N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

-40°C ~ 100°C (TJ)

Tray

AFS1500

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

SMD/SMT

135 MHz

有

微芯片技术

40

Actel

5.25 V

Tray

A42MX24

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX24-TQG176A

124 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Details

150 I/O

4.75 V

- 40 C

+ 125 C

-40°C ~ 125°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

125 °C

-40 °C

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

5 V

AUTOMOTIVE

5.25 V

4.75 V

2 ns

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

36000

135 MHz

STD

1410

2 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

SMD/SMT

116 MHz

有

微芯片技术

24

Actel

5.25 V

Tray

A42MX36

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX36-PQG208A

107 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

176 I/O

4.75 V

- 40 C

+ 125 C

-40°C ~ 125°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

125 °C

-40 °C

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

5 V

AUTOMOTIVE

5.25 V

4.75 V

320 B

2.3 ns

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

2560

54000

116 MHz

STD

1822

2.3 ns

2438

54000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

Actel

0.239083 oz

5.25 V

Tray

A42MX24

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-3PLG84

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

16

0°C ~ 70°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7A3P1000-FG256

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

177 I/O

0 to 70 °C

Tray

M7A3P1000

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

3 V

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

微芯片技术

90

Actel

5.5 V

Tray

A40MX02

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-1VQG80I

92 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

-40°C ~ 85°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

微芯片技术

60

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

M1AFS1500-2FG484

无

85 °C

30

N

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

20

无

AFS1500-FG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.83

This product may require additional documentation to export from the United States.

N

有

60

Fusion

223

Tray

AFS1500

活跃

BGA, BGA484,22X22,40

网格排列

-55°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

223

不合格

1.5,3.3 V

33.8 kB

223

现场可编程门阵列

276480

1.5e+06

38400

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

M2GL050

微芯片技术

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

有

M2GL050TS-FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

377

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

10 In Stock

-

8 Weeks

表面贴装

表面贴装

400-LFBGA

400

335

0°C~85°C TJ

Tray

2015

MachXO3

活跃

3 (168 Hours)

400

EAR99

ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

8542.39.00.01

2.375V~3.465V

BOTTOM

BALL

未说明

2.5V

0.8mm

未说明

11.5kB

现场可编程门阵列

4320

94208

540

540

1.7mm

17mm

17mm

ROHS3 Compliant

无铅

388 In Stock

-

8 Weeks

表面贴装

表面贴装

381-FBGA

203

0°C~85°C TJ

Tray

2016

ECP5

活跃

3 (168 Hours)

EAR99

8542.39.00.01

1.045V~1.155V

260

未说明

243kB

现场可编程门阵列

44000

1990656

11000

ROHS3 Compliant

224 In Stock

-

8 Weeks

表面贴装

1760-BBGA, FCBGA

YES

600

0°C~85°C TJ

Tray

Stratix® V GX

活跃

3 (168 Hours)

3A001.A.7.A

8542.39.00.01

0.87V~0.93V

BOTTOM

BALL

0.9V

1mm

5SGXEB6

S-PBGA-B1760

600

不合格

0.851.52.52.5/31.2/3V

600

22540 CLBS

现场可编程门阵列

597000

53248000

225400

3.4mm

42.5mm

42.5mm

符合RoHS标准

N/A

-

表面贴装

484-BBGA

YES

382

0°C~85°C TJ

Tray

APEX-20K®

e0

Obsolete

3 (168 Hours)

484

3A991

Tin/Lead (Sn/Pb)

8542.39.00.01

2.375V~2.625V

BOTTOM

BALL

220

2.5V

1mm

compliant

30

EP20K200

S-PBGA-B484

376

不合格

2.52.5/3.3V

3 ns

376

可加载 PLD

8320

106496

526000

832

MACROCELL

4

2.1mm

23mm

23mm

Non-RoHS Compliant

147 In Stock

-

8 Weeks

表面贴装

1760-BBGA, FCBGA

YES

600

-40°C~100°C TJ

Tray

Stratix® V GX

活跃

3 (168 Hours)

8542.39.00.01

0.82V~0.88V

BOTTOM

BALL

0.85V

1mm

5SGXEB5

S-PBGA-B1760

600

不合格

0.851.52.52.5/31.2/3V

600

18500 CLBS

现场可编程门阵列

490000

41984000

185000

3.4mm

42.5mm

42.5mm

符合RoHS标准

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS250-1FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

3000 LE

114 I/O

-40°C ~ 100°C (TJ)

Tray

AFS250

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.28205 GHz

1

6144

6144

250000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

无

A54SX72A-1FG256

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

0°C ~ 70°C (TA)

Tray

A54SX72A

e0

TIN LEAD/TIN LEAD SILVER

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

40

微芯片技术

Actel

5.5 V

Tray

A42MX24

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-3TQG176I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

150 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

-40°C ~ 85°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

微芯片技术

60

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M7AFS600-2FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

172 I/O

-40°C ~ 85°C (TA)

Tray

M7AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

Details

81 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

微芯片技术

90

Actel

0.023175 oz

2.75 V

Tray

A54SX08

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

有

A54SX08A-1TQG100I

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-40°C ~ 85°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

127

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

127

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

1.4 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

微芯片技术

Actel

Tray

A42MX24

活跃

5.25 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-3TQG176

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

150 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

40

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

-40°C ~ 100°C (TJ)

Tray

AFS1500

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.47059 GHz

2

38400

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

0°C ~ 70°C (TA)

Tray

AX1000

70 °C

0 °C

1.425V ~ 1.575V

763 MHz

1.5 V

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

12096

165888

1000000

763 MHz

18144

12096

1

12096

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

892.86 MHz

有

90

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AGL1000V5-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

0 to 70 °C

Tray

AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

1.26 V

209

微芯片技术

Tray

M2GL005

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL005S-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

OTHER

209

2.44 mm

现场可编程门阵列

6060

719872

6060

23 mm

23 mm

N/A

-

FCBGA-325

Details

27696 LE

180 I/O

1.14 V

1.26 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

0.740878 oz

Tray

M2GL025

1.2 V

667 Mb/s

2 Transceiver