category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	供应商器件包装						厂商					操作温度	系列	子类别	工作电源电压	速度	内存大小	核心处理器	周边设备	连接方式	建筑学	产品类别	主要属性	闪光大小
XCVM1502-1LSINFVB1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1		AMD	478	Tray	活跃			Versal™ Prime			400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ Prime FPGA, 1M Logic Cells	-
XCVM1402-2MSINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	- 40 C	+ 110 C	Xilinx	Xilinx	AMD 赛灵思	424	Tray	活跃	1	-40°C ~ 100°C (TJ)	Versal™ Prime	SOC - Systems on a Chip	800 mV	600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	System-On-Modules - SOM	Versal™ Prime FPGA, 1.2M Logic Cells	-	SoC FPGA
XCVM1302-1MLINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	- 40 C	1	Xilinx	Xilinx	AMD 赛灵思	316	Tray	活跃	+ 110 C	-40°C ~ 100°C (TJ)	Versal™ Prime	SOC - Systems on a Chip	800 mV	600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells	-	SoC FPGA
XCVM1302-1LSENBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	0 C	1	Xilinx	Xilinx	AMD 赛灵思	316	Tray	活跃	+ 100 C	0°C ~ 100°C (TJ)	Versal™ Prime	SOC - Systems on a Chip	700 mV	400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells	-	SoC FPGA
XCVM1302-1LSINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	- 40 C	1	Xilinx	Xilinx	AMD 赛灵思	316	Tray	活跃	+ 110 C	-40°C ~ 100°C (TJ)	Versal™ Prime	SOC - Systems on a Chip	700 mV	400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells	-	SoC FPGA
XCVM1402-2MLINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	1	Xilinx	Xilinx	AMD 赛灵思	424	活跃	+ 110 C	- 40 C	-40°C ~ 100°C (TJ)		SOC - Systems on a Chip	800 mV	600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	System-On-Modules - SOM	Versal™ Prime FPGA, 1.2M Logic Cells	-	SoC FPGA
XCVM1802-2LLEVFVC1760-5189	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1	Xilinx	Xilinx				+ 110 C	0 C			SOC - Systems on a Chip	700 mV							System-On-Modules - SOM			SoC FPGA
AGFC023R25A3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	480	Tray	活跃	0°C ~ 100°C (TJ)	Agilex F			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 2.3M Logic Elements	-
XCZU11EG-2FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	XCZU11	活跃	360	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG			533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	-
AGIB027R31B2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	720	Tray	活跃	-40°C ~ 100°C (TJ)	Agilex I			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 2.7M Logic Elements	-
AGFB006R16A2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	384	Tray	活跃	-40°C ~ 100°C (TJ)	Agilex F			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 573K Logic Elements	-
AGIB019R18A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	480	Tray	活跃	0°C ~ 100°C (TJ)	Agilex I			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 1.9M Logic Elements	-
XCZU5EV-2SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	Tray	XCZU5	活跃	252	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EV			533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	-
XAZU2EG-1SFVC784Q	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	Tray	XAZU2	活跃	128	-40°C ~ 125°C (TJ)	Zynq® UltraScale+™ MPSoC EG			500MHz, 1.2GHz	1.2MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	-
XC7Z045-2FF900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	Tray	XC7Z045	活跃	130	-40°C ~ 100°C (TJ)	Zynq®-7000			800MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Kintex™-7 FPGA, 350K Logic Cells	-
AGFB023R25A3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	480	Tray	活跃	-40°C ~ 100°C (TJ)	Agilex F			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 2.3M Logic Elements	-
AGFB023R25A2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	480	Tray	活跃	0°C ~ 100°C (TJ)	Agilex F			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 2.3M Logic Elements	-
XCZU17EG-3FFVC1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD	Tray	XCZU17	活跃	512	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG			600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	-
AGIB022R31B1E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	720	Tray	活跃	0°C ~ 100°C (TJ)	Agilex I			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 2.2M Logic Elements	-
AGFB008R24C2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	576	Tray	活跃	-40°C ~ 100°C (TJ)	Agilex F			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 764K Logic Elements	-
XCZU11EG-1FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	XCZU11	活跃	360	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	-
XCVC1502-1MLIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	586	Tray	活跃		Versal™ AI Core			600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ AI Core FPGA, 800k Logic Cells	-
AGFA008R24C3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	576	Tray	活跃	-40°C ~ 100°C (TJ)	Agilex F			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 764K Logic Elements	-
XCVC1502-1MLIVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	AMD	Tray	活跃		478		Versal™ AI Core			600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ AI Core FPGA, 800k Logic Cells	-
AGFD019R25A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	480	Tray	活跃	0°C ~ 100°C (TJ)	Agilex F			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 1.9M Logic Elements	-