N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

Non-Compliant

36

64

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

PLASTIC/EPOXY

TQFP44,.47SQ,32

-40 °C

2.5 V

30

2.375 V

85 °C

无

EPM7064BTI44-5

303 MHz

LQFP

SQUARE

Intel Corporation

Obsolete

36

INTEL CORP

2.625 V

7.82

-40°C ~ 85°C (TA)

Tray

MAX® 7000B

e0

Obsolete

EAR99

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.8 mm

compliant

EPM7064

S-PQFP-G44

不合格

1.8/3.3,2.5 V

INDUSTRIAL

系统内可编程

3.5 ns

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

1250

MACROCELL

64

YES

2.375 V ~ 2.625 V

5.0ns

4

YES

10 mm

10 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

QFP144,.87SQ,20

2.5 V

40

2.375 V

85 °C

有

EPM570T144C5N

LFQFP

SQUARE

Intel Corporation

活跃

116

CPLD, MAX II

INTEL CORP

2.625 V

1.17

116

440

MAX II

20 x 20 x 1.4mm

2.375 V

TQFP

+85 °C

0 °C

57

3.6 V

Flash

有

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

Matte Tin (Sn)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM570

144

S-PQFP-G144

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

8.7 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

1.4mm

20mm

20mm

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

2.375 V

85 °C

有

EPM570F256C5N

BGA

SQUARE

Intel Corporation

活跃

160

INTEL CORP

2.625 V

0.59

160

440

BGA, BGA256,16X16,40

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM570

S-PBGA-B256

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

8.7 ns

0 DEDICATED INPUTS, 160 I/O

2.2 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

17 mm

17 mm

N/A

-

表面贴装

208-BFQFP Exposed Pad

208-RQFP (28x28)

146

480

0°C ~ 70°C (TA)

Tray

MAX® 9000

Obsolete

EPM9480

系统内可编程

10000

4.75 V ~ 5.25 V

20.0ns

30

N/A

-

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

Altera

2.625 V

5.64

QFP

84

Bulk

256

EPM7256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

30

2.375 V

85 °C

无

EPM7256BTI100-7

188.7 MHz

LFQFP

SQUARE

Rochester Electronics LLC

活跃

84

ROCHESTER ELECTRONICS INC

-40°C ~ 85°C (TA)

MAX® 7000B

e0

无

锡铅

CMOS

QUAD

鸥翼

235

0.5 mm

unknown

100

S-PQFP-G100

COMMERCIAL

INDUSTRIAL

系统内可编程

5 ns

0 DEDICATED INPUTS, 84 I/O

1.27 mm

EE PLD

5000

MACROCELL

2.375V ~ 2.625V

7.5 ns

16

14 mm

14 mm

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

AMD

Non-Compliant

117

Tray

288

XC95288XV

Obsolete

0°C ~ 70°C (TA)

XC9500XV

系统内可编程

6400

2.37V ~ 2.62V

7.5 ns

16

N/A

-

N/A

-

表面贴装

20-UFQFN

20-STQFN (2x3)

Renesas Design Germany GmbH

9

Tape & Reel (TR)

15

活跃

-40°C ~ 85°C (TA)

GreenPAK™

OTP

2.3V ~ 5.5V

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

512

FINE LINE, BGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

3.3 V

30

3 V

70 °C

无

EPM3512AFC256-10

BGA

SQUARE

Altera Corporation

Transferred

208

ALTERA CORP

3.6 V

3.97

BGA

208

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e0

无

Obsolete

3A991

Tin/Lead (Sn63Pb37)

YES

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

not_compliant

EPM3512

256

S-PBGA-B256

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 208 I/O

3.5 mm

EE PLD

10000

MACROCELL

512

YES

3 V ~ 3.6 V

10.0ns

32

YES

17 mm

17 mm

N/A

-

表面贴装

208-BFQFP Exposed Pad

208-RQFP (28x28)

