类别是'category.内存模块' (5401)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 长度 | 宽度 | ||||||||||||||||||||
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![]() | K4U6E3S4AA-MGCR | Samsung | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | true | Tray | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | K3LK2K20BM-BGCN | Samsung | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | true | Tape & Reel (TR) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M29W160ET70N6 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 12 X 20 MM, PLASTIC, TSOP-48 | 70 ns | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 无 | Transferred | NUMONYX | TSOP | EAR99 | NOR型号 | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 1MX16 | 1.2 mm | 16 | 0.0001 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | TOP | YES | 18.4 mm | 12 mm | |||||||||||||||||||
![]() | PM49FL004T-33JCE | BHC Components / KEMET | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PM49FL004T-33JCE | Programmable Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 3.3 V | 有 | Transferred | PROGRAMMABLE MICROELECTRONICS CORP | 120 ns | 524288 words | 512000 | 85 °C | EAR99 | NOR型号 | 8542.32.00.51 | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J32 | 不合格 | OTHER | 0.02 mA | 512KX8 | 8 | 0.0005 A | 4194304 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 4K | TOP | |||||||||||||||||||||||||||||||||||
![]() | RC28F128J3F75 | Alliance Memory Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 活跃 | ALLIANCE MEMORY INC | FBGA-64 | 75 ns | 134217728 words | 128000000 | NOR型号 | BOTTOM | BALL | 1 | 1 mm | unknown | R-PBGA-B64 | 3.6 V | 2.7 V | ASYNCHRONOUS | 0.07 mA | 128MX1 | OPEN-DRAIN | 1.2 mm | 1 | 0.002 A | 134217728 bit | PARALLEL | FLASH | 3 V | 100000 Write/Erase Cycles | 0.000075 ms | YES | NO | NO | 128 | 64K | YES | YES | 13 mm | 10 mm | ||||||||||||||||||||||||||
![]() | RC28F128J3F75 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | BGA | BGA-64 | 75 ns | 1 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 无 | Obsolete | MICRON TECHNOLOGY INC | e0 | 无 | EAR99 | NOR型号 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.32.00.51 | BOTTOM | BALL | 235 | 1 | 1 mm | unknown | 30 | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.054 mA | 8MX16 | 1.2 mm | 16 | 0.00012 A | 134217728 bit | PARALLEL | FLASH | 2.7 V | 8 | NO | NO | YES | 128 | 128K | 4/8 words | YES | YES | 13 mm | 10 mm | ||||||||||||||
![]() | S34ML04G100TFI00 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W25Q256JVFIN | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS25LP064D-QBLA3-TR | Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MZ7L3480HCHQ-00A07 | Samsung Electronics Co. Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MZ7L3240HCHQ-00A07 | Samsung Electronics Co. Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 27C512-15FA | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | DIP | RECTANGULAR | IN-LINE | 5 V | Obsolete | NXP SEMICONDUCTORS | DIP-28 | 150 ns | 65536 words | 64000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T28 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.015 mA | 64KX8 | 8 | 524288 bit | PARALLEL | UVPROM | ||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL512N11TFI023 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | TSOP1 | LEAD FREE, MO-142EC, TSOP-56 | 110 ns | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 有 | Obsolete | SPANSION INC | e3 | 有 | 3A991.B.1.A | NOR型号 | 哑光锡 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PDSO-G56 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.2 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | 18.4 mm | 14 mm | ||||||||||||||
![]() | S29GL512N11TFI023 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 有 | Obsolete | CYPRESS SEMICONDUCTOR CORP | LEAD FREE, MO-142EC, TSOP-56 | 110 ns | e3 | EAR99 | NOR型号 | 哑光锡 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G56 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.2 mm | 16 | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | S29GL512N11TFI023 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 有 | Transferred | ADVANCED MICRO DEVICES INC | 110 ns | 33554432 words | 32000000 | 85 °C | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 0.5 mm | unknown | R-PDSO-G56 | 不合格 | INDUSTRIAL | 0.09 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||||||||
![]() | PC28F640P30BF65 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 10 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, BGA-64 | 65 ns | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 1.8 V | 有 | Obsolete | MICRON TECHNOLOGY INC | BGA | e1 | 有 | EAR99 | NOR型号 | 锡银铜 | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | 64 | R-PBGA-B64 | 2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS/SYNCHRONOUS | 0.028 mA | 4MX16 | 3-STATE | 1.2 mm | 16 | 0.000035 A | 67108864 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 4,63 | 16K,64K | 8 words | BOTTOM | YES | 13 mm | 10 mm | ||||||||||||||||||
