869 In Stock

-

8 Weeks

表面贴装

1517-BBGA, FCBGA

YES

696

0°C~85°C TJ

Tray

Stratix® V GX

活跃

3 (168 Hours)

3A001.A.7.A

8542.39.00.01

0.87V~0.93V

BOTTOM

BALL

0.9V

1mm

5SGXEA7

S-PBGA-B1517

696

不合格

0.851.52.52.5/31.2/3V

696

23472 CLBS

现场可编程门阵列

622000

51200000

234720

3.5mm

40mm

40mm

符合RoHS标准

33 In Stock

• 1: ¥265.080824
• 10: ¥250.076251
• 100: ¥235.920991
• 500: ¥222.566973
查看所有的价格

-

10 Weeks

表面贴装

表面贴装

100-TQFP

100

63

0°C~85°C TJ

Tray

2006

Spartan®-3

e0

no

活跃

3 (168 Hours)

100

EAR99

1.14V~1.26V

QUAD

鸥翼

225

1.2V

not_compliant

30

XC3S200

100

63

不合格

1.2V

27kB

现场可编程门阵列

4320

221184

200000

480

5

480

1.2mm

14mm

14mm

Non-RoHS Compliant

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

2.25 V

0 C

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

27

Actel

Tray

A54SX32

活跃

2.75 V

5.24

MICROSEMI CORP

活跃

SQUARE

BGA

278 MHz

A54SX32A-1BG329

无

70 °C

30

2.5 V

BGA329,23X23,50

PLASTIC/EPOXY

3

网格排列

BGA, BGA329,23X23,50

N

249 I/O

0°C ~ 70°C (TA)

Tray

A54SX32A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

CSP-201

YES

201-CSP (8x8)

201

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

348

IGLOO PLUS

1.575 V

Tray

AGLP060

活跃

VFBGA, BGA201,15X15,20

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA201,15X15,20

1.5 V

未说明

70 °C

有

AGLP060V5-CSG201

250 MHz

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

157 I/O

0°C ~ 85°C (TJ)

Tray

AGLP060V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B201

157

不合格

1.5 V

1.5 V

COMMERCIAL

157

1584 CLBS, 60000 GATES

0.99 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

0.66 mm

8 mm

8 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

3 V

0 C

+ 70 C

SMD/SMT

175 MHz

有

微芯片技术

66

Actel

0.062040 oz

Tray

A40MX02

活跃

5.25 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-2PQG100

101 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

57 I/O

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

2 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

0 C

+ 70 C

SMD/SMT

188 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A40MX02

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-3VQG80

109 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

1.7 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

178 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P400-2FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

2

9216

400000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

3 V

0 C

+ 70 C

SMD/SMT

188 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-3PQG100

109 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

57 I/O

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

1.7 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

3 V

0 C

+ 70 C

SMD/SMT

269 MHz

有

微芯片技术

66

Actel

0.062040 oz

Tray

A42MX09

活跃

5.25 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-2PQG100

146 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

83 I/O

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

1.8 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

有

A54SX32A-FFGG256

172 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.7 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

- 40 C

+ 125 C

SMD/SMT

153 MHz

有

66

微芯片技术

Actel

0.062040 oz

5.25 V

83

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-PQG100A

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.53

Details

4.75 V

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

5 V

AUTOMOTIVE

24000 GATES

3.4 mm

现场可编程门阵列

24000

STD

2.4 ns

24000

2.7 mm

20 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

237 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.25 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-3PQG160

129 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

24000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

3 V

0 C

+ 70 C

SMD/SMT

296 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX09

活跃

3.3 V

40

70 °C

有

A42MX09-3PQG100

161 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

PLASTIC/EPOXY

3

FLATPACK

QFP,

Details

83 I/O

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

1.6 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

IGLOO2

176

有

1.2 V

Tray

M2GL090

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL090T

1.14V ~ 2.625V

1.2 V

86184

2648064

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

237 MHz

有

微芯片技术

40

Actel

5.25 V

Tray

A42MX16

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-3TQG176

129 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

140 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

24000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

0 C

+ 70 C

SMD/SMT

103 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A42MX16

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-FVQG100

56 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

83 I/O

3 V

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

4 ns

1232

24000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE1500

活跃

0°C ~ 85°C (TJ)