Altera

139

400

Tray

Obsolete

0°C ~ 70°C (TA)

Tray

MAX® 9000

Obsolete

EPM9400

系统内可编程

8000

4.75 V ~ 5.25 V

15.0ns

25

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

32

QCCJ, LDCC44,.7SQ

CHIP CARRIER

1

PLASTIC/EPOXY

LDCC44,.7SQ

3.3 V

未说明

3 V

70 °C

无

EPM3032ALC44-4

227.3 MHz

QCCJ

SQUARE

Intel Corporation

Obsolete

34

INTEL CORP

3.6 V

5.25

34

0°C ~ 70°C (TA)

Tube

MAX® 3000A

e0

Obsolete

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

未说明

1.27 mm

compliant

EPM3032

S-PQCC-J44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

4.5 ns

0 DEDICATED INPUTS, 34 I/O

4.572 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

4.5ns

2

YES

16.5862 mm

16.5862 mm

N/A

-

Compliant

N/A

-

表面贴装

176-LQFP

YES

176-TQFP (24x24)

176

Lattice Semiconductor Corporation

2.7 V

5.78

QFP

1

Glenair

Glenair

128

Bulk

128

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

30

2.3 V

70 °C

无

ISPLSI2128VL-135LT176

95 MHz

LFQFP

SQUARE

活跃

128

ROCHESTER ELECTRONICS INC

0°C ~ 70°C (TA)

D38999 Series IV

e0

无

锡铅

Circular Connectors

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

176

S-PQFP-G176

COMMERCIAL

COMMERCIAL

In System Programmable (min 10K program/erase cycles)

10 ns

4 DEDICATED INPUTS, 128 I/O

1.6 mm

EE PLD

军规圆形连接器

6000

MACROCELL

4

2.3V ~ 2.7V

7.5 ns

32

军规圆形连接器

24 mm

24 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

Infineon Technologies

Non-Compliant

165

Tray

512

CY37512

Obsolete

0°C ~ 70°C (TA)

Ultra37000™

In-System Reprogrammable™ (ISR™) CMOS

4.75V ~ 5.25V

15 ns

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

AMD

256

XC2C256

Obsolete

0.670593 oz

1

TE Connectivity

TE Connectivity / AMP

Details

173

Tray

-40°C ~ 85°C (TA)

CoolRunner II

Tools

系统内可编程

Wire Strippers & Cutters

6000

1.7V ~ 1.9V

6.7 ns

16

Wire Stripping & Cutting Tools

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

AMD

288

XC95288XV

Obsolete

168

Tray

0°C ~ 70°C (TA)

XC9500XV

系统内可编程

6400

2.37V ~ 2.62V

7.5 ns

16

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

AMD

64

XC2C64

活跃

64

Tray

0°C ~ 70°C (TA)

CoolRunner II

系统内可编程

1500

1.7V ~ 1.9V

6.7 ns

4

N/A

-

N/A

-

Gold

YES

Aluminum

68

LDCC68,1.0SQ

5 V

20

4.75 V

70 °C

无

EPM5128JC-1

50 MHz

WQCCJ

SQUARE

Obsolete

52

ALTERA CORP

LCC

8.71

5.25 V

9

方形法兰

MIL-DTL-38999

0.035274 oz

1

Panel

09-19

Copper Alloy

Threaded

Amphenol

Amphenol Aerospace

2M

N

WQCCJ, LDCC68,1.0SQ

CHIP CARRIER, WINDOW

CERAMIC, METAL-SEALED COFIRED

2M801

e0

无

EAR99

19 Position

Tin/Lead (Sn/Pb)

LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

Circular Connectors

CMOS

QUAD

J BEND

220

1.27 mm

unknown

5 A

68

Solder

S-CQCC-J68

不合格

Pin (Male)

