N/A

-

表面贴装

表面贴装

44-TQFP

44

44-TQFP (10x10)

36

32

Compliant

EEPROM

0°C ~ 70°C (TA)

Tray

MAX® 7000S

Obsolete

SMD/SMT

70 °C

0 °C

5 V

250 MHz

EPM7032

系统内可编程

5 ns

5 ns

2

600

2

4.75 V ~ 5.25 V

5.25 V

4.75 V

5.0ns

2

无SVHC

N/A

-

表面贴装

20-UFQFN

20-STQFN (2x3)

Renesas Design Germany GmbH

SLG46531

不用于新设计

+ 85 C

- 40 C

SMD/SMT

2 MHz

17

Tape & Reel (TR)

17

-40°C ~ 85°C (TA)

-

1.8 V, 3.3 V, 5 V

OTP

1.71V ~ 1.89V, 3V ~ 3.6V, 4.5V ~ 5.5V

N/A

-

表面贴装

表面贴装

256-BGA

256

256-FBGA (17x17)

Altera

EPM7512

活跃

212

512

Compliant

EEPROM

Bulk

0°C ~ 70°C (TA)

Tray

MAX® 7000B

Obsolete

70 °C

0 °C

3.3 V

166.67 MHz

EPM7512

系统内可编程

7.5 ns

32

10000

163.9 MHz

212

32

2.375 V ~ 2.625 V

3.6 V

3 V

7.5ns

32

无铅

N/A

-

表面贴装

表面贴装

64-TFBGA

64

64-MBGA (4.5x4.5)

25 µA

TE Connectivity Deutsch 连接器

DIV44E21

活跃

Bag

30

64

Compliant

FLASH

-40°C ~ 100°C (TJ)

Tray

*

活跃

100 °C

-40 °C

1.8 V

1.4749 GHz

5M80Z

系统内可编程

1 kB

14 ns

25 µA

80

152 MHz

30

8

5

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

80

1.05 mm

4.5 mm

4.5 mm

无

N/A

-

表面贴装

256-BGA

256-FPBGA (17x17)

14 mA

Lattice Semiconductor Corporation

活跃

512

44

Non-Compliant

EEPROM

Bulk

-40°C ~ 105°C (TJ)

ispMACH® 4000

105 °C

-40 °C

系统内可编程

14 mA

322 MHz

44

32

2.3V ~ 2.7V

2.7 V

2.3 V

10 ns

32

N/A

-

表面贴装

表面贴装

68-TFBGA

YES

68

68-MBGA (5x5)

68

25 µA

CPLD MAXu00c2u00ae V Family 64 Macro Cells 118.3MHz 1.8V 68-Pin Micro FBGA Tray

INTEL CORP

1.89 V

1.53

52

64

FLASH

Compliant

TFBGA, BGA68,9X9,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA68,9X9,20

1.8 V

40

1.71 V

85 °C

有

5M80ZM68C5N

118.3 MHz

TFBGA

SQUARE

Intel Corporation

活跃

52

0°C ~ 85°C (TJ)

Tray

MAX® V

e1

活跃

EAR99

锡银铜

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

0.5 mm

compliant

1.4749 GHz

5M80Z

S-PBGA-B68

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

14 ns

25 µA

52 I/O

1.2 mm

闪存 PLD

80

152 MHz

52

8

5

MACROCELL

64

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

80

YES

5 mm

5 mm

无

无铅

N/A

-

表面贴装

表面贴装

100-TQFP

YES

100

100-TQFP (14x14)

100

SQUARE

Intel Corporation

Obsolete

68

INTEL CORP

2.625 V

7.66

8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

64

68

Compliant

EEPROM

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

40

2.375 V

70 °C

有

EPM7064BTC100-5N

303 MHz

LFQFP

0°C ~ 70°C (TA)

Tray

MAX® 7000B

e3

Obsolete

EAR99

Matte Tin (Sn)

70 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

250 MHz

EPM7064

S-PQFP-G100

不合格

1.8/3.3,2.5 V

COMMERCIAL

系统内可编程

5 ns

5 ns

0 DEDICATED INPUTS, 68 I/O

1.27 mm

EE PLD

4

1250

303 MHz

68

4

5

MACROCELL

64

YES

2.375 V ~ 2.625 V

3.6 V

3 V

5.0ns

4

YES

14 mm

14 mm

无铅

N/A

-

表面贴装

表面贴装

100-TQFP

YES

100

100-TQFP (14x14)

