category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.PLDs（可编程逻辑器件）' (2797)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																			JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	包装方式	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	温度等级	传播延迟	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	筛选水平	输出功能	宏细胞数	JTAG BST	专用输入数量	系统内可编程	产品条款数量	长度	宽度
PALCE610H-15PC	Vantis Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	PLASTIC/EPOXY	DIP	DIP24,.3	RECTANGULAR	IN-LINE	5 V	无	Transferred	VANTIS CORP	76.1 MHz	16	70 °C	e0			Tin/Lead (Sn/Pb)				DUAL	THROUGH-HOLE		2.54 mm	unknown			R-PDIP-T24	16	不合格	COMMERCIAL	15 ns	PAL-TYPE	20	4 DEDICATED INPUTS, 16 I/O		EE PLD		MACROCELL			4		160
PALCE610H-15PC	Rochester Electronics LLC	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	50 MHz	16	75 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	5.25 V	4.75 V	5 V	活跃	ROCHESTER ELECTRONICS INC	DIP	DIP,				未说明				DUAL	THROUGH-HOLE		2.54 mm	unknown		24	R-PDIP-T24		COMMERCIAL	商业扩展	15 ns			4 DEDICATED INPUTS, 16 I/O	5.08 mm	EE PLD		MACROCELL			4			30.734 mm	7.62 mm
PZ5032I10A44-T	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	QCCJ,	59 MHz	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	Obsolete	XILINX INC	LPCC					32 MACROCELLS	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	INDUSTRIAL	12.5 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
PZ5064I12BB1-S	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	无	Obsolete	XILINX INC	QFP	14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100	67 MHz	3	64	85 °C	-40 °C	PLASTIC/EPOXY	QFP	QFP100,.7X.9	RECTANGULAR	FLATPACK	5.5 V	4.5 V	5 V	e0			锡铅	64 MACROCELLS	8542.39.00.01	TRAY	QUAD	鸥翼	225	0.65 mm	not_compliant	30	100	R-PQFP-G100		不合格	INDUSTRIAL	14.5 ns			2 DEDICATED INPUTS, 64 I/O	3.4 mm	EE PLD		MACROCELL	64	NO	2	NO		20 mm	14 mm
PZ5064I12BB1-S	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	RECTANGULAR	QFP100,.7X.9	QFP	PLASTIC/EPOXY	-40 °C	85 °C	无	Transferred	飞利浦半导体	QFP, QFP100,.7X.9	5 V	FLATPACK	e0			Tin/Lead (Sn/Pb)	NO	8542.39.00.01	TRAY	QUAD	鸥翼		0.635 mm	unknown			R-PQFP-G100		不合格	INDUSTRIAL	14.5 ns					EE PLD			64	NO		NO
PZ5128-S10BP	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	PLASTIC/EPOXY	QFP	TQFP100,.63SQ	SQUARE	FLATPACK	5 V	无	Obsolete	XILINX INC	QFP, TQFP100,.63SQ	3	70 °C					YES	8542.39.00.01		QUAD	鸥翼	240	0.5 mm	unknown	30		S-PQFP-G100		不合格	COMMERCIAL	12 ns					EE PLD			128	YES		YES
PZ5128-S10BP	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	71 MHz	80	70 °C	PLASTIC/EPOXY	TFQFP	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	5.25 V	4.75 V	5 V	Obsolete	NXP SEMICONDUCTORS	QFP	14 X 14 X 1 MM, PLASTIC, SOT-386-1, TQFP-100						8542.39.00.01		QUAD	鸥翼		0.5 mm	unknown		100	S-PQFP-G100		不合格	COMMERCIAL	12 ns			2 DEDICATED INPUTS, 80 I/O	1.2 mm	EE PLD		MACROCELL			2			14 mm	14 mm
XC7272-25PC84I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	PLASTIC/EPOXY	QCCJ	LDCC84,1.2SQ	SQUARE	CHIP CARRIER	5 V	无	Obsolete	XILINX INC	3	85 °C	-40 °C	e0			锡铅	NO	8542.39.00.01		QUAD	J BEND	225	1.27 mm	unknown	30		S-PQCC-J84		不合格	INDUSTRIAL	40 ns					OT PLD			72	NO		NO