![]() | S29PL064J55BFI12 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | BGA | VFBGA, BGA48,6X8,32 | 55 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 V | 有 | Transferred | SPANSION INC | e1 | 有 | EAR99 | NOR型号 | 锡银铜 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 4MX16 | 1 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,126 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | ||||||||||||||
![]() | S25FL040A0LVFI001 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOIC | 0.150 INCH, LEAD FREE, PLASTIC, MS-012AA, SOP-8 | 50 MHz | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3 V | 有 | Obsolete | SPANSION INC | e3 | 有 | EAR99 | NOR型号 | 哑光锡 | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | unknown | 40 | 8 | R-PDSO-G8 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.013 mA | 512KX8 | 3-STATE | 1.75 mm | 8 | 0.000005 A | 4194304 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | |||||||||||||||||
![]() | S29PL032J70BAW12 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | BGA | 8.15 X 6.15 MM, FBGA-48 | 70 ns | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 V | 无 | Transferred | SPANSION INC | e0 | 无 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 0.07 mA | 2MX16 | 1 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,62 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | |||||||||||||||
![]() | SDIN5C2-8G-L | SanDisk Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 169 | 8000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3.3 V | 有 | Obsolete | SANDISK CORP | TFBGA-169 | 3 | 8589934592 words | 有 | EAR99 | MLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.5 mm | unknown | R-PBGA-B169 | 3.6 V | OTHER | 2.7 V | SYNCHRONOUS | 8GX8 | 1 mm | 8 | 68719476736 bit | PARALLEL | FLASH | 3.3 V | 16 mm | 12 mm | ||||||||||||||||||||||||||||||||||
![]() | LH28F400SUT-NF60 | Sharp Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | SOP | RECTANGULAR | 小概要 | 5 V | Obsolete | SHARP CORP | TSOP1-56 | 60 ns | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | NOR型号 | USER CONFIGURABLE AS 256K X 16 | DUAL | 鸥翼 | 1 | unknown | R-PDSO-G56 | 不合格 | COMMERCIAL | 512KX8 | 8 | 4194304 bit | PARALLEL | FLASH | 5 V | ||||||||||||||||||||||||||||||||||||||||||||
![]() | E28F016XS-15 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 20 ns | 2097152 words | 2000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 5 V | 无 | Obsolete | INTEL CORP | TSOP1 | TSOP1, TSSOP56,.8,20 | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | ALSO CAN BE CONFIGURED AS 1M X 16 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 56 | R-PDSO-G56 | 不合格 | 5.25 V | COMMERCIAL | 4.75 V | SYNCHRONOUS | 0.175 mA | 2MX8 | 3-STATE | 1.2 mm | 8 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 5 V | 8 | NO | NO | YES | 16 | 128K | YES | 18.4 mm | 14 mm | |||||||||||||||||||
![]() | S29GL256P90TFIR1 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17256L-DD8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | 55 ns | 10 MHz | 262144 words | 1000 | 85 °C | -40 °C | CERAMIC | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | XILINX INC | DIP, DIP8,.3 | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-XDIP-T8 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 0.01 mA | 1KX8 | 3-STATE | 8 | 0.00005 A | 8192 bit | PARALLEL | COMMON | OTP ROM |
K4U6E3S4AA-MGCR
Samsung
分类:Memory - Modules
K3LK2K20BM-BGCN
Samsung
分类:Memory - Modules
M29W160ET70N6
Numonyx Memory Solutions
分类:Memory - Modules
PM49FL004T-33JCE
BHC Components / KEMET
分类:Memory - Modules
PM49FL004T-33JCE
Programmable Microelectronics Corp
分类:Memory - Modules
RC28F128J3F75
Alliance Memory Inc
分类:Memory - Modules
RC28F128J3F75
Micron Technology Inc
分类:Memory - Modules
S34ML04G100TFI00
Spansion
分类:Memory - Modules
W25Q256JVFIN
Winbond Electronics Corp
分类:Memory - Modules
IS25LP064D-QBLA3-TR
Integrated Silicon Solution Inc
分类:Memory - Modules
MZ7L3480HCHQ-00A07
Samsung Electronics Co. Ltd
分类:Memory - Modules
MZ7L3240HCHQ-00A07
Samsung Electronics Co. Ltd
分类:Memory - Modules
27C512-15FA
NXP Semiconductors
分类:Memory - Modules
S29GL512N11TFI023
Spansion
分类:Memory - Modules
S29GL512N11TFI023
Cypress Semiconductor
分类:Memory - Modules
S29GL512N11TFI023
AMD
分类:Memory - Modules
PC28F640P30BF65
Micron Technology Inc
分类:Memory - Modules
S29PL064J55BFI12
Spansion
分类:Memory - Modules
S25FL040A0LVFI001
Spansion
分类:Memory - Modules
S29PL032J70BAW12
Spansion
分类:Memory - Modules
SDIN5C2-8G-L
SanDisk Corporation
分类:Memory - Modules
LH28F400SUT-NF60
Sharp Corp
分类:Memory - Modules
E28F016XS-15
Intel Corporation
分类:Memory - Modules
S29GL256P90TFIR1
Spansion
分类:Memory - Modules
XC17256L-DD8I
AMD Xilinx
分类:Memory - Modules