100

Obsolete

84

INTEL CORP

2.625 V

5.05

84

128

Compliant

EEPROM

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

30

2.375 V

70 °C

无

EPM7128BTC100-4

243.9 MHz

LFQFP

SQUARE

Intel Corporation

0°C ~ 70°C (TA)

Tray

MAX® 7000B

e0

Obsolete

3A991

Tin/Lead (Sn/Pb)

70 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.5 mm

compliant

333.33 MHz

EPM7128

S-PQFP-G100

不合格

1.8/3.3,2.5 V

COMMERCIAL

系统内可编程

4 ns

4 ns

0 DEDICATED INPUTS, 84 I/O

1.27 mm

EE PLD

8

2500

243.9 MHz

84

8

4

MACROCELL

128

YES

2.375 V ~ 2.625 V

3.6 V

3 V

4.0ns

8

YES

14 mm

14 mm

含铅

N/A

-

表面贴装

20-UFQFN

20-STQFN (2x3)

Renesas Design Germany GmbH

Tape & Reel (TR)

9

活跃

MSL 1 - Unlimited

500 ns, 2000 ns

+ 85 C

- 40 C

SMD/SMT

2 MHz

17

-40°C ~ 85°C (TA)

-

1.8 V, 3.3 V, 5 V

OTP

2

1.71V ~ 1.89V, 3V ~ 3.6V, 4.5V ~ 5.5V

N/A

-

表面贴装

表面贴装

324-LBGA

324

324-FBGA (19x19)

2 mA

271

980

Compliant

FLASH

-40°C ~ 100°C (TJ)

Tray

MAX® V

活跃

100 °C

-40 °C

1.8 V

5M1270

系统内可编程

1 kB

2 mA

1270

304 MHz

271

1270

1.71 V ~ 1.89 V

1.89 V

1.71 V

6.2ns

1270

N/A

-

表面贴装

28

Compliant

EEPROM

10

10

70 °C

0 °C

5 V

142 MHz

7.5 ns

750

142 MHz

10

5.25 V

4.75 V

含铅

N/A

-

表面贴装

表面贴装

256-LBGA

YES

256

256-FBGA (17x17)

256

INTEL CORP

1.89 V

0.99

211

980

Compliant

FLASH

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

PLASTIC/EPOXY

BGA256,16X16,40

1.8 V

40

1.71 V

85 °C

有

5M1270ZF256C5N

201.1 MHz

LBGA

SQUARE

Intel Corporation

活跃

211

0°C ~ 85°C (TJ)

Tray

MAX® V

e1

活跃

3A991

锡银铜

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

1 mm

compliant

118.3 MHz

5M1270

S-PBGA-B256

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

6.2 ns

2 mA

211 I/O

1.55 mm

闪存 PLD

1270

304 MHz

1270

MACROCELL

980

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

6.2ns

1270

YES

1.25 mm

17 mm

17 mm

无

无SVHC

N/A

-

表面贴装

Surface Mount, MLCC

0402 (1005 Metric)

240

Vishay Vitramon

Non-Compliant

Tape & Reel (TR)

VJ0402

活跃

100V

EEPROM

-55°C ~ 125°C

VJ HIFREQ

0.040 L x 0.020 W (1.02mm x 0.51mm)

±0.5pF

Obsolete

C0G, NP0

70 °C

0 °C

RF, Microwave, High Frequency

1.7 pF

5 V

-

-

15 ns

35

5.25 V

4.75 V

High Q, Low Loss

-

0.024 (0.61mm)

-

N/A

-

表面贴装

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

84

KEMET

125 MHz

QCCJ

SQUARE

Altera Corporation

Transferred

64

ALTERA CORP

5.25 V

4.21

LCC

Bulk

Obsolete

64

160

Compliant

EEPROM

PLASTIC, LCC-84

CHIP CARRIER

2

PLASTIC/EPOXY

LDCC84,1.2SQ

5 V

30

4.75 V

70 °C

无

EPM7160ELC84-10

0°C ~ 70°C (TA)

Tube

-

e0

无

Obsolete

Tin/Lead (Sn/Pb)