5 V

28-23

COMMERCIAL

40 ns

7 DEDICATED INPUTS, 52 I/O

5.08 mm

UV PLD

军规圆形连接器

MACROCELL

128

黑锌镍

NO

7

NO

Receptacles

Straight

军规圆形连接器

24.13 mm

24.13 mm

N/A

-

1 Week

表面贴装

160-LQFP

YES

160-TQFP (24x24)

160

Infineon Technologies

CYPRESS SEMICONDUCTOR CORP

3.6 V

5.7

QFP

Other

133

Tray

128

CY37128

Obsolete

24 X 24 MM, 1.4 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-160

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP160,1.0SQ,20

3.3 V

20

3 V

70 °C

有

CY37128VP160-83AXC

62.5 MHz

LFQFP

SQUARE

赛普拉斯半导体

Obsolete

133

0°C ~ 70°C (TA)

Ultra37000™

e3

Matte Tin (Sn)

128 MACROCELLS

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

unknown

160

S-PQFP-G160

不合格

3.3 V

COMMERCIAL

In-System Reprogrammable™ (ISR™) CMOS

15 ns

1 DEDICATED INPUTS, 133 I/O

1.6 mm

EE PLD

MACROCELL

128

YES

1

3V ~ 3.6V

15 ns

YES

24 mm

24 mm

N/A

-

表面贴装

292-BGA

YES

292-PBGA (27x27)

256

Infineon Technologies

3.6 V

5.83

BGA

Attachable current transformer

197

Tray

512

CY37512

Obsolete

BGA,

网格排列

3

PLASTIC/EPOXY

3.3 V

未说明

3 V

70 °C

无

CY37512VP256-83BGC

62.5 MHz

BGA

SQUARE

Rochester Electronics LLC

活跃

197

ROCHESTER ELECTRONICS INC

0°C ~ 70°C (TA)

Ultra37000™

e0

无

锡铅

512 MACROCELLS

CMOS

BOTTOM

BALL

220

1.27 mm

unknown

256

S-PBGA-B256

COMMERCIAL

COMMERCIAL

In-System Reprogrammable™ (ISR™) CMOS

15 ns

1 DEDICATED INPUTS, 197 I/O

2.46 mm

EE PLD

MACROCELL

1

3V ~ 3.6V

15 ns

27 mm

27 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

256

LFQFP, QFP144,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.63SQ,20

3.3 V

30

3 V

70 °C

无

EPM7256AETC144-10

95.2 MHz

LFQFP

SQUARE

Intel Corporation

活跃

120

INTEL CORP

3.6 V

1.65

120

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e0

活跃

3A991

Tin/Lead (Sn85Pb15)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

not_compliant

EPM7256

S-PQFP-G144

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 120 I/O

1.6 mm

EE PLD

5000

MACROCELL

256

YES

3 V ~ 3.6 V

10.0ns

16

YES

20 mm

20 mm

N/A

-

表面贴装

44-LQFP

44-TQFP (10x10)

Infineon Technologies

有

37

Tape & Reel (TR)

32

CY37032

Obsolete

0°C ~ 70°C (TA)

Ultra37000™

In-System Reprogrammable™ (ISR™) CMOS

3V ~ 3.6V

8.5 ns

N/A

-

表面贴装

256-BGA

YES

256-FPBGA (17x17)

256

Lattice Semiconductor Corporation

208

Bulk

512

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.8 V

40

1.65 V

有

BGA

5.69

1.95 V

ROCHESTER ELECTRONICS INC

208

活跃

Rochester Electronics LLC

SQUARE

BGA

111 MHz

LC4512C-75FN256C

0°C ~ 90°C (TJ)

ispMACH® 4000

e1

有

锡银铜

CMOS

BOTTOM

BALL

250

1 mm

unknown

256

S-PBGA-B256

COMMERCIAL

系统内可编程

7.5 ns

4 DEDICATED INPUTS, 208 I/O

2.1 mm

EE PLD

MACROCELL

4

1.65V ~ 1.95V

7.5 ns

32

17 mm

17 mm