类别是'category.FPGA 评估板' (3802)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 内存大小 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 筛选水平 | 速度等级 | 输出功能 | 宏细胞数 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 专用输入数量 | 等效门数 | 系统内可编程 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||
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![]() | XCV400E-6BGG560I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | BGA | BGA-560 | 5.79 | 357 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA560,33X33,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | Compliant | 1.71 V | XCV400E-6BGG560I | 有 | Obsolete | XILINX INC | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 100 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 560 | S-PBGA-B560 | 404 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | 20 kB | 404 | 2400 CLBS, 129600 GATES | 1.7 mm | 现场可编程门阵列 | 6 | 0.47 ns | 2400 | 10800 | 129600 | 42.5 mm | 42.5 mm | 无 | |||||||||||||||
![]() | XC4062XLA-08BGG432C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | LBGA, | 5.81 | 263 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 40 | 3 V | XC4062XLA-08BGG432C | 有 | Obsolete | XILINX INC | BGA | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 130000 GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 不合格 | OTHER | 2304 CLBS, 40000 GATES | 1.7 mm | 现场可编程门阵列 | 1 ns | 2304 | 40000 | 40 mm | 40 mm | ||||||||||||||||||||||||||
![]() | XC7VX415T-3FFG1158I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | XILINX INC | , | 5.77 | 4 | 30 | XC7VX415T-3FFG1158I | 有 | 活跃 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 245 | compliant | 现场可编程门阵列 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-7BGG352I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 352 | BGA-352 | 5.81 | 400 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.71 V | 1.8 V | 30 | XCV300E-7BGG352I | 有 | Obsolete | XILINX INC | BGA | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 352 | S-PBGA-B352 | 260 | 不合格 | 1.2/3.6,1.8 V | 260 | 1536 CLBS, 82944 GATES | 1.7 mm | 现场可编程门阵列 | 0.42 ns | 1536 | 6912 | 82944 | 35 mm | 35 mm | ||||||||||||||||||||||
![]() | XC2C128-4CP132C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 132 | BGA | 8 X 8 MM, 0.50 MM PITCH, CSP-132 | 5.73 | 3 | 100 | 70 °C | PLASTIC/EPOXY | TFBGA | BGA132,14X14,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.9 V | 1.8 V | 30 | 1.7 V | XC2C128-4CP132C | 无 | Obsolete | XILINX INC | e0 | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 0.5 mm | not_compliant | 132 | S-PBGA-B132 | 不合格 | 1.5/3.3,1.8 V | COMMERCIAL | 4.5 ns | 0 DEDICATED INPUTS, 100 I/O | 1.1 mm | 闪存 PLD | MACROCELL | 128 | YES | YES | 8 mm | 8 mm | ||||||||||||||||||||||
![]() | XC4VFX140-12FF1760C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | BGA | 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760 | 5.28 | 1181 MHz | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.14 V | XC4VFX140-12FF1760C | 无 | 活跃 | XILINX INC | e0 | 无 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1 mm | not_compliant | 1760 | S-PBGA-B1760 | 896 | 不合格 | 1.2,1.2/3.3,2.5 V | OTHER | 896 | 15792 CLBS | 3.5 mm | 现场可编程门阵列 | 15792 | 142128 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||
![]() | XCV400E-8BGG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | 416 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | XCV400E-8BGG432I | 有 | 1.8 V | 30 | 1.71 V | Obsolete | XILINX INC | BGA | LBGA, BGA432,31X31,50 | 5.8 | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | 316 | 2400 CLBS, 129600 GATES | 1.7 mm | 现场可编程门阵列 | 0.4 ns | 2400 | 10800 | 129600 | 40 mm | 40 mm | |||||||||||||||||||||||
![]() | XCR3064A-10PC44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | LCC | PLASTIC, LCC-44 | 5.68 | 83 MHz | 3 | 32 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 3.6 V | 3.3 V | 3 V | XCR3064A-10PC44C | 无 | Obsolete | XILINX INC | e0 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 44 | S-PQCC-J44 | 不合格 | 3.3 V | COMMERCIAL | 10 ns | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | MACROCELL | 64 | YES | 2 | YES | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||
![]() | XC5210-3PQG208C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FQFP, | 5.81 | 83 MHz | 3 | 85 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 5.25 V | 5 V | 30 | 4.75 V | XC5210-3PQG208C | 有 | Obsolete | XILINX INC | QFP | e3 | 有 | Matte Tin (Sn) | MAX AVAILABLE 16000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | OTHER | 324 CLBS, 10000 GATES | 4.1 mm | 现场可编程门阵列 | 3 ns | 324 | 10000 | 28 mm | 28 mm | |||||||||||||||||||||||||