70 °C

0 °C

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

5 V

QUAD

J BEND

220

1.27 mm

unknown

125 MHz

EPM7160

84

S-PQCC-J84

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

10 ns

10 ns

0 DEDICATED INPUTS, 64 I/O

5.08 mm

EE PLD

10

3200

100 MHz

64

10

10

MACROCELL

160

NO

4.75 V ~ 5.25 V

5.25 V

4.75 V

10.0ns

10

NO

29.3116 mm

29.3116 mm

无

含铅

N/A

-

表面贴装

表面贴装

100-TQFP

YES

100

100-TQFP (14x14)

100

25 µA

1.71 V

未说明

1.8 V

-40 °C

TQFP100,.63SQ

PLASTIC/EPOXY

FLATPACK, THIN PROFILE, FINE PITCH

TFQFP, TQFP100,.63SQ

192

79

8542390000

Compliant

FLASH

0.97

1.89 V

INTEL CORP

CPLD - Complex Programmable Logic Devices CPLD - MAX V 192 Macro 79 IOs

79

活跃

Intel Corporation

SQUARE

TFQFP

118.3 MHz

5M240ZT100I5N

有

100 °C

-40°C ~ 100°C (TJ)

Tray

MAX® V

e3

活跃

EAR99

哑光锡

100 °C

-40 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

QUAD

鸥翼

未说明

0.5 mm

compliant

1.4749 GHz

5M240Z

S-PQFP-G100

不合格

1.8,1.2/3.3 V

INDUSTRIAL

系统内可编程

1 kB

14 ns

25 µA

79 I/O

1.2 mm

闪存 PLD

240

152 MHz

79

8

5

MACROCELL

192

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

240

YES

14 mm

14 mm

无

N/A

-

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

Altera Corporation

Transferred

164

ALTERA CORP

3.6 V

7.69

QFP

164

256

Compliant

EEPROM

PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

3 V

70 °C

有

EPM7256AEQC208-5N

172.4 MHz

FQFP

SQUARE

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e3

有

Obsolete

3A991

Matte Tin (Sn) - annealed

70 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

245

0.5 mm

unknown

250 MHz

EPM7256

208

S-PQFP-G208

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

5.5 ns

5.5 ns

0 DEDICATED INPUTS, 164 I/O

4.1 mm

EE PLD

16

5000

172.4 MHz

164

16

5

MACROCELL

256

YES

3 V ~ 3.6 V

3.6 V

3 V

5.5ns

16

YES

28 mm

28 mm

无铅

N/A

-

表面贴装

表面贴装

256-LBGA

YES

256

256-FBGA (17x17)

256

2 mA

活跃

203

Altera 5M2210ZF256C5N, CPLD MAX V Flash 1700 Cells, 203 I/O, 2210 Labs, 7ns, ISP, 256-Pin FBGA

INTEL CORP

1.89 V

1.6

203

1700

8542390000

Compliant

FLASH

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

PLASTIC/EPOXY

BGA256,16X16,40

1.8 V

40

1.71 V

85 °C

有

5M2210ZF256C5N

201.1 MHz

LBGA

SQUARE

Intel Corporation

0°C ~ 85°C (TJ)

Tray

MAX® V

e1

活跃

3A991

锡银铜

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

1 mm

compliant

118.3 MHz

5M2210Z

S-PBGA-B256

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

7 ns

2 mA

203 I/O

1.55 mm

闪存 PLD

2210

304 MHz

203

2210

MACROCELL

1700

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.0ns

2210

YES

1.25 mm

17 mm

17 mm

无SVHC

N/A

-

表面贴装

表面贴装

256-LBGA

YES

256

256-FBGA (17x17)

256

27 µA

GRID ARRAY, LOW PROFILE

LBGA, BGA256,16X16,40

159

440

Compliant

FLASH

INTEL CORP

1.89 V

1.59

159

活跃

Intel Corporation

SQUARE

LBGA

184.1 MHz

5M570ZF256C4N

有

85 °C

1.71 V

40

1.8 V

BGA256,16X16,40

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

MAX® V

e1

活跃

EAR99

锡银铜

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

1 mm

compliant

5M570Z

S-PBGA-B256

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

9.5 ns

27 µA

159 I/O

1.55 mm

闪存 PLD

570

152 MHz

159

8

4

MACROCELL

440

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

9.0ns

570

YES

17 mm

17 mm

无

N/A

-

表面贴装

表面贴装

100-TQFP

YES

100

100-TQFP (14x14)

