N/A

-

FPGA

Flash

1

Nios II/Quartus II ver. 6.0 SP1

供应商未确认

8471.50.01.50

EP2C8

Unconfirmed

开发套件

4MB

ASMI Flash/Serial Flash

4MB

1

1

N/A

-

Nios II

供应商未确认

EAR99

8473.30.11.80

EP4CE55

FPGA

Flash

1

Unconfirmed

发展委员会

1GB

ASMI Flash/Serial Flash

64MB

3

1

N/A

-

8473.30.11.80

Compliant

EAR99

N/A

-

67 mm x 84 mm x 5 mm

Allwinner

A20

Serial

0 C

+ 70 C

DDR3

5

A20-SOM204

1 GHz

1 GB

SO-DIMM

N/A

-

Pentium

8 GB

4 GB

Audio, Ethernet, GPIO, PCIe, SDIO, SPI, USB

0 C

+ 60 C

2 MB

DDR3L

32 GB

eMMC

N4200

1

84 mm x 55 mm

Details

Intel

SOM-7569

1.1 GHz

4.75 V to 20 V

4 GB

COM Express 2.1

N/A

-

8 GB

4 GB

Ethernet, GPIO, I2C, PCIe, SATA, Serial, USB

- 40 C

+ 85 C

DDR3L

16 GB

eMMC

E3805

1

70 mm x 70 mm

Details

Intel

Atom

SOM-3567

1.33 GHz

5 V

4 GB

Qseven

N/A

-

+ 60 C

DDR3L

E3845

1

70 mm x 70 mm

Details

Intel

Atom

8 GB

4 GB

Ethernet, GPIO, I2C, PCIe, SATA, Serial, USB

0 C

SOM-3567

1.91 GHz

5 V

4 GB

Qseven

N/A

-

1

95 mm x 95 mm

Details

Intel

Atom

8 GB

Audio, Ethernet, GPIO, I2C, SATA, Serial, USB

- 40 C

+ 85 C

DDR3L

X7-E3950

SOM-6869

1.6 GHz

4.75 V to 20 V

COM Express 紧凑型模块

N/A

-

Atom

8 GB

4 GB

Audio, Ethernet, GPIO, PCIe, SDIO, SPI, USB

- 40 C

+ 85 C

2 MB

DDR3L

32 GB

eMMC

X5-E3940

1

84 mm x 55 mm

Details

Intel

SOM-7569

1.6 GHz

4.75 V to 20 V

4 GB

COM Express 2.1

N/A

-

8 GB

4 GB

Ethernet, GPIO, I2C, PCIe, SATA, Serial, USB

- 40 C

+ 85 C

DDR3L

32 GB

eMMC

E3845

1

70 mm x 70 mm

Details

Intel

Atom

SOM-3567

1.91 GHz

5 V

4 GB

Qseven

N/A

-

Details

Advantech Corp

Intel

Atom

4 GB

2 GB

Audio, GPIO, I2C, SATA, SPI, USB

- 40 C

+ 85 C

1 MB

DDR3L

E3825

1

Bulk

有

Obsolete

84 mm x 55 mm

-40°C ~ 85°C

SOM-7567

3.300 x 2.170 (83.82mm x 55.12mm)

-

1.33 GHz

4.75 V to 20 V

1.33GHz

2 GB

Atom E3825

GbE

USB 2.0 (4), USB 3.0 (1)

微型COM Express模块

2

4GB/2GB

SATA 2.0 (2)

DDI, LCD, Multi-Display

HD-A, I²C, LPC, PCIe, SMBus

-

Fan + Heat Sink

-

N/A

-

- 40 C

+ 85 C

1 MB

COM Express 紧凑型模块

DDR3L-1333

E3827

1

95 mm x 95 mm

Details

Intel

Atom

8 GB

Audio, Ethernet, GPIO, I2C, SATA, Serial, USB

SOM-6867

1.75 GHz

4.75 V to 20 V

N/A

-

XCZU9EG-1FFVC900E

4 GB

4 GB

PCIe

128 MB

DDR4

32 GB

eMMC

Zynq UltraScale+

1

5.2 cm x 7.6 cm

This product may require additional documentation to export from the United States.

Details

Xilinx

5.2 cm x 7.6 cm

N/A

-

XCZU9EG-2FFVC900I

4 GB

4 GB

GPIO, Serial

- 40 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

5.2 cm x 7.6 cm

This product may require additional documentation to export from the United States.

