N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

60

微芯片技术

Actel

0.046530 oz

2.5000 V

Tray

A54SX08

活跃

2.75 V

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

有

A54SX08A-2TQG144

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

0 to 70 °C

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

2

0.9 ns

768

768

12000

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

A3PE600

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

0 to 70 °C

Tray

A3PE600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

272 MHz

1

13824

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

7000 LE

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

Tray

AFS600

活跃

1.575 V

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

活跃

M1A3PE1500

Tray

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

M1A3PE1500-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

0 to 70 °C

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

活跃

M1A3P600

Tray

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

This product may require additional documentation to export from the United States.

N

56340 LE

200 I/O

1.14 V

1.26 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

Tray

M2GL050TS

667 Mb/s

2 Transceiver

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

活跃

微芯片技术

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

M2GL050T-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

0°C ~ 85°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P125-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

A3P125

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

1

3072

125000

1.05 mm

13 mm

13 mm

3275 In Stock

-

8 Weeks

表面贴装

256-LFBGA

YES

162

-40°C~100°C TJ

Tray

Cyclone® 10 LP

活跃

3 (168 Hours)

256

1.0V

BOTTOM

BALL

未说明

1V

0.8mm

未说明

S-PBGA-B256

现场可编程门阵列

15408

516096

963

963

1.5mm

14mm

14mm

符合RoHS标准

200 In Stock

-

表面贴装

100-TQFP

YES

65

0°C~85°C TJ

Tray

2014

Cyclone®

e0

Obsolete

3 (168 Hours)

100

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V~1.575V

QUAD

鸥翼

235

1.5V

0.5mm

30

EP1C3

S-PQFP-G100

104

不合格

1.51.5/3.3V

320MHz

104

现场可编程门阵列

2910

59904

291

1.2mm

14mm

14mm

Non-RoHS Compliant

N/A

-

表面贴装

256-BGA

YES

191

-40°C~85°C TA

Tray

FLEX-10KE®

e0

Obsolete

3 (168 Hours)

256

Tin/Lead (Sn/Pb)

8542.39.00.01

2.375V~2.625V

BOTTOM

BALL

220

2.5V

1mm

30

EPF10K100

S-PBGA-B256

191

不合格

2.52.5/3.3V

0.5 ns

191

可加载 PLD

4992

49152

257000

624

MIXED

2.1mm

17mm

17mm

Non-RoHS Compliant

442 In Stock

-

6 Weeks

表面贴装

表面贴装

896-BBGA, FCBGA

896

556

0°C~85°C TJ

Tray

2005

Virtex®-II Pro

e1

yes

Obsolete

4 (72 Hours)

896

3A991.D

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

245

1.5V

1mm

30

XC2VP30

896

556

不合格

1.5V

1.51.5/3.32/2.52.5V

306kB

1200MHz

现场可编程门阵列

30816

2506752

3424

6

27392

0.32 ns

3.4mm

31mm

31mm

ROHS3 Compliant

无铅

625 In Stock

-

表面贴装

表面贴装

100-TQFP

77

0°C~85°C TJ

Tray

1999

Spartan®

e0

Obsolete

3 (168 Hours)

100

EAR99

锡铅

8542.39.00.01

4.75V~5.25V

QUAD

鸥翼

225

5V

0.5mm

unknown

30

XCS10

100

S-PQFP-G100

112

不合格

5V

784B

166MHz

112

现场可编程门阵列

466

6272

10000

196

1.2 ns

196

196

3000

1.2mm

14mm

14mm

Non-RoHS Compliant

含铅

30 In Stock

-

8 Weeks

表面贴装

表面贴装

100-LQFP

100

657.000198mg

SRAM

74

0°C~85°C TJ

Tray

2000

MachXO

e3

yes

活跃

3 (168 Hours)

100

EAR99

Matte Tin (Sn)

8542.39.00.01

1.14V~1.26V

QUAD

鸥翼

260

1.2V

0.5mm

30

LCMXO640

100

74

不合格

1.2V

14mA

0B

4.9 ns

4.9 ns

闪存 PLD

640

500MHz

80

MACROCELL

320

640

7

1.6mm

14mm

14mm

ROHS3 Compliant

无铅

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

0 C

+ 70 C

SMD/SMT

175 MHz

有

19

微芯片技术

Actel

0.171777 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-2PLG68

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

24

ProASIC3

1.575 V

Tray

A3PE1500

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

A3PE1500-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

A3PE1500

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

Tray

U1AFS600

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

114

-40°C ~ 100°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

30

70 °C

无

M1A3P1000L-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

97

Tray

微芯片技术

M1AGL1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1AGL1000V5-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

160

IGLOOe

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

Tray

A3PE1500

活跃

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

0 to 70 °C

Tray

A3PE1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

310 MHz

2

38400

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE600-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

270 I/O

1.425 V

0 to 70 °C

Tray

A3PE600

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

4 Transceiver

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

96 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P060-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

1

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

33 In Stock

-

8 Weeks

表面贴装

484-BGA

YES

343

-40°C~100°C TJ

Tray

Cyclone® IV E

e1

活跃

3 (168 Hours)

484

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

0.97V~1.03V

BOTTOM

BALL

260

1V

1mm

40

EP4CE15

S-PBGA-B484

346

不合格

11.2/3.32.5V

362MHz

346

现场可编程门阵列

15408

516096

963

963

2.4mm

23mm

23mm

符合RoHS标准