100

25 µA

Compliant

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

1.8 V

未说明

1.71 V

85 °C

有

5M240ZT100C4N

184.1 MHz

TFQFP

SQUARE

Intel Corporation

活跃

79

INTEL CORP

1.89 V

1.58

79

192

MAX V

16 x 16mm

1.71 V

TQFP

+85 °C

0 °C

240

1.89 V

Flash

有

0°C ~ 85°C (TJ)

Tray

MAX® V

e3

活跃

EAR99

Matte Tin (Sn) - annealed

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

QUAD

鸥翼

未说明

0.5 mm

compliant

5M240Z

100

S-PQFP-G100

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

7.9ns

25 µA

79 I/O

1.2 mm

闪存 PLD

240

152 MHz

79

240

4

MACROCELL

192

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

240

YES

16mm

16mm

N/A

-

表面贴装

表面贴装

84-LCC (J-Lead)

84

84-PLCC (29.31x29.31)

106 mA

60

320

Compliant

EEPROM

-40°C ~ 85°C (TA)

Tray

MAX® 9000

Obsolete

85 °C

-40 °C

5 V

EPM9320

系统内可编程

23 ns

23 ns

106 mA

20

6000

144 MHz

60

20

20

4.5 V ~ 5.5 V

5.5 V

4.5 V

20.0ns

20

无

N/A

-

表面贴装

表面贴装

256-LBGA

256

256-FBGA (17x17)

2 mA

203

1700

8542390000

Compliant

FLASH

0°C ~ 85°C (TJ)

Tray

MAX® V

活跃

85 °C

0 °C

1.8 V

2.3148 GHz

5M2210Z

系统内可编程

1 kB

9.1 ns

2 mA

2210

304 MHz

203

2210

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.0ns

2210

1.25 mm

17 mm

17 mm

无

N/A

-

表面贴装

20-TSSOP (0.173, 4.40mm Width)

20-TSSOP

Renesas Design Germany GmbH

19

124 ns

+ 85 C

- 40 C

SMD/SMT

25 MHz

活跃

13

Tape & Reel (TR)

-40°C ~ 85°C

-

1.8 V to 5 V

系统内可编程

1.71V ~ 5.5V, 2.3V ~ 5.5V

N/A

-

表面贴装

YES

68

68

25 µA

Compliant

FLASH

FBGA, BGA68,9X9,20

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA68,9X9,20

-40 °C

105 °C

有

5M240ZM68A5N

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

5.59

192

52

125 °C

-40 °C

YES

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

0.5 mm

compliant

1.4749 GHz

S-PBGA-B68

不合格

1.8,1.2/3.3 V

INDUSTRIAL

1 kB

17.7 ns

25 µA

闪存 PLD

240

152 MHz

52

24

192

YES

1.89 V

1.71 V

YES

N/A

-

表面贴装

表面贴装

256-LBGA

YES

256

256-FBGA (17x17)

256

2 mA

活跃

203

CPLD - Complex Programmable Logic Devices CPLD - MAX V 1700 Macro 203 IOs

INTEL CORP

1.89 V

1.81

203

1700

Compliant

FLASH

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.8 V

未说明

1.71 V

100 °C

无

5M2210ZF256I5

201.1 MHz

LBGA

SQUARE

Intel Corporation

-40°C ~ 100°C (TJ)

Tray

MAX® V

e0

活跃

3A991

锡铅

100 °C

-40 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

未说明

1 mm

compliant

5M2210Z

S-PBGA-B256

不合格

1.8,1.2/3.3 V

INDUSTRIAL

系统内可编程

1 kB

11.2 ns

2 mA

203 I/O

1.55 mm

闪存 PLD

2210

304 MHz

203

2210

MACROCELL

1700

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.0ns

2210

YES

17 mm

17 mm

N/A

-

表面贴装

表面贴装

100-TFBGA

100

100-MBGA (6x6)

40 mA

76

440

Compliant

FLASH

0°C ~ 85°C (TJ)

Tray

MAX® II

活跃

SMD/SMT

85 °C

0 °C

1.8 V

1.8797 GHz

EPM570

系统内可编程

1 kB

8.7 ns

8.7 ns

40 mA

570

304 MHz

76

57

5

1.71 V ~ 1.89 V

1.89 V

1.71 V

5.4ns

570

无

Unknown

无铅