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | Xilinx | + 110 C | - 40 C | 1 | 50.0000 ppm/°C | 137 kOhm | SOC - Systems on a Chip | 0.5 W | Industrial | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | 6.1 | |||||||||||||||||||||||
| AGFB023R31C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||
| AGID023R18A2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||
| AGFA019R31C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||
| AGIC035R39A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | ||||||||||||||||||||||||
| AGIB022R31A2I2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | ||||||||||||||||||||||||
| AGIB022R31A1E2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | ||||||||||||||||||||||||
| AGID019R31B2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||
| AGFB014R24D2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | |||||||||||||||||||||||||
| AGFC019R31C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||
| AGFD019R31C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||
| AGFB023R31C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||
| AGFA019R31C2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||
| AGIC040R39A1E2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 4.047M Logic Elements | ||||||||||||||||||||||||
| AGFD019R31C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||
| AGFC019R31C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||
| AGIB019R31B2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||
| BCM11350KFEBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Bulk | Obsolete | ||||||||||||||||||||||||||||||||||||
 | AMA4B2KL-KXR | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 131-VFBGA | 131-BGA (4.7x4.7) | AMA4B2KL | 75 | -20°C ~ 60°C | Tape & Reel (TR) | Apollo4 Blue Lite | 活跃 | 192MHz | 1.375MB | ARM® Cortex®-M4F | AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | GPIO, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART | MCU | 2MB | |||||||||||||||||||||||
| XC7Z030-2SB485I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | XC7Z030 | 活跃 | 130 | Tray | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||
| XCZU47DR-2FSVG1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | Tray | 活跃 | 561 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||
| XA7Z010-1CLG225Q | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | AMD | XA7Z010 | 活跃 | 86 | Tray | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, Zynq®-7000 XA | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - |
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XCVE2002-2HSISFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVE2302-2LSESFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
-
XQVP1202-1LLIVSQA2785
Xilinx
分类:Embedded - System On Chip (SoC)
-
XQVC1802-1LLIVIQA1596
Xilinx
分类:Embedded - System On Chip (SoC)
-
AGFB023R31C3I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGID023R18A2I3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA019R31C3E4X
Intel
分类:Embedded - System On Chip (SoC)
-
AGIC035R39A2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB022R31A2I2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB022R31A1E2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGID019R31B2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB014R24D2E2V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFC019R31C3E3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFD019R31C3E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB023R31C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA019R31C2I3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGIC040R39A1E2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFD019R31C2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFC019R31C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB019R31B2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
BCM11350KFEBG
Broadcom Limited
分类:Embedded - System On Chip (SoC)
-
AMA4B2KL-KXR
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
-
XC7Z030-2SB485I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-2FSVG1517E
AMD
分类:Embedded - System On Chip (SoC)
-
XA7Z010-1CLG225Q
AMD
分类:Embedded - System On Chip (SoC)