N/A

-

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

PLASTIC/EPOXY

LDCC84,1.2SQ

5 V

30

4.75 V

70 °C

无

EPM7064LC84-10

125 MHz

QCCJ

SQUARE

Altera Corporation

Transferred

68

ALTERA CORP

5.25 V

4.44

LCC

68

64

PLASTIC, LCC-84

CHIP CARRIER

2

0°C ~ 70°C (TA)

Tube

MAX® 7000

e0

无

Obsolete

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

220

1.27 mm

unknown

EPM7064

84

S-PQCC-J84

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

10 ns

0 DEDICATED INPUTS, 68 I/O

5.08 mm

EE PLD

1250

MACROCELL

64

NO

4.75 V ~ 5.25 V

10.0ns

4

NO

29.3116 mm

29.3116 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

PLASTIC/EPOXY

QFP100,.7X.9

5 V

30

4.75 V

70 °C

无

EPM7064QC100-7

166.7 MHz

QFP

RECTANGULAR

Intel Corporation

Obsolete

68

INTEL CORP

5.25 V

8.52

68

64

QFP, QFP100,.7X.9

FLATPACK

3

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

Obsolete

锡铅

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.65 mm

compliant

EPM7064

R-PQFP-G100

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

7.5 ns

0 DEDICATED INPUTS, 68 I/O

3.65 mm

EE PLD

1250

MACROCELL

64

NO

4.75 V ~ 5.25 V

7.5ns

4

NO

20 mm

14 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

PLASTIC/EPOXY

QFP100,.7X.9

5 V

30

4.75 V

70 °C

无

EPM7160EQC100-10

125 MHz

QFP

RECTANGULAR

Altera Corporation

Transferred

84

ALTERA CORP

5.25 V

4.2

QFP

84

160

PLASTIC, QFP-100

FLATPACK

3

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

无

Obsolete

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.65 mm

compliant

EPM7160

100

R-PQFP-G100

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

10 ns

0 DEDICATED INPUTS, 84 I/O

3.65 mm

EE PLD

3200

MACROCELL

160

NO

4.75 V ~ 5.25 V

10.0ns

10

NO

20 mm

14 mm

N/A

-

表面贴装

160-BQFP

YES

160-PQFP (28x28)

160

3

PLASTIC/EPOXY

QFP160,1.2SQ

5 V

30

4.75 V

70 °C

无

EPM7192SQC160-15

100 MHz

QFP

SQUARE

Obsolete

124

INTEL CORP

5.25 V

7.94

124

192

ALTERA

QFP, QFP160,1.2SQ

FLATPACK

0°C ~ 70°C (TA)

Tray

MAX® 7000S

e0

Obsolete

EAR99

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.65 mm

compliant

EPM7192

S-PQFP-G160

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

15 ns

0 DEDICATED INPUTS, 124 I/O

4.07 mm

EE PLD

3750

MACROCELL

192

YES

4.75 V ~ 5.25 V

15.0ns

12

YES

28 mm

28 mm

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

2.375 V

70 °C

无

EPM7256BFC256-10

188.7 MHz

BGA

SQUARE

Intel Corporation

Obsolete

164

INTEL CORP

2.625 V

5.1

164

256

BGA, BGA256,16X16,40

网格排列

3

0°C ~ 70°C (TA)

Tray

MAX® 7000B

e0

Obsolete

EAR99

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

compliant

EPM7256

S-PBGA-B256

不合格

1.8/3.3,2.5 V

COMMERCIAL

系统内可编程

5 ns

0 DEDICATED INPUTS, 164 I/O

3.5 mm

EE PLD

5000

MACROCELL

256

YES

2.375 V ~ 2.625 V

10.0ns

16

YES

17 mm

17 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

PLASTIC/EPOXY

TQFP100,.63SQ

3.3 V

40

3 V

70 °C

有

EPM3064ATC100-7N

135.1 MHz

LFQFP

SQUARE

Altera Corporation

Transferred

66

ALTERA CORP

3.6 V

5.2

QFP

66

64

TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e3

有

Obsolete

EAR99

Matte Tin (Sn) - annealed

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

unknown

EPM3064

100

S-PQFP-G100

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 66 I/O

1.27 mm

EE PLD

1250

MACROCELL

64

YES

3 V ~ 3.6 V

7.5ns

4

YES

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

3

PLASTIC/EPOXY

TQFP100,.63SQ

-40 °C

5 V

40

4.5 V

85 °C

有

EPM7064STI100-7N

166.7 MHz

LFQFP

SQUARE

Altera Corporation

Transferred

68

ALTERA CORP

5.5 V

2.95

QFP

68

64

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

-40°C ~ 85°C (TA)