Details

Xilinx

5.2 cm x 7.6 cm

N/A

-

- 40 C

+ 85 C

6 MB

QM175

DDR4-2400

i5-7440EQ

1

125 mm x 95 mm

Details

Intel

Core i5

32 GB

Audio, Ethernet, GPIO, I2C, PCIe, SPI, USB

SOM-5898

2.9 GHz

8.5 V to 20 V

COM Express 基本模块

N/A

-

- 40 C

+ 85 C

3 MB

QM175

DDR4-2400

i3-7102E

1

125 mm x 95 mm

Details

Intel

Core i3

32 GB

Audio, Ethernet, GPIO, I2C, PCIe, SPI, USB

SOM-5898

2.1 GHz

8.5 V to 20 V

COM Express 基本模块

N/A

-

12 MB

DDR4

D-1548

1

125 mm x 95 mm

Details

Intel

Xeon D-1548

64 GB

Ethernet, GPIO, I2C, PCIe, SATA, Serial, USB

0 C

+ 60 C

SOM-5992

2 GHz

8.5 V to 20 V

55.53 W

COM Express 基本模块

N/A

-

活跃

45 mm x 40 mm x 3.5 mm

Digi

Details

NXP

i.MX 8M Mini Quad

2 GB

2 GB

Bluetooth, Ethernet, I2C, PCIe, SPI, UART, USB, WiFi

- 40 C

+ 85 C

16 kB, 32 kB

LPDDR4

8 GB

eMMC

50

Box

CC-WMX

-40°C ~ 85°C

ConnectCore® 8M Mini

1.770 L x 1.570 W (45.00mm x 40.00mm)

USB

1.6 GHz

2 GB

1.6GHz

2GB

ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8

Digi SMTplus

MPU核心

-

-

N/A

-

DDR4

16 GB

eMMC

1

Kria

AMD 赛灵思

自适应系统模块

Box

活跃

Details

Xilinx

XCK26-SFVC784-2LV-I

4 GB

4 GB

CAN, GPIO, I2C, SDIO, SPI, UART, USB

- 40 C

+ 100 C

备用电池

L2

K26I

64 MB, 16 GB

-40°C ~ 100°C (TJ)

K26

3.030 L x 2.360 W (77.00mm x 60.00mm)

2 x 240 Pin

533 MHz, 1.33 GHz

5 V

4 GB

533MHz, 1.333GHz

4GB

ARM® Cortex®-A53

15 W

-

FPGA核心

16GB eMMC, 64MB QSPI

Arm® Cortex®-R5F

N/A

-

64 MB, 16 GB

DDR4

16 GB

eMMC

1

Kria

AMD 赛灵思

自适应系统模块

Box

活跃

77 mm x 60 mm x 10.9 mm

Details

Xilinx

XCK26-SFVC784-2LV-C

4 GB

4 GB

CAN, GPIO, I2C, SDIO, SPI, UART, USB

0 C

+ 85 C

备用电池

L2

K26C

0°C ~ 85°C (TJ)

K26

3.030 L x 2.360 W (77.00mm x 60.00mm)

2 x 240 Pin

533 MHz, 1.33 GHz

5 V

4 GB

533MHz, 1.333GHz

4GB

ARM® Cortex®-A53

15 W

-

FPGA核心

16GB eMMC, 64MB QSPI

Arm® Cortex®-R5F

N/A

-

N4200

84 mm x 55 mm

Intel

Pentium

4 GB

4 GB

Audio, Ethernet, I2C, RS-232, SATA, USB

- 20 C

+ 60 C

SoC集成

DDR3L

2.5 GHz

4 GB

COM Express Type 10

N/A

-

x5/E3940

84 mm x 55 mm

Intel

Atom

4 GB

4 GB

Audio, Ethernet, I2C, RS-232, SATA, USB

- 40 C

+ 85 C

SoC集成

DDR3L

1.8 GHz

4 GB

COM Express Type 10

N/A

-

1 GB

Digi

512 MB

Bluetooth, Ethernet, I2C, PCIe, SPI, UART, USB, WiFi

- 40 C

+ 85 C

32 kB

LPDDR4

8 GB

eMMC

NXP i.MX8 Nano

50

NXP

i.MX 8M Nano

Bulk

活跃

45 mm x 40 mm x 3.5 mm

-40°C ~ 85°C

ConnectCore® 8M

1.770 L x 1.570 W (45.00mm x 40.00mm)

USB

1.4 GHz

512 MB

600MHz, 1.4GHz

512MB

ARM® Cortex®-A53

Digi SMTplus

单片机核心

-

ARM® Cortex®-M7

N/A

-

活跃

76 mm x 52 mm

Trenz Electronic GmbH

This product may require additional documentation to export from the United States.

Details

Xilinx

XCZU7CG-1FBVB900I

4 GB

4 GB

GPIO, Serial

- 40 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

Box

TE0807

-40°C ~ 85°C

TE0807

2.050 L x 2.990 W (52.00mm x 76.00mm)

B2B

-

4GB

Zynq UltraScale+ XCZU7CG-1FBVB900I

5.2 cm x 7.6 cm

MPU核心

128MB

-

N/A

-

XCZU15EG-1FFVC900E

4 GB

4 GB

GPIO, Serial

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

76 mm x 52 mm

This product may require additional documentation to export from the United States.

Details

Xilinx

5.2 cm x 7.6 cm