类别是'category.应用特定微控制器' (5057)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 主时钟/晶体频率-名 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 输出时钟频率-最大值 | 串行I/O数 | 总线兼容性 | 最大数据传输率 | 通信协议 | 数据编码/解码方式 | 显示配置 | 库存数量 | 长度 | 宽度 | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | TDA8005AH/C129 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-2SBVA484E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | BGA-484 | 4 | 100 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||||||
![]() | TA100T-Y240C2X01-00T-V43 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-2LFBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | 110 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-900 | 4 | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||||||
![]() | PCM16C010VJG | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 70 °C | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 5.25 V | 4.75 V | 5 V | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | LFQFP, QFP100,.63SQ,20 | e0 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | COMMERCIAL | 微处理器电路 | 6.5 mA | 1.6 mm | 14 mm | 14 mm | ||||||||||||||||||||||||
![]() | NRF9161-LACA-R | Nordic Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M-L-ET1310I-DT | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | 活跃 | BROADCOM LTD | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-L1SBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | ADVANCED MICRO DEVICES INC | BGA-484 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.742 V | 0.698 V | 0.72 V | 有 | 活跃 | e1 | 锡银铜 | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||||
![]() | XCZU9CG-L1SBVA484I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | FBGA, BGA484,22X22,32 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.742 V | 0.698 V | 0.72 V | 有 | Transferred | XILINX INC | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||||||||
![]() | IM6102IJL | General Electric Solid State | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | 85 °C | DIP, DIP40,.6 | GENERAL ELECTRIC SOLID STATE | Obsolete | 无 | IN-LINE | RECTANGULAR | DIP40,.6 | DIP | CERAMIC | -40 °C | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | 不合格 | INDUSTRIAL | |||||||||||||||||||||||||||||||
![]() | KS152JB3 | K-micro | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | Obsolete | KAWASAKI MICROELECTRONICS INC | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KS152JB3 | MegaChips Technology America Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | Obsolete | MEGACHIPS CORP | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-2LFFVC900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | 110 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-900 | 4 | e1 | 锡银铜 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||||||||
![]() | PI7C8150MA-33 | Pericom Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | PERICOM SEMICONDUCTOR CORP | QFP | QFP, | 33 MHz | 3 | 85 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 3.6 V | 3 V | 3.3 V | 无 | Obsolete | e0 | EAR99 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 1 mm | compliant | 208 | S-PQFP-G208 | 不合格 | OTHER | BUS CONTROLLER, PCI | 1.76 mm | 32 | 32 | 17 mm | 17 mm | |||||||||||||||||||
![]() | ICS90C64N | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | 70 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | 无 | Obsolete | INTEGRATED CIRCUIT SYSTEMS INC | DIP, DIP20,.3 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T20 | 不合格 | COMMERCIAL | CLOCK GENERATOR, VIDEO | 30 mA | 14.318 MHz | 75 MHz | ||||||||||||||||||||||||
![]() | ADM6995L | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | RECTANGULAR | FLATPACK, FINE PITCH | 1.9 V | 1.7 V | 1.8 V | 接触制造商 | INTEL CORP | PLASTIC, QFP-128 | 25 MHz | PLASTIC/EPOXY | FQFP | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | R-PQFP-G128 | 不合格 | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 3.4 mm | NO | NO | 5 | 12.5 MBps | SYNC, BYTE; ETHERNET | NRZ; NRZI; BIPH-LEVEL (MANCHESTER) | 20 mm | 14 mm | |||||||||||||||||||||||
![]() | ADM6995L | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | PLASTIC/EPOXY | FQFP | RECTANGULAR | FLATPACK, FINE PITCH | 1.9 V | 1.7 V | 1.8 V | Transferred | INFINEON TECHNOLOGIES AG | QFP | PLASTIC, QFP-128 | 25 MHz | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 128 | R-PQFP-G128 | 不合格 | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 3.4 mm | NO | NO | 5 | 12.5 MBps | NRZ; NRZI; BIPH-LEVEL(MANCHESTER) | 20 mm | 14 mm | ||||||||||||||||||||||