![]() | XCV600E-6BGG560C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | BGA | BGA-560 | 5.8 | 357 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA560,33X33,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | XCV600E-6BGG560C | 有 | Obsolete | XILINX INC | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 560 | S-PBGA-B560 | 404 | 不合格 | 1.2/3.6,1.8 V | OTHER | 404 | 3456 CLBS, 186624 GATES | 1.7 mm | 现场可编程门阵列 | 0.47 ns | 3456 | 15552 | 186624 | 42.5 mm | 42.5 mm | ||||||||||||||||||||
![]() | XCV300E-8FGG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA | BGA, BGA256,16X16,40 | 5.8 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV300E-8FGG256C | 有 | Obsolete | XILINX INC | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | 176 | 不合格 | 1.2/3.6,1.8 V | OTHER | 176 | 1536 CLBS, 82944 GATES | 2 mm | 现场可编程门阵列 | 0.4 ns | 1536 | 6912 | 82944 | 17 mm | 17 mm | ||||||||||||||||||||
![]() | XC7336Q-12PC44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | XILINX INC | LCC | PLASTIC, LCC-44 | 5.91 | 80 MHz | 3 | 32 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | Non-Compliant | 4.75 V | XC7336Q-12PC44C | 无 | Obsolete | e0 | EAR99 | Tin/Lead (Sn85Pb15) | 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 36 FLIP-FLOPS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 44 | S-PQCC-J44 | 不合格 | 3.3/5,5 V | COMMERCIAL | 19 ns | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | OT PLD | MACROCELL | 36 | NO | 2 | NO | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||
![]() | XC7336Q-15WC44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | XILINX INC | LCC | WQCCJ, LDCC44,.7SQ | 5.91 | 66.7 MHz | 1 | 32 | 70 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | 5.25 V | 5 V | 未说明 | 4.75 V | XC7336Q-15WC44C | 无 | Obsolete | EAR99 | 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 36 FLIP-FLOPS | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | 44 | S-CQCC-J44 | 不合格 | 3.3/5,5 V | COMMERCIAL | 23 ns | 2 DEDICATED INPUTS, 32 I/O | 4.826 mm | UV PLD | MACROCELL | 36 | NO | 2 | NO | 16.51 mm | 16.51 mm | |||||||||||||||||||||
![]() | XCVU160-1FLGB2104C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 2104 | BGA | SQUARE | 网格排列 | 0.979 V | 0.95 V | 未说明 | 0.922 V | XCVU160-1FLGB2104C | 有 | 活跃 | XILINX INC | 47.50 X 47.50 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-2104 | 5.77 | 85 °C | PLASTIC/EPOXY | e1 | 3A001.A.7.A | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | not_compliant | S-PBGA-B2104 | OTHER | 1560 CLBS | 现场可编程门阵列 | 1560 | |||||||||||||||||||||||||||||||||||||
![]() | XC4020XLA-07BGG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA, | 5.81 | 294 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.6 V | 3.3 V | 30 | 3 V | XC4020XLA-07BGG256C | 有 | Obsolete | XILINX INC | BGA | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 40000 GATES | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.27 mm | compliant | 256 | S-PBGA-B256 | 不合格 | OTHER | 784 CLBS, 13000 GATES | 2.55 mm | 现场可编程门阵列 | 0.9 ns | 784 | 13000 | 27 mm | 27 mm | ||||||||||||||||||||||||||
![]() | XC3195A-2PQ160C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 160 | QFP | QFP, QFP160,1.2SQ | 5.8 | 323 MHz | 3 | 85 °C | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | 5.25 V | 5 V | 30 | 4.75 V | XC3195A-2PQ160C | 无 | Obsolete | XILINX INC | e0 | 无 | Tin/Lead (Sn85Pb15) | MAX USABLE 7500 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.65 mm | not_compliant | 160 | S-PQFP-G160 | 138 | 不合格 | 5 V | OTHER | 138 | 484 CLBS, 6500 GATES | 4.1 mm | 现场可编程门阵列 | 2.2 ns | 484 | 484 | 6500 | 28 mm | 28 mm | ||||||||||||||||||||
![]() | XC3190A-4TQ144C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | QFP | PLASTIC, TQFP-144 | 5.8 | 227 MHz | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 5.25 V | 5 V | 30 | 4.75 V | XC3190A-4TQ144C | 无 | Obsolete | XILINX INC | e0 | 无 | Tin/Lead (Sn85Pb15) | MAX USABLE 6000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | not_compliant | 144 | S-PQFP-G144 | 122 | 不合格 | 5 V | OTHER | 122 | 320 CLBS, 5000 GATES | 1.6 mm | 现场可编程门阵列 | 3.3 ns | 320 | 320 | 5000 | 20 mm | 20 mm | ||||||||||||||||||||
![]() | XC2018-100PC68C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | LCC | QCCJ, LDCC68,1.0SQ | 5.8 | 100 MHz | 1 | 85 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | 未说明 | 4.75 V | XC2018-100PC68C | 无 | Obsolete | XILINX INC | e0 | 锡铅 | 174 FLIP-FLOPS; TYP. GATES = 1000-1500 | QUAD | J BEND | 225 | 1.27 mm | unknown | 68 | S-PQCC-J68 | 58 | 不合格 | 5 V | OTHER | 58 | 100 CLBS, 1000 GATES | 4.445 mm | 现场可编程门阵列 | 7.5 ns | 100 | 100 | 1000 | 24.2316 mm | 24.2316 mm | ||||||||||||||||||||||
