N/A

-

表面贴装

783-BBGA, FCBGA

783-FCPBGA (29x29)

飞思卡尔半导体

Bulk

MPC85

活跃

0°C ~ 105°C (TA)

MPC85xx

1.333GHz

PowerPC e500

1.8V, 2.5V, 3.3V

10/100/1000Mbps (4)

1 Core, 32-Bit

无

DDR, DDR2, SDRAM

-

DUART, I²C, PCI, RapidIO

Signal Processing; SPE

-

-

-

N/A

-

表面贴装

689-BBGA Exposed Pad

689-TEPBGA II (31x31)

飞思卡尔半导体

活跃

Bulk

-40°C ~ 105°C (TA)

QorIQ P1

800MHz

PowerPC e500v2

2.5V, 3.3V

10/100/1000Mbps (3)

2 Core, 32-Bit

无

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I²C, MMC/SD, SPI

-

-

-

-

N/A

-

FCBGA-1296

8 Port

+ 85 C

Revision 2.0, Revision 3.0

1 Configuration

Revision 2.0

1.6 GHz

有

12 W

DDR3L, LPDDR4

Details

Embedded

3 Display

1x4, 1x2, 1x1

Intel

2 Port

Intel

983201

阿波罗湖

4 Channel

SMD/SMT

1

- 40 C

1.624366 oz

2 MB

-40 to 85 °C

Tray

Embedded Processors & Controllers

1296

LAN/UART/USB

8 GB

Intel Atom

64 Bit

CPU - Central Processing Units

4 Core

Embedded Processors

CPU - Central Processing Units

N/A

-

N/A

-

表面贴装

529-FBGA

529-FBGA (19x19)

飞思卡尔半导体

活跃

Bulk

-40°C ~ 125°C (TJ)

i.MX53

800MHz

ARM® Cortex®-A8

1.3V, 1.8V, 2.775V, 3.3V

10/100Mbps (1)

1 Core, 32-Bit

有

DDR2, DDR3, LPDDR2

USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)

1-Wire, AC97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 1.5Gbps (1)

N/A

-

表面贴装

516-BBGA Exposed Pad

516-TEPBGA (27x27)

飞思卡尔半导体

Obsolete

Tray

-40°C ~ 105°C (TA)

MPC83xx

267MHz

PowerPC e300c3

1.8V, 2.5V, 3.3V

10/100/1000Mbps (2)

1 Core, 32-Bit

无

DDR, DDR2

USB 2.0 + PHY (1)

DUART, HSSI, I²C, PCI, SPI

Security; SEC 2.2

Cryptography

-

-

N/A

-

表面贴装

360-BCBGA, FCCBGA

360-CBGA (25x25)

飞思卡尔半导体

Bulk

MPC75

活跃

0°C ~ 105°C (TA)

MPC7xx

350MHz

PowerPC

2.5V, 3.3V

-

1 Core, 32-Bit

无

-

-

-

-

-

-

-

N/A

-

表面贴装

64-QFP

64-QFP (14x14)

飞思卡尔半导体

1SNA199279R1700

Entrelec

Tray

Obsolete

-40°C ~ 85°C (TA)

M680x0

10MHz

EC000

5.0V

-

1 Core, 32-Bit

无

-

-

-

-

-

-

-

N/A

-

Broadcom Limited

017840814

Entrelec

Bulk

最后一次购买

-

N/A

-

16 Weeks

YES

1.25, 1.35 V

BGA,

网格排列

PLASTIC/EPOXY

GE217GIBJ23HM

BGA

SQUARE

AMD

活跃

ADVANCED MICRO DEVICES INC

5.63

8542.31.00.01

CMOS

BOTTOM

BALL

compliant

S-PBGA-B

1.25, 1.35 V

微处理器电路

N/A

-

表面贴装

783-BBGA, FCBGA

783-FCPBGA (29x29)

飞思卡尔半导体

VH1245FR+958BGA

Johnson Controls

Bulk

MPC85

活跃

-40°C ~ 105°C (TA)

MPC85xx

533MHz

PowerPC e500

2.5V, 3.3V

10/100/1000Mbps (2)

1 Core, 32-Bit

无

DDR, SDRAM

USB 2.0 (1)

DUART, I²C, PCI, SPI, TDM, UART

Communications; CPM, Security; SEC

Cryptography, Random Number Generator

-

-

N/A

-

LGA-16

Intel

Intel

Details

2.3 GHz

15 MB

1

SMD/SMT

99AHJ5

Tray

4310T

Embedded Processors & Controllers

CPU - Central Processing Units

CPU - Central Processing Units

N/A

-

225-LFBGA

225-FBGA (13x13)

Renesas Electronics America Inc

Renesas Electronics

Details

Tray

R9A07

活跃

119

Renesas Electronics

-40°C ~ 125°C (TJ)

Tray

RZ/T2M

Microprocessors - MPU

600MHz, 800MHz

ARM® Cortex®-R52

Microprocessors - MPU

1.8V, 3.3V

10/100/1000Mbps (2)