![]() | TMPZ84C40AP | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | -40 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | 活跃 | TOSHIBA CORP | DIP, DIP40,.6 | 85 °C | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | 不合格 | INDUSTRIAL | ||||||||||||||||||||||||||||||
![]() | ICS9FG108CFLF | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 0.300 INCH, ROHS COMPLIANT, MO-118, SSOP-48 | 70 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.465 V | 3.135 V | 3.3 V | 有 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | SSOP | e3 | EAR99 | 哑光锡 | 8542.39.00.01 | DUAL | 鸥翼 | 0.635 mm | compliant | 48 | R-PDSO-G48 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.8 mm | 25 MHz | 400 MHz | 15.875 mm | 7.5 mm | |||||||||||||||||||||
![]() | HD63485PS48 | Hitachi Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 64 | DIP | SDIP, SDIP64,.75 | 70 °C | PLASTIC/EPOXY | SDIP | SDIP64,.75 | RECTANGULAR | IN-LINE, SHRINK PITCH | 5.25 V | 4.75 V | 5 V | 无 | Obsolete | HITACHI LTD | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 1.778 mm | unknown | 64 | R-PDIP-T64 | 不合格 | COMMERCIAL | MEMORY CONTROLLER, DRAM | 160 mA | 5.08 mm | 19 | NO | NO | 1 | 57.6 mm | 19.05 mm | ||||||||||||||||||
![]() | PSD108/12 | POWER SEMICONDUCTORS INC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PCI9030-AA60 | PLX Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TN82050SZ201 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 5 V | 无 | Obsolete | INTEL CORP | QCCJ, LDCC32,.5X.6 | 85 °C | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J32 | 不合格 | INDUSTRIAL | ||||||||||||||||||||||||||||||
![]() | M35012-001SP | Mitsubishi Electric | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | 70 °C | -20 °C | PLASTIC/EPOXY | SDIP | RECTANGULAR | IN-LINE, SHRINK PITCH | 5.5 V | 4.5 V | 5 V | Transferred | MITSUBISHI ELECTRIC CORP | DIP | SDIP, | 8542.31.00.01 | DUAL | THROUGH-HOLE | 1.778 mm | unknown | 20 | R-PDIP-T20 | 不合格 | COMMERCIAL | DISPLAY CONTROLLER, CRT CHARACTER DISPLAY | 20 mA | 4.5 mm | 1 | 24 X 10 CHARACTERS | 19 mm | 7.62 mm | |||||||||||||||||||||||
![]() | SED1561TOB | Epson Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 85 °C | -30 °C | 5.5 V | 4.5 V | 5 V | Obsolete | S-MOS SYSTEMS | DIE | , | 0.022 MHz | 8542.31.00.01 | unknown | 不合格 | OTHER | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | 1 | 8 | 80 FAMILY; 68 FAMILY | 33 X 134 DOTS |
TDA8005AH/C129
Philips Semiconductors
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-2SBVA484E
AMD
分类:Embedded - Microcontrollers - Application Specific
TA100T-Y240C2X01-00T-V43
Microchip Technology Inc
分类:Embedded - Microcontrollers - Application Specific
XCZU7EG-2LFBVB900E
AMD
分类:Embedded - Microcontrollers - Application Specific
PCM16C010VJG
National Semiconductor Corporation
分类:Embedded - Microcontrollers - Application Specific
NRF9161-LACA-R
Nordic Semiconductor
分类:Embedded - Microcontrollers - Application Specific
M-L-ET1310I-DT
Broadcom Limited
分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-L1SBVA484I
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-L1SBVA484I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
IM6102IJL
General Electric Solid State
分类:Embedded - Microcontrollers - Application Specific
KS152JB3
K-micro
分类:Embedded - Microcontrollers - Application Specific
KS152JB3
MegaChips Technology America Corporation
分类:Embedded - Microcontrollers - Application Specific
XCZU6EG-2LFFVC900E
AMD
分类:Embedded - Microcontrollers - Application Specific
PI7C8150MA-33
Pericom Semiconductor Corporation
分类:Embedded - Microcontrollers - Application Specific
ICS90C64N
Integrated Device Technology Inc
分类:Embedded - Microcontrollers - Application Specific
ADM6995L
Intel Corporation
分类:Embedded - Microcontrollers - Application Specific
ADM6995L
Infineon Technologies AG
分类:Embedded - Microcontrollers - Application Specific
TMPZ84C40AP
Toshiba America Electronic Components
分类:Embedded - Microcontrollers - Application Specific
ICS9FG108CFLF
Integrated Device Technology Inc
分类:Embedded - Microcontrollers - Application Specific
HD63485PS48
Hitachi Ltd
分类:Embedded - Microcontrollers - Application Specific
PSD108/12
POWER SEMICONDUCTORS INC
分类:Embedded - Microcontrollers - Application Specific
PCI9030-AA60
PLX Technology
分类:Embedded - Microcontrollers - Application Specific
TN82050SZ201
Intel Corporation
分类:Embedded - Microcontrollers - Application Specific
M35012-001SP
Mitsubishi Electric
分类:Embedded - Microcontrollers - Application Specific
SED1561TOB
Epson Electronics America Inc
分类:Embedded - Microcontrollers - Application Specific