![]() | XC4062XLA-09BGG560C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | LBGA, | 5.81 | 227 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 40 | 3 V | XC4062XLA-09BGG560C | 有 | Obsolete | XILINX INC | BGA | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 130000 GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 不合格 | OTHER | 2304 CLBS, 40000 GATES | 1.7 mm | 现场可编程门阵列 | 1.1 ns | 2304 | 40000 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||
![]() | XC4044XLA-08HQG304C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 304 | 263 MHz | 85 °C | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 3 V | XC4044XLA-08HQG304C | 有 | Obsolete | XILINX INC | QFP | HFQFP, | 5.81 | CAN ALSO USE 80000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 304 | S-PQFP-G304 | 不合格 | OTHER | 1600 CLBS, 27000 GATES | 4.5 mm | 现场可编程门阵列 | 1 ns | 1600 | 27000 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||
![]() | XC4010E-4PG191B | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 191 | PGA | CERAMIC, PGA-191 | 5.79 | 111 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA191M,18X18 | SQUARE | 网格排列 | 5.5 V | 5 V | 4.5 V | Military grade | XC4010E-4PG191B | 有 | Obsolete | XILINX INC | e3 | 3A001.A.2.C | 哑光锡 | TYP. GATES = 7000-20000 | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | compliant | 191 | S-CPGA-P191 | 160 | 不合格 | 5 V | MILITARY | 160 | 400 CLBS, 7000 GATES | 4.318 mm | 现场可编程门阵列 | MIL-STD-883 Class B | 2.7 ns | 400 | 400 | 7000 | 47.244 mm | 47.244 mm | ||||||||||||||||||||
![]() | XCV1600E-8FG900I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | FBGA-900 | 5.84 | 416 MHz | 3 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV1600E-8FG900I | 无 | Obsolete | XILINX INC | BGA | e0 | 无 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | not_compliant | 900 | S-PBGA-B900 | 700 | 不合格 | 1.2/3.6,1.8 V | 700 | 7776 CLBS, 419904 GATES | 2.6 mm | 现场可编程门阵列 | 0.4 ns | 7776 | 34992 | 419904 | 31 mm | 31 mm | |||||||||||||||||||||||
![]() | XC4085XLA-09HQG240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | HFQFP | PLASTIC/EPOXY | 85 °C | 3 | 227 MHz | 5.81 | HFQFP, | QFP | XILINX INC | Obsolete | 有 | XC4085XLA-09HQG240C | 3 V | 30 | 3.3 V | 3.6 V | FLATPACK, HEAT SINK/SLUG, FINE PITCH | SQUARE | e3 | 有 | 哑光锡 | CAN ALSO USE 180000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 不合格 | OTHER | 3136 CLBS, 55000 GATES | 4.1 mm | 现场可编程门阵列 | 1.1 ns | 3136 | 55000 | 32 mm | 32 mm | |||||||||||||||||||||||||
![]() | XC7VX415T-3FF1158E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1156 | XC7VX415T-3FF1158E | BGA, BGA1156,34X34,40 | 5.85 | 1818 MHz | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | XILINX INC | 活跃 | 无 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1156 | 350 | 不合格 | 1,1.8 V | 350 | 现场可编程门阵列 | 412160 | ||||||||||||||||||||||||||||||||||||||||||
![]() | XC3130A-2PC44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | SQUARE | CHIP CARRIER | 5.25 V | 5 V | 4.75 V | XC3130A-2PC44C | 接触制造商 | ROCHESTER ELECTRONICS LLC | QCCJ, | 5.78 | 323 MHz | 85 °C | PLASTIC/EPOXY | QCCJ | MAX USABLE 2000 LOGIC GATES | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J44 | OTHER | 100 CLBS, 1500 GATES | 4.572 mm | 现场可编程门阵列 | 2.2 ns | 100 | 1500 | 16.5862 mm | 16.5862 mm |
XCV400E-6BGG560I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4062XLA-08BGG432C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC7VX415T-3FFG1158I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-7BGG352I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC2C128-4CP132C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4VFX140-12FF1760C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV400E-8BGG432I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCR3064A-10PC44C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC5210-3PQG208C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV600E-6BGG560C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-8FGG256C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC7336Q-12PC44C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC7336Q-15WC44C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCVU160-1FLGB2104C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4020XLA-07BGG256C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3195A-2PQ160C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3190A-4TQ144C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC2018-100PC68C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4062XLA-09BGG560C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4044XLA-08HQG304C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4010E-4PG191B
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV1600E-8FG900I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4085XLA-09HQG240C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC7VX415T-3FF1158E
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3130A-2PC44C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
