N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

7000 LE

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

Tray

AFS600

活跃

1.575 V

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.5 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

M1A3PE1500-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

0 to 70 °C

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

This product may require additional documentation to export from the United States.

N

56340 LE

200 I/O

1.14 V

1.26 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

Tray

M2GL050TS

667 Mb/s

2 Transceiver

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

活跃

微芯片技术

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

M2GL050T-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

0°C ~ 85°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

3275 In Stock

-

8 Weeks

表面贴装

256-LFBGA

YES

162

-40°C~100°C TJ

Tray

Cyclone® 10 LP

活跃

3 (168 Hours)

256

1V

BOTTOM

BALL

未说明

0.8mm

未说明

S-PBGA-B256

现场可编程门阵列

15408

516096

963

963

1.5mm

14mm

14mm

符合RoHS标准

N/A

-

表面贴装

100-TQFP

YES

65

0°C~85°C TJ

Tray

2014

Cyclone®

e0

Obsolete

3 (168 Hours)

100

Tin/Lead (Sn/Pb)

8542.39.00.01

1.5V

QUAD

鸥翼

235

0.5mm

30

EP1C3

S-PQFP-G100

104

不合格

1.51.5/3.3V

320MHz

104

现场可编程门阵列

2910

59904

291

1.2mm

14mm

14mm

Non-RoHS Compliant

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

+ 85 C

SMD/SMT

有

90

微芯片技术

IGLOOe

0.014110 oz

1.5000 V

1.575 V

Tray

M1AGL600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1AGL600V5-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1AGL600V5

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

N

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P600

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

A3P600L-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

A3P600L

e0

锡铅银

85 °C

-40 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

13.5 kB

5 mA

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

892.86 MHz

1

13824

13824

13824

1.26 V

1.14 V

600000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

+ 70 C

SMD/SMT

有

90

Actel

微芯片技术

0.023175 oz

2.7 V

Tray

EX256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

70 °C

有

EX256-PTQG100

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

81 I/O

2.3 V

0 C

0°C ~ 70°C (TA)

Tray

eX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

COMMERCIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

0.7 ns

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

4 Transceiver

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0.014110 oz

ProASIC3

160

有

272 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

微芯片技术

96 I/O

N

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P060-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

1

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3P600

活跃

5.24

MICROSEMI CORP

活跃

SQUARE

BGA

350 MHz

M1A3P600-FG256

无

85 °C

30

1.5 V

PLASTIC/EPOXY

3

网格排列

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

Tray

A3PE1500

活跃

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

0 to 70 °C

Tray

A3PE1500

70 °C

0 °C

1.5 V

33.8 kB

276480

1500000

310 MHz

2

38400

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

272 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

微芯片技术

270 I/O

N

This product may require additional documentation to export from the United States.

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE600-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

ProASIC3

60

有

0 to 70 °C

Tray

A3PE600

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

COMMERCIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

0 C

+ 70 C

SMD/SMT

175 MHz

有

19

微芯片技术

Actel

0.171777 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-2PLG68

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

24

ProASIC3

1.575 V

Tray

A3PE1500

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

A3PE1500-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

A3PE1500

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

38400

1.575 V

1.425 V

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

30

70 °C

无

M1A3P1000L-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

Tray

U1AFS600

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

114

-40°C ~ 100°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

97

Tray

微芯片技术

M1AGL1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1AGL1000V5-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

160

IGLOOe

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

表面贴装

100-TQFP

100

77

0°C~85°C TJ

Tray

1999

Spartan®

e0

Obsolete

3 (168 Hours)

100

EAR99

锡铅

8542.39.00.01

5V

QUAD

鸥翼

225

0.5mm

unknown

30

XCS10

S-PQFP-G100

112

不合格

5V

784B

166MHz

112

现场可编程门阵列

466

6272

10000

196

1.2 ns

196

196

3000

1.2mm

14mm

14mm

Non-RoHS Compliant

含铅

30 In Stock

-

8 Weeks

表面贴装

表面贴装

100-LQFP

100

657.000198mg

SRAM

74

0°C~85°C TJ

Tray

2000

MachXO

e3

yes

活跃

3 (168 Hours)

100

EAR99

Matte Tin (Sn)

8542.39.00.01

1.2V

QUAD

鸥翼

260

0.5mm

30

LCMXO640

74

不合格

0B

4.9 ns

4.9 ns

14mA

闪存 PLD

640

500MHz

80

MACROCELL

320

640

7

1.6mm

14mm

14mm

ROHS3 Compliant

无铅

N/A

-

表面贴装

256-BGA

YES

191

-40°C~85°C TA

Tray

FLEX-10KE®

e0

Obsolete

3 (168 Hours)

256

Tin/Lead (Sn/Pb)

8542.39.00.01

2.5V

BOTTOM

BALL

220

1mm

30

EPF10K100

S-PBGA-B256

191

不合格

2.52.5/3.3V

0.5 ns

191

可加载 PLD

4992

49152

257000

624

MIXED

2.1mm

17mm

17mm

Non-RoHS Compliant

N/A

-

6 Weeks

表面贴装

表面贴装

896-BBGA, FCBGA

896

556

0°C~85°C TJ

Tray

2005

Virtex®-II Pro

e1

yes

Obsolete

4 (72 Hours)

896

3A991.D

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

1.5V

BOTTOM

BALL

245

1mm

30

XC2VP30

556

不合格

1.51.5/3.32/2.52.5V

306kB

1200MHz

现场可编程门阵列

30816

2506752

3424

6

27392

0.32 ns

3.4mm

31mm

31mm

ROHS3 Compliant

无铅

47 In Stock

-

8 Weeks

表面贴装

484-BGA

YES

343

-40°C~100°C TJ

Tray

Cyclone® IV E

e1

活跃

3 (168 Hours)

484

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1V

BOTTOM

BALL

260

1mm

40

EP4CE15

S-PBGA-B484

346

不合格

11.2/3.32.5V

362MHz

346

现场可编程门阵列

15408

516096

963

963

2.4mm

23mm

23mm

符合RoHS标准