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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | Current - Supply (Nom) | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 电压 | 界面 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 25LC010A-I/P | Microchip Technology | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 5mA | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 通孔 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 5V | DUAL | 1 | 2.54mm | 25LC010A | SPI, Serial | 1Kb 128 x 8 | 10MHz | 100 ns | EEPROM | SPI | 5ms | 1 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 3.3mm | 9.4mm | 6.35mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC02BH-I/P | Microchip Technology | 数据表 | 1624 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 3mA | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 活跃 | 不适用 | 8 | EAR99 | 5V | DUAL | 1 | 2.54mm | 24LC02BH | I2C, Serial | 2Kb 256 x 8 | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 4.953mm | 10.16mm | 7.112mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA64-E/P | Microchip Technology | 数据表 | 40 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 3mA | Non-Volatile | -40°C~125°C TA | Tube | 2012 | e3 | 活跃 | 1 (Unlimited) | 3V | NOT APPLICABLE | 1 | 2.54mm | NOT APPLICABLE | 24AA64 | I2C, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 64KX1 | 1 | 5ms | 64 kb | I2C | 5ms | 5.5V | 2.5V | 5.334mm | 9.271mm | 7.62mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PC28F256M29EWLA | Micron Technology Inc. | 数据表 | 49 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LBGA | YES | 64 | 31mA | Non-Volatile | -40°C~85°C TA | Tray | 1998 | e1 | yes | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 3V | BOTTOM | 260 | 1 | 30 | 28F256M29EW | 3/3.3V | 2.7V | 256Mb 32M x 8 16M x 16 | FLASH | Parallel | 16MX16 | 100ns | 256 Mb | 0.00021A | 100 ns | Asynchronous | YES | YES | YES | 256 | 128K | 16/32words | YES | YES | 1.4mm | 11mm | 13mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | CY62187EV30LL-55BAXIT | Cypress Semiconductor Corp | 数据表 | 91 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 48-LFBGA | 48 | 55mA | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2001 | MoBL® | e4 | yes | 活跃 | 3 (168 Hours) | 48 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V | BOTTOM | 260 | 1 | 0.75mm | 40 | CY62187 | 64Mb 4M x 16 | 1 | SRAM | Parallel | 3-STATE | 16 | 55ns | 22b | 64 Mb | 55 ns | COMMON | Asynchronous | 16b | 3.7V | 2.2V | 9.5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC66AT-I/MC | Microchip Technology | 数据表 | 3401 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | 2mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | 5V | DUAL | 260 | 1 | 0.65mm | 40 | 93LC66A | Serial | 4Kb 512 x 8 | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1mm | 3mm | 2.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC160DT-I/MNY | Microchip Technology | 数据表 | 2454 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | 5mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 5V | DUAL | 260 | 1 | 0.5mm | 40 | 25LC160D | SPI, Serial | 16Kb 2K x 8 | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA66AXT-I/SN | Microchip Technology | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 2mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V | DUAL | 260 | 1 | 0.65mm | 40 | 93AA66A | 2/5V | Serial | 4Kb 512 x 8 | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 5.5V | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| 24LC16BHT-I/SN | Microchip Technology | 数据表 | 831 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 3mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2002 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 5V | DUAL | 260 | 1 | 1.27mm | 40 | 24LC16BH | I2C, Serial | 16Kb 2K x 8 | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1.7V | 1010MMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL128P90FFCR20 | Cypress Semiconductor Corp | 数据表 | 900 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | 110mA | Non-Volatile | 0°C~85°C TA | Tray | 2003 | GL-P | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 3.3V | BOTTOM | 260 | 1 | 1mm | 40 | 128Mb 16M x 8 | FLASH | Parallel | 8b | 128MX1 | 1 | 90ns | 128 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | 3.6V | 3V | YES | 128 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | SST25VF080B-50-4I-QAF-T | Microchip Technology | 数据表 | 700 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | SST25 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | 3.3V | DUAL | 1 | 1.27mm | SST25VF080B | SPI, Serial | 8Mb 1M x 8 | 50MHz | 0.03mA | 8 ns | FLASH | SPI | 1 | 10μs | 1b | 8 Mb | 0.00002A | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 3.6V | 2.7V | 6mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | M29W320DT70N6E | Micron Technology Inc. | 数据表 | 619 In Stock | - | 最小起订量: 1 最小包装量: 1 | Gold, Tin | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | 10mA | Non-Volatile | -40°C~85°C TA | Tray | 2008 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | 3A991.B.1.A | Matte Tin (Sn) | TOP BOOT BLOCK | 8542.32.00.51 | 3.3V | DUAL | 260 | 1 | 0.5mm | 30 | M29W320 | 3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | FLASH | Parallel | 2MX16 | 16 | 70ns | 32 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 12163 | 16K8K32K64K | YES | TOP | YES | 1.2mm | 18.4mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | MT48LC16M4A2P-75:GTR | Micron | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | RAM, SDRAM | Tape & Reel (TR) | 70 °C | 0 °C | 133 MHz | 3.3 V | Parallel | 61 MB | 133 µs | 4 b | 14 b | 64 Mb | 133 MHz | 无 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29GL064N90FFI042 | Cypress Semiconductor Corp | 数据表 | 13 