N/A

-

N/A

-

YES

20

小概要

5 V

无

Transferred

TEMIC SEMICONDUCTORS

SSO-20

105 °C

-40 °C

PLASTIC/EPOXY

SSOP

SSOP20,.25

RECTANGULAR

e0

Tin/Lead (Sn/Pb)

DUAL

鸥翼

1

0.635 mm

unknown

R-PDSO-G20

不合格

INDUSTRIAL

0.0087 mA

电信电路

N/A

-

YES

20

Obsolete

MOTOROLA INC

SOIC

SOP,

85 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

8542.39.00.01

DUAL

鸥翼

1

1.27 mm

unknown

20

R-PDSO-G20

不合格

INDUSTRIAL

ASYNCHRONOUS

2.65 mm

PCM 编解码器

YES

A-LAW

-5 V

12.8 mm

7.5 mm

N/A

-

活跃

BROADCOM INC

compliant

N/A

-

NO

20

无

活跃

HOLTEK SEMICONDUCTOR INC

DIP, DIP20(UNSPEC)

70 °C

-20 °C

PLASTIC/EPOXY

DIP

DIP20(UNSPEC)

RECTANGULAR

IN-LINE

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

unknown

R-PDIP-T20

不合格

COMMERCIAL

2 mA

3.58 MHz

N/A

-

表面贴装

100-LQFP

100-LQFP (14x14)

Analog Devices Inc./Maxim Integrated

DS21Q58

Obsolete

Tray

-40°C ~ 85°C

-

3.14V ~ 3.47V

收发器

E1

4

230mA

N/A

-

表面贴装

32-VQFN Exposed Pad

32-QFN (7x7)

0°C ~ 85°C

Tape & Reel (TR)

--

Obsolete

305mW

3.3V

ISL5585

Subscriber Line Interface Concept (SLIC)

--

1

--

Balanced and Unbalanced Ringing, Ringing Generator, Thermal Shutdown with Alarm Indicator

N/A

-

表面贴装

144-LFBGA, CSPBGA

144-CSBGA (12x12)

Analog Devices Inc./Maxim Integrated

MAX298

Obsolete

Tray

0°C ~ 70°C

-

2.045 W

1.62V ~ 1.98V, 3V ~ 3.6V

收发器

JTAG, USB

1

426mA

N/A

-

表面贴装

-

50-QFN (6x8)

Skyworks Solutions Inc.

SI32266

活跃

Tape & Reel (TR)

-

ProSLIC®

3.3V

Subscriber Line Interface Concept (SLIC), CODEC

GCI, PCM, SPI

1

-

N/A

-

表面贴装

144-BGA, CSPBGA

144-TECSBGA (13x13)

Analog Devices Inc./Maxim Integrated

DS3251

Obsolete

Tray

-40°C ~ 85°C

-

3.135V ~ 3.465V

Line Interface Unit (LIU)

LIU

1

80mA

N/A

-

表面贴装

28-SOIC (0.295, 7.50mm Width)

28-SOIC

ams欧司朗

Tube

Obsolete

-25°C ~ 70°C

-

3.8V ~ 5V

Telecom Circuit

-

1

4mA

N/A

-

表面贴装

60-WFQFN Exposed Pad

60-QFN (8x8)

Skyworks Solutions Inc.

SI32260

Obsolete

Tray

-40°C ~ 85°C

ProSLIC®

3.13V ~ 3.47V

Subscriber Line Interface Concept (SLIC), CODEC

GCI, PCM, SPI

1

-

N/A

-

表面贴装

196-LBGA

196-FBGA (15x15)

Infineon Technologies

CYV15G0201

Tray

Obsolete

0°C ~ 70°C

HOTlink II™

3.135V ~ 3.465V

收发器

LVTTL

2

570mA

N/A

-

表面贴装

Compliant

85 °C

-40 °C

1

4 µA

N/A

-

N/A

-

供应商未确认

EAR99

8542.31.00.01

无

无

无

无

无

表面贴装

Unconfirmed

N/A

-

41

88

-40

85

表面贴装

1

4.4

9.7

38

TSSOP

Compliant

8542.39.00.01

无

无

1

无

CMOS

有

60

有

3.13

3.3|5

5.25

Unconfirmed

38

N/A

-

8542330001

无

无

Unconfirmed

N/A

-

无

无

无

无

8542330001

EAR99

Ball

LFBGA

BGA

119

表面贴装

无

Unconfirmed

119

N/A

-

无

无

Unconfirmed

N/A

-

8542.39.00.01

Unknown

Unknown

Compliant

Unconfirmed

N/A

-

-40

70

3.465

3.3

3.135

有

60(Min)

有

CMOS

有

2

无

无

8542.39.00.01

Compliant

EAR99

Gull-wing

MQFP

QFP

64

14

14

2

表面贴装

85

卷带

活跃

64

N/A

-

5.5

3.3|5

3.1

有

53(Min)

有

CMOS

有

2

无

无

8542.39.00.01

EAR99

Compliant

Gull-wing

DSO

SOP

20

15.9

11

3.25

表面贴装

85

-40

0.9

卷带

Unconfirmed

20

N/A

-

表面贴装

无

无

5A991

供应商未确认

DSO

36

Obsolete

36

N/A

-

无

无

Obsolete