N/A

-

Digi

1 GB

Bluetooth, Ethernet, I2C, PCIe, SPI, UART, USB, WiFi

- 40 C

+ 85 C

32 kB

LPDDR4

8 GB

eMMC

NXP i.MX8 Nano

50

Bulk

活跃

40 mm x 45 mm x 3.5 mm

NXP

i.MX 8M Nano

1 GB

-40°C ~ 85°C

ConnectCore® 8M

1.770 L x 1.570 W (45.00mm x 40.00mm)

USB

1.4 GHz

-

1 GB

600MHz, 1.4GHz

1GB

ARM® Cortex®-A53

Digi SMTplus

单片机核心

-

ARM® Cortex®-M7

N/A

-

Digi

eMMC

NXP i.MX8 Nano

50

有

LPDDR4

32 kB

+ 85 C

- 40 C

Ethernet, I2C, PCIe, SPI, UART, USB

512 MB

1 GB

i.MX 8M Nano

NXP

Bulk

活跃

45 mm x 40 mm x 3.5 mm

8 GB

-40°C ~ 85°C

ConnectCore® 8M

1.770 L x 1.570 W (45.00mm x 40.00mm)

USB

1.4 GHz

512 MB

600MHz, 1.4GHz

512MB

ARM® Cortex®-A53

Digi SMTplus

单片机核心

-

ARM® Cortex®-M7

N/A

-

Trenz Electronic GmbH

Xilinx

XC7Z030-1SBG485I

1 GB

1 GB

Ethernet, I2C, SPI, USB 2.0

- 40 C

+ 85 C

1

Bulk

Discontinued at Digi-Key

Details

-40°C ~ 85°C

TE0715

1.970 L x 1.570 W (50.00mm x 40.00mm)

萨姆泰克 LSHM

-

3.3 V

125MHz

1GB

ARM Cortex-A9

4 cm x 5 cm

MCU, FPGA

32MB

Zynq-7000 (Z-7030)

N/A

-

Trenz Electronic GmbH

Xilinx

XC7A100T-1FGG484I

1 GB

1 GB

Ethernet, JTAG

- 40 C

+ 85 C

1

Bulk

Discontinued at Digi-Key

Details

-40°C ~ 85°C

TE0712

1.970 L x 1.570 W (50.00mm x 40.00mm)

萨姆泰克 LSHM

-

2.4 V to 5.5 V

200MHz

1GB

Artix-7 A100T

4 cm x 5 cm

FPGA核心

32MB

-

N/A

-

Trenz Electronic GmbH

76 mm x 52 mm

Details

Xilinx

XC7Z030-1FBG676I

1 GB

1 GB

Ethernet, I2C, QSPI, USB 2.0

- 40 C

+ 85 C

1

Bulk

活跃

-40°C ~ 85°C

TE0745

2.050 L x 2.990 W (52.00mm x 76.00mm)

Board-to-Board (BTB) Socket - 160

-

12 V

-

1GB

ARM Cortex-A9

5.2 cm x 7.6 cm

MCU, FPGA

64MB

Zynq-7000 (Z-7030)

N/A

-

Trenz Electronic GmbH

128 Mbit

DDR3

XC6SLX100-2

1

Bulk

活跃

50 mm x 40 mm

Details

Xilinx

Spartan-6

512 MB, 512 MB

SPI

0 C

+ 70 C

0°C ~ 70°C

-

1.970 L x 1.570 W (50.00mm x 40.00mm)

萨姆泰克 LSHM

3.3 V

512 MB, 512 MB

125MHz

256MB

Spartan-6 LX-100

4 cm x 5 cm

FPGA核心

16MB

-

N/A

-

1

6.5 cm x 9 cm

This product may require additional documentation to export from the United States.

Details

Xilinx

Zynq UltraScale+

4 GB

I2C, PCIe, USB

0 C

+ 85 C

128 MB

DDR4

1.3 GHz

5 V

4 GB

4 Core

N/A

-

Advantech Corp

95 mm x 95 mm

Intel

Core i3-1115G4E

16 GB

0 GB

Audio, CAN, COM, DDI, Ethernet, GPIO, I2C, LPC, PCIe, SATA 3.0, SMBus, SPI, USB 2.0, USB 3.2, VGA

1

+ 60 C

0 C

Box

有

活跃

0°C ~ 60°C

-

3.740 x 3.740 (94.99mm x 94.99mm)

15W

2.2 GHz

8.5 V to 20 V

2.2GHz

Core™ i3-1115G4E

10/100/1000Mbps

USB 2.0 (8), USB 3.2 (4)

COM Express Compact Type 6

2

-/0GB

SATA 3.0 (2)