Tray

MAX® 7000S

e3

有

Obsolete

EAR99

Matte Tin (Sn)

64 MACROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM7064

100

S-PQFP-G100

不合格

3.3/5,5 V

INDUSTRIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 68 I/O

1.27 mm

EE PLD

1250

MACROCELL

64

NO

4.5 V ~ 5.5 V

7.5ns

4

YES

14 mm

14 mm

N/A

-

表面贴装

160-BQFP

YES

160-PQFP (28x28)

160

PLASTIC/EPOXY

QFP160,1.2SQ

5 V

40

4.75 V

70 °C

有

EPM7192SQC160-7N

166.7 MHz

QFP

SQUARE

Altera Corporation

Transferred

124

ALTERA CORP

5.25 V

3.73

QFP

124

192

QFP, QFP160,1.2SQ

FLATPACK

3

0°C ~ 70°C (TA)

Tray

MAX® 7000S

e3

有

Obsolete

EAR99

Matte Tin (Sn)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

245

0.65 mm

compliant

EPM7192

160

S-PQFP-G160

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 124 I/O

4.07 mm

EE PLD

3750

MACROCELL

192

YES

4.75 V ~ 5.25 V

7.5ns

12

YES

28 mm

28 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

PLASTIC/EPOXY

LDCC44,.7SQ

3.3 V

40

3 V

70 °C

有

EPM3064ALC44-4N

222.2 MHz

QCCJ

SQUARE

Intel Corporation

Obsolete

34

INTEL CORP

3.6 V

5.21

34

64

QCCJ, LDCC44,.7SQ

CHIP CARRIER

3

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e3

Obsolete

EAR99

Matte Tin (Sn)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

245

1.27 mm

compliant

EPM3064

S-PQCC-J44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

4.5 ns

0 DEDICATED INPUTS, 34 I/O

4.572 mm

EE PLD

1250

MACROCELL

64

YES

3 V ~ 3.6 V

4.5ns

4

YES

16.5862 mm

16.5862 mm

N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

PLASTIC/EPOXY

TQFP44,.47SQ,32

5 V

30

4.75 V

70 °C

无

EPM7064STC44-6

200 MHz

LQFP

SQUARE

Intel Corporation

Obsolete

36

INTEL CORP

5.25 V

5.35

36

64

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

0°C ~ 70°C (TA)

Tray

MAX® 7000S

e0

Obsolete

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.8 mm

compliant

EPM7064

S-PQFP-G44

不合格

5 V

COMMERCIAL

系统内可编程

6 ns

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

1250

MACROCELL

64

YES

4.75 V ~ 5.25 V

6.0ns

4

YES

10 mm

10 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

PLASTIC/EPOXY

LDCC44,.7SQ

5 V

30

4.75 V

70 °C

无

EPM7064LC44-12

125 MHz

QCCJ

SQUARE

Intel Corporation

Obsolete

36

INTEL CORP

5.25 V

5.61

36

64

QCCJ, LDCC44,.7SQ

CHIP CARRIER

1

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

Obsolete

锡铅

LABS INTERCONNECTED BY PIA; 4 LABS; 64 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