2 Core, 32-Bit

无

-

USB 2.0 (1)

CANbus, I²C, SCI, SPI, WDT

Multimedia; NEON™ SIMD

-

-

-

Microprocessors - MPU

N/A

-

N/A

-

LGA-16

Intel

Intel

Details

2.3 GHz

30 MB

1

SMD/SMT

99AHHT

Tray

4316

Embedded Processors & Controllers

CPU - Central Processing Units

CPU - Central Processing Units

N/A

-

LGA-16

Intel

Intel

Details

2.4 GHz

24 MB

1

SMD/SMT

99AHHZ

Tray

4314

Embedded Processors & Controllers

CPU - Central Processing Units

CPU - Central Processing Units

N/A

-

表面贴装

361-LFBGA

361-LFBGA (16x16)

STMicroelectronics

活跃

Bulk

-40°C ~ 150°C (TJ)

Automotive, AEC-Q100

600MHz

ARM® Cortex®-A7

3.3V

GBE (2)

2 Core, 32-Bit

无

DDR3L, LPDDR2, SRAM

USB 2.0 + PHY (2)

CAN, FlexRay, GPIO, I²C, I²S, MMC/SD/SDIO, SPI, SSP, UART

ARM® Cortex®-M3, Multimedia; NEON

AES, MD5, SHA-1/2, TRNG

-

-

N/A

-

Compliant

不含卤素

N/A

-

544-BBGA

544-PBGA (35x35)

Intel

BGA

Bulk

Obsolete

0°C ~ 70°C (TA)

Intel® IXP45x

544

400 MHz

1.3, 1.5, 2.5, 3.3 V

400MHz

Intel® IXP45x

2.5V, 3.3V

Mll (3), SMII (3)

1 Core, 32-Bit

无

DDR, SDRAM

USB 1.1 (1), USB 2.0 (1)

I²C, PCI, SPI, SSP, UART, UTOPIA 2

Communications; Network Processor Engine, Math Engine; Multiply Accumulate

3DES, AES, DES, MD5, RNG, SHA1

-

-

N/A

-

208-QFP

YES

208-PQFP

208

Intel

FLATPACK, FINE PITCH

PLASTIC/EPOXY

3.3 V

3.15 V

85 °C

FC80960HA33

40 MHz

FQFP

SQUARE

Rochester Electronics LLC

活跃

ROCHESTER ELECTRONICS INC

3.45 V

5.76

QFP

Non-Compliant

Bulk

活跃

FQFP,

0°C ~ 85°C (TC)

-

OPERATING CASE TEMPERATURE 0 TO 90

MOS

QUAD

鸥翼

0.5 mm

unknown

208

S-PQFP-G208

COMMERCIAL

OTHER

33MHz

MICROPROCESSOR, RISC

i960

32

3.75 mm

32

YES

NO

32

固定点

YES

3.3V

-

1 Core, 32-Bit

无

DRAM

-

-

-

-

-

-

28 mm

28 mm

N/A

-

208-QFP

YES

208-PQFP

208

Intel

40 MHz

FQFP

SQUARE

Rochester Electronics LLC

活跃

ROCHESTER ELECTRONICS INC

3.45 V

5.75

QFP

Bulk

活跃

FQFP,

FLATPACK, FINE PITCH

PLASTIC/EPOXY

3.3 V

3.15 V

FC80960HD80

0°C ~ 85°C (TC)

-

OPERATING CASE TEMPERATURE 0 TO 90

QUAD

鸥翼

0.5 mm

unknown

208

S-PQFP-G208

COMMERCIAL

80MHz

MICROPROCESSOR, RISC

i960

32

3.75 mm

32

YES

32

固定点

YES

3.3V

-

1 Core, 32-Bit

无

DRAM

-

-

-

-

-

-

28 mm

28 mm

N/A

-

This product may require additional documentation to export from the United States.

60

935441455557

NXP

恩智浦半导体

Details

Tray

Microprocessors - MPU

Microprocessors - MPU

Microprocessors - MPU

N/A

-

表面贴装

361-LFBGA

361-LFBGA (16x16)

STMicroelectronics

Details

Bulk

活跃

有

504

STMicroelectronics

STMicroelectronics

-40°C ~ 150°C (TJ)

Tray

Automotive, AEC-Q100

Microprocessors - MPU

600MHz

ARM® Cortex®-A7

Microprocessors - MPU

3.3V

GBE (2)

2 Core, 32-Bit

无

DDR3L, LPDDR2, SRAM

USB 2.0 + PHY (2)

CAN, FlexRay, GPIO, I²C, I²S, MMC/SD/SDIO, SPI, SSP, UART

ARM® Cortex®-M3, Multimedia; NEON

AES, MD5, SHA-1/2, TRNG

-

-

Microprocessors - MPU

N/A

-

AEC-Q100

This product may require additional documentation to export from the United States.

21

NXP

恩智浦半导体

Details

Tray

恩智浦半导体

N/A

-