LVDS

CAN, GPIO, LPC, PCIe

-

Fan

-

N/A

-

APQ8016E

1 GB

1 GB

MIPI

- 25 C

+ 85 C

8 GB

LPDDR3

8 GB

eMMC 闪存

1

Open-Q

QC-DL-H00004

0.243390 oz

Details

Qualcomm

Bulk

2.4 GHz

3.3 V to 4.2 V

44 mm x 26.5 mm

N/A

-

Details

Qualcomm

APQ8096SG

4 GB

GPIO, I2C, SPI, UART, USB

LPDDR4

32 GB

Flash

1

Open-Q

0.296301 oz

Bulk

12 V

N/A

-

32 GB

eMMC 闪存

1

Open-Q

0.294185 oz

Details

Qualcomm

SDA660

4 GB

MIPI

- 25 C

+ 85 C

LPDDR4

Bulk

3.6 V to 4.2 V

50 mm x 25 mm

N/A

-

Intel

Atom C3708

CAN, I2C, SPI, USB

- 40 C

+ 85 C

备用电池

DDR4

64 GB

eMMC

1

125 mm x 95 mm

SOM-5962

1.7 GHz

8.5 V to 20 V

128 GB

32.6 W

COM Express

8

N/A

-

Advantech Corp

备用电池

DDR4

32 GB

eMMC

1

Box

SOM-6882

有

活跃

95 mm x 95 mm

Intel

Core i3-8145UE

CAN, I2C, SPI, USB

0 C

+ 60 C

0°C ~ 60°C

SOM-6882

3.740 x 3.740 (94.99mm x 94.99mm)

15W

2.2 GHz

8.5 V to 20 V

2.2GHz

64 GB

Intel®Celeron®I3-8145UE

59.721 W

10/100/1000Mbps

USB 2.0 (4), USB 3.1 (3)

COM Express

2

64GB/-

SATA 3.0 (3)

DP, DVI, HDMI, LCD, LVDS

I²C, LPC, PCIe, SMBus

8

Fan

-

N/A

-

GPIO, Serial

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

5.2 cm x 7.6 cm

This product may require additional documentation to export from the United States.

Details

Xilinx

XCZU15EG-1FFVC900E

4 GB

4 GB

5.2 cm x 7.6 cm

N/A

-

GPIO, Serial

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

5.2 cm x 7.6 cm

This product may require additional documentation to export from the United States.

Details

Xilinx

XCZU9EG-1FFVC900E

4 GB

4 GB

5.2 cm x 7.6 cm

N/A

-

GPIO, SPI

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

76 mm x 52 mm

This product may require additional documentation to export from the United States.

Details

Xilinx

XCZU6EG-1FFVC900E

4 GB

4 GB

-

3.3 V

5.2 cm x 7.6 cm

N/A

-

PCIe

128 MB

DDR4

32 GB

eMMC

Zynq UltraScale+

1

5.2 cm x 7.6 cm

This product may require additional documentation to export from the United States.

Details

Xilinx

XCZU7EV-1FBVB900E

4 GB

4 GB

5.2 cm x 7.6 cm

N/A

-

16 MB

DDR3L

Zynq-7010

1

65 mm x 30 mm

Details

Xilinx

XC7Z010-1CLG225C

512 MB

512 MB

GPIO, JTAG, UART, USB

0 C

+ 70 C

-

-

512 MB

Raspberry Pi Zero

N/A

-

DDR4

64 GB

eMMC

Zynq UltraScale+

1

Xilinx

XCZU2CG-1SFVC784E

4 GB

4 GB

GMII, PCIe, SATA, USB

0 C

+ 85 C

128 MB

4 cm x 5 cm

N/A

-

粘合剂安装

2.5/3 dBi

2

-30 to 65 °C

MHF4

PIFA

0.15 m

N/A

-

10 %

1

Trenz Electronic

Trenz Electronic

Details

-40 to 85 °C

240 pF

Computing

金属氧化物

Radial Leaded

System-On-Modules - SOM

620 V

System-On-Modules - SOM

N/A

-

Tin

Trenz Electronic GmbH

Solder

Polyester

磷青铜

表面贴装

1

Trenz Electronic

Trenz Electronic

Details

Bulk

Obsolete

TE0720, XC7Z020

Straight

-40 to 105 °C

TE0720

FPGA

Plug

2.5400 mm

Red

-

Board(s), Cable(s), Power Supply, Accessories

-

-

Vivado

Trenz Electronic

N/A

-

Trenz Electronic GmbH

Discontinued at Digi-Key

TE0729

1

Trenz Electronic

Trenz Electronic

Details

Bulk

TE0729

FPGA

-

Board(s)

-

-

-

Trenz Electronic

N/A

-

N/A

-

微芯片技术

Obsolete

Core1553

Bulk

-

25.0000 ppm/°C

FPGA

41.2 kOhm

0.1 W

Board(s)

0.1

7.06