N/A

-

Amphenol LTW

Obsolete

Bulk

UC-30AMM

-

Black

Shielded

23 AWG, 30 AWG, 32 AWG

A Male to C Male (Circular Coupling)

USB 3.2 Gen 1 (USB 3.1 Gen 1, Superspeed (USB 3.0))

Data Transfer and Charge, Industrial Environments - IP68

9.84 (3.00m)

N/A

-

Wide 1206 (3216 Metric), 0612

0612

TE Connectivity 无源产品

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

-55°C ~ 155°C

3430

0.061 L x 0.118 W (1.55mm x 3.00mm)

±1%

2

±100ppm/°C

680 Ohms

厚膜

1.5W

-

Automotive AEC-Q200

0.026 (0.65mm)

AEC-Q200

N/A

-

Production (Last Updated: 5 days ago)

Gold

Polybutylene

100

TE Connectivity

TE Connectivity

Bronze

Compliant

Carton

Solder

20

2

2.54 mm

Straight

5 mm

Green

AMPMODU Board-to-Boad & Wire-to-Board Connectors

TE Connectivity

25.4 mm

N/A

-

施耐德电气

Bulk

活跃

多系列

-

Door

Accessories

N/A

-

Tin

Panel Mount, Through Hole

Bulkhead - Front Side Nut

Aluminum

Nylon

-

-

Amphenol Aerospace Operations

-

Bulk

Metal

TV07DZ

活跃

Copper Alloy

Gold

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ HD

Solder

Receptacle, Female Sockets

121

Black

Military

Threaded

-

2 mm

N (Normal)

Unshielded

抗环境干扰

2 A

黑锌镍

21-121

Solder

-

-

Connectors

校准盘

50.0µin (1.27µm)

-

N/A

-

PEI-Genesis

Bulk

活跃

*

N/A

-

Matte Tin

Straight

Solder

LCP (Liquid Crystal Polymer)

磷青铜

表面贴装

-55 to 105 °C

4

Header

2 mm

32

Black

20.32 mm

N/A

-

1

Samtec

Samtec

老虎购买

Tube

ESW

背板连接器

PC / 104 Connectors

PC / 104 Connectors

N/A

-

表面贴装

780-BBGA, FCBGA

780-HBGA (33x33)

360

1

Samtec

Samtec

Details

0°C ~ 85°C (TJ)

Stratix® V GS

活跃

堆叠封头

Headers & Wire Housings

0.82 V ~ 0.88 V

5SGSMD4

360000

Headers & Wire Housings

23946240

135840

Headers & Wire Housings

N/A

-

通孔

12mm

Samtec

Samtec

Details

Tube

Free Height (FH)

活跃

Receptacle, Outer Shroud Contacts

80

2

Headers & Wire Housings

0.050 (1.27mm)

Gold

Headers & Wire Housings

电路板指南

Headers & Wire Housings

11.8µin (0.30µm)

0.374 (9.50mm)

N/A

-

通孔

Polyphenylene Sulfide (PPS), Glass Filled

36 (2 x 18)

铍铜

铍铜

Gold

--

Bulk

55

活跃

Solder

DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing

1A

0.100 (2.54mm)

Gold

--

0.110 (2.78mm)

0.100 (2.54mm)

封闭框架

--

--

UL94 V-0

N/A

-

Molex

Connectors

Bulk

087939

活跃

*

N/A

-

1

Samtec

Samtec

柔性叠片

TW

堆叠封头

Headers & Wire Housings

Headers & Wire Housings

Headers & Wire Housings

N/A

-

Gold

Liquid Crystal Polymer (LCP)

磷青铜

1

Samtec

Samtec

Details

+ 125 C

- 55 C

TW

堆叠封头

16 Position

2 Row

Headers & Wire Housings

2 mm

5.2 A

焊针

Headers & Wire Housings

Headers

Vertical

Headers & Wire Housings

0.6 in

N/A

-

N/A

-

T8 Linear

Samtec

柔性叠片

73

F32T8/741K

Eiko

4,100 K

1

TW

Fluorescent

Headers & Wire Housings

Headers & Wire Housings

32 W

Headers & Wire Housings

N/A

-

1

AirBorn

AirBorn

M系列

N

EAR99

Unavailable

MA

Board to Board & Mezzanine Connectors

Board to Board & Mezzanine Connectors

Board to Board & Mezzanine Connectors

N/A

-

LCP (Liquid Crystal Polymer)

通孔

-55 to 125 °C

叠板机

2

2.0000 mm

50

Black

50 mm

N/A

-

Molex

7000-88011-0110240

Murrelektronik

Bulk

087761

活跃

*

N/A

-

Molex

Bulk

087763

活跃

*

N/A

-

1

Samtec

Samtec

XCede

Board to Board & Mezzanine Connectors

Board to Board & Mezzanine Connectors

Board to Board & Mezzanine Connectors

N/A

-

Aluminum

Square, Fins

Assorted (BGA, LGA, CPU, ASIC...)

蓝色阳极氧化

Samtec

Samtec

pushPIN™

活跃

顶部安装

Board to Board & Mezzanine Connectors

推销

1.181 (30.00mm)

3.93°C/W @ 100 LFM

Board to Board & Mezzanine Connectors

--

--

Connectors

Board to Board & Mezzanine Connectors

--

1.378 (35.00mm)

1.378 (35.00mm)

N/A

-

N/A

-

N/A

-

Gold

Thermoplastic

Straight

Solder

Thermoplastic

Copper Alloy

通孔

+ 125 C

- 65 C

200

-

TE Connectivity

TE Connectivity

AMPMODU

Details

-65 to 125 °C

AMPMODU MOD II

Unshrouded

9 Position

Header

Headers & Wire Housings

2.5400 mm

3 A

焊针

Black

8.38 mm

Headers & Wire Housings

Headers

Headers & Wire Housings

22.45 mm