220

1.27 mm

compliant

EPM7064

S-PQCC-J44

不合格

5 V

COMMERCIAL

EE PLD

12 ns

0 DEDICATED INPUTS, 36 I/O

4.572 mm

EE PLD

1250

MACROCELL

64

NO

4.75 V ~ 5.25 V

12.0ns

4

NO

16.5862 mm

16.5862 mm

N/A

-

YES

256

2.5 V

40

2.375 V

有

EPM2210F256I5N

BGA

SQUARE

Intel Corporation

活跃

204

CPLD - Complex Programmable Logic Devices CPLD - MAX II 1700 Macro 204 IO

INTEL CORP

2.625 V

1.2

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

e1

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5/3.3,2.5/3.3 V

11.2 ns

0 DEDICATED INPUTS, 204 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

YES

17 mm

17 mm

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

Altera

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.8 V

30

1.71 V

85 °C

无

EPM2210GF256C3

BGA

SQUARE

Intel Corporation

活跃

204

INTEL CORP

1.89 V

5.02

204

1700

Bulk

活跃

BGA, BGA256,16X16,40

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

3A991

锡铅

YES

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

compliant

EPM2210

S-PBGA-B256

不合格

1.5/3.3,1.8 V

商业扩展

系统内可编程

7 ns

0 DEDICATED INPUTS, 204 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

1.71 V ~ 1.89 V

7.0ns

2210

YES

17 mm

17 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

1.8 V

30

1.71 V

无

EPM2210GF324I5

BGA

SQUARE

Intel Corporation

活跃

272

INTEL CORP

1.89 V

5.02

272

1700

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40°C ~ 100°C (TJ)

Tray

MAX® II

e0

活跃

3A991

锡铅

YES

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

compliant

EPM2210

S-PBGA-B324

不合格

1.5/3.3,1.8 V

系统内可编程

11.2 ns

0 DEDICATED INPUTS, 272 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

1.71 V ~ 1.89 V

7.0ns

2210

YES

19 mm

19 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

PLASTIC/EPOXY

LDCC44,.7SQ

5 V

30

4.75 V

70 °C

无

EPM7064LC44-7

166.7 MHz

QCCJ

SQUARE

Altera Corporation

Transferred

36

ALTERA CORP

5.25 V

4.44

LCC

36

64

PLASTIC, LCC-44

CHIP CARRIER

1

0°C ~ 70°C (TA)

Tube

MAX® 7000

e0

无

Obsolete

Tin/Lead (Sn/Pb)

LABS INTERCONNECTED BY PIA; 4 LABS; 64 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

220

1.27 mm

not_compliant

EPM7064

44

S-PQCC-J44

不合格

5 V

COMMERCIAL

EE PLD

7.5 ns

0 DEDICATED INPUTS, 36 I/O

4.572 mm

EE PLD

1250

MACROCELL

64

NO

4.75 V ~ 5.25 V

7.5ns

4

NO

16.5862 mm

16.5862 mm

N/A

-

表面贴装

100-TFBGA

YES

100-MBGA (6x6)

100

PLASTIC/EPOXY

BGA100,11X11,20

2.5 V

40

2.375 V

85 °C

有

EPM570M100C4N

BGA

SQUARE

Intel Corporation

活跃

76

IC MAX II CPLD 570 LE 100-MBGA

INTEL CORP

2.625 V

5.04

76

440

BGA, BGA100,11X11,20

网格排列

3

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

0.5 mm

compliant

EPM570

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

7 ns

0 DEDICATED INPUTS, 76 I/O

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

N/A

-

表面贴装

304-BFQFP

YES

304-RQFP (40x40)

304

QFP

FQFP, HQFP304,1.7SQ,20

FLATPACK, FINE PITCH

Obsolete

216

ALTERA CORP

5.25 V

HQFP304,1.7SQ,20

5 V

30

4.75 V

70 °C

无

EPM9560RC304-15

117.6 MHz

FQFP

SQUARE

Altera Corporation

216

560

3

PLASTIC/EPOXY

7.98

0°C ~ 70°C (TA)

Tray

MAX® 9000

e0

无

Obsolete

3A001.A.7.A

Tin/Lead (Sn/Pb)

772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

compliant

EPM9560

304

S-PQFP-G304

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

16.6 ns

0 DEDICATED INPUTS, 216 I/O

4.5 mm

EE PLD

12000

MACROCELL

560

YES

4.75 V ~ 5.25 V

15.0ns

35

YES

40 mm

40 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

AMD

180

Bulk

512

XCR3512

Obsolete

-40°C ~ 85°C (TA)

CoolRunner XPLA3

In System Programmable (min 1K program/erase cycles)