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 64-LBGA | 64 | 50mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | GL-N | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 3V | BOTTOM | 260 | 1 | 1mm | 40 | 不合格 | 3/3.3V | 64Mb 8M x 8 4M x 16 | FLASH | Parallel | 4MX16 | 16 | 90ns | 64 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | 3.6V | 2.7V | YES | 8127 | 8/16words | YES | BOTTOM | YES | 1.4mm | 13mm | 11mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | W25Q40CLSNIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | 3V | DUAL | 1 | 1.27mm | 不合格 | 2.5/3.3V | SPI, Serial | 4Mb 512K x 8 | SYNCHRONOUS | 104MHz | 8 ns | FLASH | SPI | 4MX1 | 1 | 800μs | 32 Mb | 0.000005A | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 3.6V | 2.3V | 256B | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24C01C-I/MS | Microchip Technology | 数据表 | 25 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | 3mA | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 5V | DUAL | 260 | 1 | 0.65mm | 40 | 24C01C | 5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 400kHz | 900ns | EEPROM | I2C | 1ms | 1 kb | 0.00005A | I2C | 1000000 Write/Erase Cycles | 1ms | 200 | 1010DDDR | 950μm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC025-E/MC | Microchip Technology | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | 3mA | Non-Volatile | -40°C~125°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 5V | DUAL | 260 | 1 | 0.5mm | 40 | 24LC025 | I2C, Serial | 2Kb 256 x 8 | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | 1010DDDR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28LV010-20JU-T | Microchip Technology | 数据表 | 2559 In Stock | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | 表面贴装 | 32-LCC (J-Lead) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | 活跃 | 2 (1 Year) | 32 | Matte Tin (Sn) - annealed | 3.3V | QUAD | 未说明 | 1 | 1.27mm | 未说明 | R-PQCC-J32 | 1Mb 128K x 8 | ASYNCHRONOUS | 200ns | EEPROM | Parallel | 128KX8 | 8 | 10ms | 1048576 bit | 3V | 10ms | 3.465V | 3.135V | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C25632KV18-500BZXC | Cypress Semiconductor Corp | 数据表 | 394 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | 850mA | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.8V | BOTTOM | 260 | 1 | 1mm | 30 | CY7C25632 | 72Mb 4M x 18 | 2 | 500MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | 0.36A | SEPARATE | Synchronous | 18b | 1.7V | 1.9V | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| CY7C25652KV18-400BZXI | Cypress Semiconductor Corp | 数据表 | 2033 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | 1A | Volatile | -40°C~85°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 流水线结构 | 1.8V | BOTTOM | 260 | 1 | 1mm | 30 | CY7C25652 | 72Mb 2M x 36 | 2 | 400MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 19b | 72 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.9V | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T02FJ-WGE2 | ROHM Semiconductor | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2013 | yes | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | 不合格 | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000002A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 5.5V | 1.6V | 1010DDDR | 1.65mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT25040VI-GT3JN | ON Semiconductor | 数据表 | 2850 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 4 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | 活跃 | 1 (Unlimited) | 1.8V~5.5V | CAT25040 | SPI, Serial | 4Kb 512 x 8 | 20MHz | EEPROM | SPI | 5ms | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC56BT-E/SN | Microchip Technology | 数据表 | 6600 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 2mA | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 5V | DUAL | 260 | 1 | 1.27mm | 40 | 93LC56B | 3/5V | Serial | 2Kb 128 x 16 | 2MHz | 250 ns | EEPROM | SPI | 16 | 6ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 5.5V | 2.5V | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | CY14B256LA-SP45XI | Cypress Semiconductor Corp | 数据表 | 55 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | 48-BSSOP (0.295, 7.50mm Width) | 48 | 52mA | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e4 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.41 | 1W | 3V | DUAL | 260 | 1 | 0.635mm | 30 | CY14*256 | 256Kb 32K x 8 | NVSRAM | Parallel | 8b | 32KX8 | 8 | 45ns | 256 kb | 0.005A | 45 ns | 8b | 3.6V | 2.7V | 2.794mm | 15.875mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA01HT-I/ST | Microchip Technology | 数据表 | 12 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 3mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24AA01H | 2/5V | I2C, Serial | 1Kb 128 x 8 | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 5.5V | 1.7V | 1010XXXR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant |
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25LC010A-I/P
Microchip Technology
分类:Memory
-
24LC02BH-I/P
Microchip Technology
分类:Memory
-
24AA64-E/P
Microchip Technology
分类:Memory
-
PC28F256M29EWLA
Micron Technology Inc.
分类:Memory
-
CY62187EV30LL-55BAXIT
Cypress Semiconductor Corp
分类:Memory
-
93LC66AT-I/MC
Microchip Technology
分类:Memory
-
25LC160DT-I/MNY
Microchip Technology
分类:Memory
-
93AA66AXT-I/SN
Microchip Technology
分类:Memory
-
24LC16BHT-I/SN
Microchip Technology
分类:Memory
-
S29GL128P90FFCR20
Cypress Semiconductor Corp
分类:Memory
-
SST25VF080B-50-4I-QAF-T
Microchip Technology
分类:Memory
-
M29W320DT70N6E
Micron Technology Inc.
分类:Memory
-
MT48LC16M4A2P-75:GTR
Micron
分类:Memory
-
S29GL064N90FFI042
Cypress Semiconductor Corp
分类:Memory
-
W25Q40CLSNIG
Winbond Electronics
分类:Memory
-
24C01C-I/MS
Microchip Technology
分类:Memory
-
24LC025-E/MC
Microchip Technology
分类:Memory
-
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