类别是'category.片上系统(SoC)' (7695)

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M2S050-1FCS325
M2S050-1FCS325
Microchip Technology 数据表

2896 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

Tray

微芯片技术

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S050-1FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

200

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S025T-VFG256
M2S025T-VFG256
Microchip Technology 数据表

2956 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

YES

256-FPBGA (14x14)

256

ARM Cortex M3

0 C

+ 85 C

有

2308 LAB

微芯片技术

119

Tray

M2S025

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

有

M2S025T-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

138 I/O

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm

M2S025-1FGG484I
M2S025-1FGG484I
Microchip Technology 数据表

2995 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

64 kB

27696 LE

有

2308 LAB

60

267

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

M2S025TS-1FCSG325
M2S025TS-1FCSG325
Microchip Technology 数据表

2000 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

有

2308 LAB

176

180

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S025TS-1VF256
M2S025TS-1VF256
Microchip Technology 数据表

2085 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-256

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

有

2308 LAB

119

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S005S-1FG484
M2S005S-1FG484
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

209

Tray

微芯片技术

M2S005

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S005S-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

209

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

209

2.44 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

23 mm

23 mm

M2S060TS-1FGG484I
M2S060TS-1FGG484I
Microchip Technology 数据表

2175 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

SmartFusion2

0.418384 oz

1.2000 V

微芯片技术

活跃

M2S060

Tray

267

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S060TS-1FGG484I

BGA

SQUARE

活跃

IC FPGA SOC 60K LUTS

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 60K Logic Modules

56520

1 Core

256KB

23 mm

23 mm

M2S060T-1VF400
M2S060T-1VF400
Microchip Technology 数据表

2690 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

Tray

微芯片技术

M2S060

活跃

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

GRID ARRAY, LOW PROFILE, FINE PITCH

VFBGA-400

5.88

1.26 V

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2S060T-1VF400

无

85 °C

1.14 V

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

207

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S090T-FGG484
M2S090T-FGG484
Microchip Technology 数据表

2066 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

7193 LAB

60

267

Tray

M2S090

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

86316 LE

有

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 90K Logic Modules

1 Core

512KB

M2S150TS-1FCV484
M2S150TS-1FCV484
Microchip Technology 数据表

949 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

ARM Cortex M3

微芯片技术

12177 LAB

84

273

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

有

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S050T-1FG484I
M2S050T-1FG484I
Microchip Technology 数据表

2346 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

60

1.2000 V

1.14 V

1.26 V

267

Tray

M2S050

活跃

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

M2S090T-1FG484
M2S090T-1FG484
Microchip Technology 数据表

2712 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

64 kB

86316 LE

有

7193 LAB

60

267

Tray

M2S090

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

M2S090-FGG484I
M2S090-FGG484I
Microchip Technology 数据表

2283 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

273 I/O

- 40 C

+ 100 C

有

7193 LAB

60

0.766018 oz

1.2000 V

Tray

M2S090

活跃

-40 to 100 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 90K Logic Modules

1 Core

512KB

M2S060-1FG676
M2S060-1FG676
Microchip Technology 数据表

2057 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

活跃

M2S060

微芯片技术

Tray

387

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

无

M2S060-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

40

SmartFusion2

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

387

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

ST4SI2S0009AKI8T
ST4SI2S0009AKI8T
STMicroelectronics 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

-

STMicroelectronics

不适用

1.8 V, 3 V, 5 V

- 25 C

+ 80 C

SMD/SMT

15000

RISC

Microcontroller

Bulk

ST4SI2

活跃

1.8 V, 3 V, 5 V

Bulk

ST4SIM-200S

LTE-M

-

偏差网络

Flash

32 bit

2G, 3G, 4G, CDMA, LTE

SIM卡和智能卡接口

ARM SC300

XCZU4CG-L1FBVB900I4560
XCZU4CG-L1FBVB900I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-900

ARM Cortex A53, ARM Cortex R5

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

-

192150 LE

204 I/O

- 40 C

+ 100 C

2.6 Mbit

4.5 Mbit

10980 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 1.5 GHz

XCZU4CG

720 mV/850 mV

-

16 Transceiver

4 Core

XCZU6CG-L1FFVB1156I4560
XCZU6CG-L1FFVB1156I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-1156

ARM Cortex A53, ARM Cortex R5

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

-

469446 LE

328 I/O

- 40 C

+ 100 C

6.9 Mbit

25.1 Mbit

26825.5 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 1.5 GHz

XCZU6CG

720 mV/850 mV

-

24 Transceiver

4 Core

XCZU4EV-L1FBVB900I4560
XCZU4EV-L1FBVB900I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-900

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

204 I/O

2.6 Mbit

4.5 Mbit

10980 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

192150 LE

XCZU4EV

-

16 Transceiver

7 Core

XCZU5EG-L1SFVC784I4560
XCZU5EG-L1SFVC784I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-784

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

256200 LE

252 I/O

- 40 C

+ 100 C

3.5 Mbit

5.1 Mbit

14640 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

XCZU5EG

720 mV/850 mV

-

4 Transceiver

7 Core

XCZU15EG-L1FFVB1156I4560
XCZU15EG-L1FFVB1156I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-1156

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

746550 LE

328 I/O

- 40 C

+ 100 C

11.3 Mbit

26.2 Mbit

42660 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

XCZU15EG

720 mV/850 mV

-

24 Transceiver

7 Core

XCZU7EG-L1FFVC1156I4560
XCZU7EG-L1FFVC1156I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-1156

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

504000 LE

360 I/O

- 40 C

+ 100 C

6.2 Mbit

11 Mbit

28800 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

XCZU7EG

720 mV/850 mV

-

20 Transceiver

7 Core

XCZU11EG-L1FFVF1517I4560
XCZU11EG-L1FFVF1517I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-1517

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

653100 LE

464 I/O

Zynq UltraScale+

1

37320 LAB

21.1 Mbit

9.1 Mbit

+ 100 C

- 40 C

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

XCZU11EG

720 mV/850 mV

-

32 Transceiver

7 Core

XCZU7EV-L1FBVB900I4560
XCZU7EV-L1FBVB900I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-900

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

504000 LE

204 I/O

- 40 C

+ 100 C

6.2 Mbit

11 Mbit

28800 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

XCZU7EV

720 mV/850 mV

-

16 Transceiver

7 Core

XCZU11EG-L1FFVC1156I4560
XCZU11EG-L1FFVC1156I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-1156

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

653100 LE

360 I/O

- 40 C

+ 100 C

9.1 Mbit

21.1 Mbit

37320 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

XCZU11EG

720 mV/850 mV

-

20 Transceiver

7 Core

XAZU11EG-1FFVF1517I
XAZU11EG-1FFVF1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-1517

1517-FCBGA (40x40)

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

AMD 赛灵思

SMD/SMT

500 MHz, 600 MHz, 1.2 GHz

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

653100 LE

464 I/O

- 40 C

+ 100 C

9.1 Mbit

21.1 Mbit

37320 LAB

1

Zynq UltraScale+

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

XAZU11EG

0.85 V

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

32 Transceiver

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

7 Core

-