Tray

A3PE1500

70 °C

0 °C

1.425V ~ 1.575V

272 MHz

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

272 MHz

1

38400

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

240-BQFP

YES

189

0°C~85°C TJ

Tray

APEX-20K®

e0

Obsolete

3 (168 Hours)

240

Tin/Lead (Sn/Pb)

8542.39.00.01

2.375V~2.625V

QUAD

鸥翼

220

2.5V

0.5mm

30

EP20K100

S-PQFP-G240

183

不合格

2.52.5/3.3V

3.6 ns

183

可加载 PLD

4160

53248

263000

416

MACROCELL

4

4.1mm

32mm

32mm

Non-RoHS Compliant

N/A

-

表面贴装

208-BFQFP

YES

147

0°C~70°C TA

Tray

ACEX-1K®

e3

Obsolete

3 (168 Hours)

208

3A991

Matte Tin (Sn)

8542.39.00.01

2.375V~2.625V

QUAD

鸥翼

245

2.5V

0.5mm

compliant

40

EP1K100

S-PQFP-G208

147

不合格

2.52.5/3.3V

37.5MHz

0.5 ns

147

可加载 PLD

4992

49152

257000

624

MIXED

4.1mm

28mm

28mm

符合RoHS标准

80 In Stock

-

表面贴装

表面贴装

240-BFQFP Exposed Pad

240

166

0°C~85°C TJ

Tray

2000

Virtex®

e0

no

Obsolete

3 (168 Hours)

240

Tin/Lead (Sn85Pb15)

8542.39.00.01

2.375V~2.625V

QUAD

鸥翼

225

2.5V

0.5mm

unknown

30

XCV800

240

166

不合格

1.2/3.62.5V

14kB

250MHz

现场可编程门阵列

21168

114688

888439

4704

0.8 ns

4.1mm

32mm

32mm

Non-RoHS Compliant

含铅

191 In Stock

-

表面贴装

672-BBGA, FCBGA

YES

336

0°C~85°C TJ

Tray

Arria V GX

e1

Obsolete

3 (168 Hours)

672

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5AGXBA1

S-PBGA-B672

336

不合格

1.11.2/3.32.5V

670MHz

336

现场可编程门阵列

75000

8666112

3537

2.7mm

27mm

27mm

符合RoHS标准

90 In Stock

-

表面贴装

1152-BBGA, FCBGA Exposed Pad

YES

544

0°C~85°C TJ

Tray

Arria V GX

e1

Obsolete

3 (168 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5AGXFA5

S-PBGA-B1152

544

不合格

1.11.2/3.32.5V

500MHz

544

现场可编程门阵列

190000

13284352

8962

2.7mm

35mm

35mm

符合RoHS标准

50 In Stock

-

10 Weeks

表面贴装

表面贴装

1156-BBGA, FCBGA

1156

600

-40°C~100°C TJ

Tray

2008

Virtex®-6 LXT

e0

no

活跃

4 (72 Hours)

3A991.D

Tin/Lead (Sn63Pb37)

0.95V~1.05V

BOTTOM

BALL

未说明

1V

1mm

未说明

XC6VLX365T

600

不合格

1V

1.8MB

现场可编程门阵列

364032

15335424

28440

2

3.5mm

35mm

35mm

Non-RoHS Compliant

10 In Stock

-

表面贴装

表面贴装

240-BFQFP Exposed Pad

240

166

-40°C~100°C TJ

Tray

2000

Virtex®

e0

no

Obsolete

3 (168 Hours)

240

Tin/Lead (Sn85Pb15)

8542.39.00.01

2.375V~2.625V

QUAD

鸥翼

225

2.5V

0.5mm

unknown

30

XCV600

240

166

不合格

1.2/3.62.5V

12kB

250MHz

现场可编程门阵列

15552

98304

661111

3456

0.8 ns

4.1mm

32mm

32mm

Non-RoHS Compliant

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P400-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

-40 to 85 °C

Tray

A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

400000

1.05 mm

13 mm

13 mm

无