EP20K200ERI208	Altera Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	1.8 V	无	Obsolete	ALTERA CORP	QFP	HFQFP,	134	PLASTIC/EPOXY	e3			哑光锡		8542.39.00.01		QUAD	鸥翼	220	0.5 mm	compliant		208	S-PQFP-G208		不合格					4 DEDICATED INPUTS, 134 I/O	4.1 mm	可加载 PLD		MACROCELL			4			28 mm	28 mm
EP1800LI-2	Altera Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	68	Obsolete	ALTERA CORP	LCC	QCCJ, LDCC68,1.0SQ	20.8 MHz	48	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	无	e0	无		锡铅	48 MACROCELLS	8542.39.00.01		QUAD	J BEND	220	1.27 mm	unknown		68	S-PQCC-J68		不合格	INDUSTRIAL	70 ns			12 DEDICATED INPUTS, 48 I/O		OT PLD		MACROCELL	48	NO	12	NO		24.2316 mm	24.2316 mm
PZ3064DS10BC	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	-40 °C	PLASTIC/EPOXY	QFP	TQFP44,.47SQ,32	SQUARE	FLATPACK	无	Obsolete	XILINX INC	QFP, TQFP44,.47SQ,32	3	85 °C					YES	8542.39.00.01		QUAD	鸥翼	240	0.8 mm	unknown	30		S-PQFP-G44		不合格	INDUSTRIAL	11.5 ns					EE PLD			64	YES		YES
PAL10H8MJ/883B	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	20	DIP	DIP20,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	ADVANCED MICRO DEVICES INC	DIP	0.250 X 1 INCH, CERAMIC, DIP-20	125 °C	-55 °C	无	Obsolete	CERAMIC, METAL-SEALED COFIRED	e0		3A001.A.2.C	锡铅		8542.39.00.01		DUAL	THROUGH-HOLE		2.54 mm	unknown		20	R-CDIP-T20	8	不合格	MILITARY	45 ns	PAL-TYPE	10	10 DEDICATED INPUTS, 0 I/O	4.318 mm	OT PLD	38535Q/M;38534H;883B	COMBINATORIAL			10		16	25.908 mm	7.62 mm
PZ5128IS15A84	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	PEDESTAL, PLASTIC, SOT-189-3, LCC-84	63 MHz	64	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	Obsolete	NXP SEMICONDUCTORS	LCC						8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		84	S-PQCC-J84		不合格	INDUSTRIAL	17.5 ns			2 DEDICATED INPUTS, 64 I/O	4.57 mm	EE PLD		MACROCELL			2			29.3116 mm	29.3116 mm
TIBPAL20L8-20MJT	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	Obsolete	TEXAS INSTRUMENTS INC	DIP	DIP, DIP24,.3	28.5 MHz	6	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP24,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无			3A001.A.2.C			8542.39.00.01	TUBE	DUAL	THROUGH-HOLE		2.54 mm	not_compliant		24	R-GDIP-T24	8	不合格	MILITARY	25 ns	PAL-TYPE	20	14 DEDICATED INPUTS, 6 I/O	5.08 mm	OT PLD		COMBINATORIAL			14		64	32.005 mm	7.62 mm
PZ5064-7A68-T	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	68	48	70 °C	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	Transferred	NXP SEMICONDUCTORS	QCCJ,	105 MHz						8542.39.00.01		QUAD	J BEND		1.27 mm	unknown			S-PQCC-J68		不合格	COMMERCIAL	10 ns			2 DEDICATED INPUTS, 48 I/O	4.57 mm	EE PLD		MACROCELL			2			24.2316 mm	24.2316 mm
XH95288-10HQ208C	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5 V	无	Obsolete	ADVANCED MICRO DEVICES INC	HEAT SINK, QFP-208	3	168	PLASTIC/EPOXY	e0			锡铅				QUAD	鸥翼		0.5 mm	compliant			S-PQFP-G208		不合格					0 DEDICATED INPUTS, 168 I/O	4.1 mm	MASK PLD		MACROCELL						28 mm	28 mm
XH95288-10HQ208C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	168	PLASTIC/EPOXY	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5 V	无	Transferred	XILINX INC	QFP	HEAT SINK, QFP-208	3	e0	无		锡铅		8542.39.00.01		QUAD	鸥翼		0.5 mm	compliant		208	S-PQFP-G208		不合格					0 DEDICATED INPUTS, 168 I/O	4.1 mm	MASK PLD		MACROCELL						28 mm	28 mm