12000

2.7V ~ 3.6V

10.8 ns

32

N/A

-

表面贴装

160-BQFP

YES

160-PQFP (28x28)

160

PLASTIC/EPOXY

QFP160,1.2SQ

5 V

30

4.75 V

70 °C

无

EPM7192SQC160-7

166.7 MHz

QFP

SQUARE

Intel Corporation

Obsolete

124

INTEL CORP

5.25 V

5.21

124

192

QFP, QFP160,1.2SQ

FLATPACK

3

0°C ~ 70°C (TA)

Tray

MAX® 7000S

e0

Obsolete

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.65 mm

compliant

EPM7192

S-PQFP-G160

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 124 I/O

4.07 mm

EE PLD

3750

MACROCELL

192

YES

4.75 V ~ 5.25 V

7.5ns

12

YES

28 mm

28 mm

N/A

-

表面贴装

160-LFBGA

169-UBGA (11x11)

Altera

141

512

Bulk

EPM7512

活跃

0°C ~ 70°C (TA)

Tray

MAX® 7000B

Obsolete

EPM7512

系统内可编程

10000

2.375 V ~ 2.625 V

7.5ns

32

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

1.8 V

40

1.71 V

有

EPM2210GF256I5N

BGA

SQUARE

Intel Corporation

活跃

204

INTEL CORP

1.89 V

1.23

204

1700

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40°C ~ 100°C (TJ)

Tray

MAX® II

e1

活跃

3A991

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM2210

S-PBGA-B256

不合格

1.5/3.3,1.8 V

系统内可编程

11.2 ns

0 DEDICATED INPUTS, 204 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

1.71 V ~ 1.89 V

7.0ns

2210

YES

17 mm

17 mm

N/A

-

表面贴装

256-BGA

256-FBGA (17x17)

Altera

100

128

Bulk

EPM7128

活跃

0°C ~ 70°C (TA)

Tray

MAX® 7000B

Obsolete

EPM7128

系统内可编程

2500

2.375 V ~ 2.625 V

4.0ns

8

N/A

-

表面贴装

240-BFQFP Exposed Pad

YES

240-RQFP (32x32)

240

PLASTIC/EPOXY

HQFP240,1.37SQ,20

5 V

30

4.75 V

70 °C

无

EPM9560RC240-20

100 MHz

FQFP

SQUARE

Intel Corporation

Obsolete

191

INTEL CORP

5.25 V

5.4

191

560

FQFP, HQFP240,1.37SQ,20

FLATPACK, FINE PITCH

3

0°C ~ 70°C (TA)

Tray

MAX® 9000

e0

Obsolete

Tin/Lead (Sn/Pb)

772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

compliant

EPM9560

S-PQFP-G240

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

23.6 ns

0 DEDICATED INPUTS, 191 I/O

4.1 mm

EE PLD

12000

MACROCELL

560

YES

4.75 V ~ 5.25 V

20.0ns

35

YES

32 mm

32 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

AMD

164

Tray

256

XCR3256

Obsolete

0°C ~ 70°C (TA)

CoolRunner XPLA3

In System Programmable (min 1K program/erase cycles)

6000

3V ~ 3.6V

7 ns

16

N/A

-

表面贴装

49-LFBGA

YES

49-UBGA (7x7)

49

PLASTIC/EPOXY

BGA49,7X7,32

2.5 V

40

2.375 V

70 °C

有

EPM7032BUC49-3N

303 MHz

LFBGA

SQUARE

Altera Corporation

Obsolete

36

ALTERA CORP

2.625 V

5.63

BGA

36

32

LFBGA, BGA49,7X7,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

0°C ~ 70°C (TA)

Tray

MAX® 7000B

e1

Obsolete

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

YES

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

0.8 mm

compliant

EPM7032

49

S-PBGA-B49

不合格

1.8/3.3,2.5 V

COMMERCIAL

系统内可编程

3.5 ns

0 DEDICATED INPUTS, 36 I/O

1.55 mm

EE PLD

600

MACROCELL

32

YES

2.375 V ~ 2.625 V

3.5ns

2

YES

7 mm

7 mm