XC9536F-5PCG44C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	Obsolete	XILINX INC	LCC	QCCJ,	100 MHz	3	34	70 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	有	e3			Matte Tin (Sn)		8542.39.00.01		QUAD	J BEND	245	1.27 mm	compliant	30	44	S-PQCC-J44		不合格	COMMERCIAL	5 ns			0 DEDICATED INPUTS, 34 I/O	4.572 mm	闪存 PLD		MACROCELL						16.5862 mm	16.5862 mm
PAL20X8AMJS/883B	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	Obsolete	ADVANCED MICRO DEVICES INC	DIP	DIP, DIP24,.3	15.4 MHz	2	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP24,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无	e0		3A001.A.2.C	锡铅		8542.39.00.01		DUAL	THROUGH-HOLE		2.54 mm	unknown		24	R-GDIP-T24	10	不合格	MILITARY	35 ns	PAL-TYPE	12	10 DEDICATED INPUTS, 2 I/O		OT PLD	38535Q/M;38534H;883B	MIXED			10		40
PZ5064I10A44-T	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	Transferred	NXP SEMICONDUCTORS	QCCJ,	77 MHz						8542.39.00.01		QUAD	J BEND		1.27 mm	unknown			S-PQCC-J44		不合格	INDUSTRIAL	12.5 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
XCR3032-12PC44I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	QCCJ,	47 MHz	33	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	3.6 V	3 V	3.3 V	Obsolete	XILINX INC	LCC						8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	INDUSTRIAL	15 ns			2 DEDICATED INPUTS, 33 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
XC95288XV-5CS280C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	280	Obsolete	XILINX INC	BGA	PLASTIC, CSP-280	222 MHz	3	192	70 °C	PLASTIC/EPOXY	TFBGA	BGA280,19X19,32	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	2.62 V	2.37 V	2.5 V	无	e0			Tin/Lead (Sn63Pb37)	YES	8542.39.00.01		BOTTOM	BALL	240	0.8 mm	not_compliant	30	280	S-PBGA-B280		不合格	COMMERCIAL	5 ns			0 DEDICATED INPUTS, 192 I/O	1.2 mm	闪存 PLD		MACROCELL	288	YES		YES		16 mm	16 mm
PALCE22V10H-15PC/5	Vantis Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	5 V	10	58.8 MHz	VANTIS CORP	Obsolete	无	70 °C	PLASTIC/EPOXY	DIP	DIP24,.3	RECTANGULAR	IN-LINE	e0			锡铅				DUAL	THROUGH-HOLE		2.54 mm	unknown			R-PDIP-T24	10	不合格	COMMERCIAL	15 ns	PAL-TYPE	22	12 DEDICATED INPUTS, 10 I/O		EE PLD		MACROCELL			12		132
CY7C331-20WC	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28	CYPRESS SEMICONDUCTOR CORP	DIP	0.300 INCH, WINDOWED, SLIM, CERDIP-28	27 MHz	12	70 °C	CERAMIC, GLASS-SEALED	DIP	DIP28,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无	Obsolete	e0			锡铅	ASYNCHRONOUS REGISTERED; 12 I/O MACROCELLS; VARIABLE PRODUCT TERMS	8542.39.00.01		DUAL	THROUGH-HOLE		2.54 mm	not_compliant		28	R-GDIP-T28	12	不合格	COMMERCIAL	25 ns	PAL-TYPE	25	12 DEDICATED INPUTS, 12 I/O		UV PLD		MACROCELL			12		192
EPM2210F256I3	Altera Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256	SQUARE	网格排列	无	Transferred	ALTERA CORP	BGA, BGA256,16X16,40	3	PLASTIC/EPOXY	BGA	BGA256,16X16,40	e0	无		锡铅	YES	8542.39.00.01		BOTTOM	BALL	220	1 mm	compliant			S-PBGA-B256		不合格		7 ns					闪存 PLD			1700	YES		YES