N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

PLASTIC/EPOXY

TQFP44,.47SQ,32

3.3 V

30

3 V

70 °C

无

EPM7032AETC44-7

138.9 MHz

LQFP

SQUARE

Intel Corporation

活跃

36

INTEL CORP

3.6 V

1.71

36

32

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e0

活跃

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.8 mm

compliant

EPM7032

S-PQFP-G44

36

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

PLA-TYPE

36

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

7.5ns

2

YES

1024

10 mm

10 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

2.5 V

30

2.375 V

无

EPM1270T144I5

LFQFP

SQUARE

Intel Corporation

活跃

116

INTEL CORP

2.625 V

1.37

116

980

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40°C ~ 100°C (TJ)

Tray

MAX® II

e0

活跃

3A991

Tin/Lead (Sn/Pb)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

compliant

EPM1270

S-PQFP-G144

不合格

1.5/3.3,2.5/3.3 V

系统内可编程

10 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

980

YES

2.5V, 3.3V

6.2ns

1270

YES

20 mm

20 mm

N/A

-

表面贴装

256-BGA

256-FBGA (17x17)

212

980

-40°C ~ 100°C (TJ)

Tray

MAX® II

活跃

EPM1270

系统内可编程

2.5V, 3.3V

6.2ns

1270

N/A

-

表面贴装

100-LBGA

YES

100-FBGA (11x11)

100

BGA100,10X10,40

2.5 V

40

2.375 V

85 °C

有

EPM240F100C4N

LBGA

SQUARE

Intel Corporation

活跃

80

INTEL CORP

2.625 V

1.37

80

192

LBGA, BGA100,10X10,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM240

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

6.1 ns

0 DEDICATED INPUTS, 80 I/O

1.7 mm

闪存 PLD

MACROCELL

192

YES

2.5V, 3.3V

4.7ns

240

YES

11 mm

11 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

30

2.375 V

85 °C

无

EPM240T100C5

TFQFP

SQUARE

Intel Corporation

活跃

80

CPLD - Complex Programmable Logic Devices CPLD - MAX II 192 Macro 80 IOs

INTEL CORP

2.625 V

1.37

80

192

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

EAR99

Tin/Lead (Sn/Pb)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.5 mm

compliant

EPM240

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

商业扩展

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 80 I/O

1.2 mm

闪存 PLD

MACROCELL

192

YES

2.5V, 3.3V

4.7ns

240

YES

14 mm

14 mm

N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

PLASTIC/EPOXY

TQFP44,.47SQ,32

3.3 V

40

3 V

70 °C

有

EPM7032AETC44-10N

103.1 MHz

LQFP

SQUARE

Altera Corporation

Transferred

36

ALTERA CORP

3.6 V

3.67

QFP

36

32

TQFP-44

FLATPACK, LOW PROFILE

3

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e3

有

活跃

EAR99

Matte Tin (Sn) - annealed

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.8 mm

unknown

EPM7032

44

S-PQFP-G44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

10.0ns

2

YES

10 mm

10 mm

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

BGA256,16X16,40

2.5 V

40

2.375 V

85 °C

有

EPM2210F256C3N

BGA

SQUARE

Intel Corporation

活跃

204

INTEL CORP

2.625 V

1.2

204

1700

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

3A991

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM2210

S-PBGA-B256

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

7 ns

0 DEDICATED INPUTS, 204 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

2.5V, 3.3V

7.0ns

2210

YES

17 mm

17 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

PLASTIC/EPOXY

LDCC44,.7SQ

3.3 V

40

3 V

70 °C

有

EPM7032AELC44-10N

103.1 MHz

QCCJ

SQUARE

Intel Corporation

活跃

36

Altera EPM7032AELC44-10N, CPLD MAX 7000A EEPROM 32 Cells, 36 I/O, 2 Labs, ISP, 44-Pin PLCC

INTEL CORP

3.6 V

0.94

36

32

QCCJ, LDCC44,.7SQ

CHIP CARRIER

3

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e3

活跃

EAR99

Matte Tin (Sn)

32 MACROCELLS; 2 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

245

1.27 mm

compliant

EPM7032

S-PQCC-J44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 36 I/O

4.57 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

10.0ns

2

YES

16.5862 mm

16.5862 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

QFP144,.87SQ,20

2.5 V

40

2.375 V

85 °C

有

EPM570T144C4N

LFQFP

SQUARE

Intel Corporation

活跃

116

INTEL CORP

2.625 V

1.18

116

440

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

MATTE TIN (472) OVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM570

S-PQFP-G144

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

7 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

20 mm

20 mm

N/A

-

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

ALTERA CORP

64

Obsolete

Altera Corporation

SQUARE

QCCJ

166.7 MHz

EPM7096LC84-7

无

70 °C

4.75 V

40

5 V

LDCC84,1.2SQ

PLASTIC/EPOXY

CHIP CARRIER

PLASTIC, LCC-84

68

96

LCC

8.61

5.25 V

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

有

Obsolete

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

245

1.27 mm

unknown

EPM7096

84

S-PQCC-J84

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

7.5 ns

0 DEDICATED INPUTS, 64 I/O

5.08 mm

EE PLD

1800

MACROCELL

96

NO

4.75 V ~ 5.25 V

7.5ns

6

NO

29.3116 mm

29.3116 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

PLASTIC/EPOXY

LDCC44,.7SQ

5 V

30

4.75 V

70 °C

无

EPM7064SLC44-10

125 MHz

QCCJ

SQUARE

Intel Corporation

Obsolete

36

Programmable Logic Device

INTEL CORP

5.25 V

7.63

36

64

PLASTIC, LCC-44

CHIP CARRIER

1

0°C ~ 70°C (TA)

Tube

MAX® 7000S

e0

Obsolete

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

220

1.27 mm

compliant

EPM7064

S-PQCC-J44

不合格

5 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 36 I/O

4.572 mm

EE PLD

1250

MACROCELL

64

YES

4.75 V ~ 5.25 V

10.0ns

4

YES

16.5862 mm

16.5862 mm

N/A

-

表面贴装

44-LCC (J-Lead)

44-PLCC (16.59x16.59)

AMD

34

Tube

72

XC9572XL

Obsolete

0°C ~ 70°C (TA)

XC9500XL

In System Programmable (min 10K program/erase cycles)

1600

3V ~ 3.6V

7.5 ns

4

N/A

-

表面贴装

208-BFQFP Exposed Pad

208-PQFP (28x28)

AMD

166

Tray

216

XC95216

Obsolete

0°C ~ 70°C (TA)

XC9500

In System Programmable (min 10K program/erase cycles)

4800

4.75V ~ 5.25V

20 ns

12

N/A

-

表面贴装

44-TQFP

44-VQFP (10x10)

AMD

34

Tray

36

XC9536

Obsolete

0°C ~ 70°C (TA)

XC9500

In System Programmable (min 10K program/erase cycles)

800

4.75V ~ 5.25V

6 ns

2

N/A

-

表面贴装

44-LCC (J-Lead)

44-PLCC (16.59x16.59)

AMD

XC9572XL

72

Tube

34

Obsolete

-40°C ~ 85°C (TA)

XC9500XL

In System Programmable (min 10K program/erase cycles)

1600

3V ~ 3.6V

10 ns

4

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

AMD

180

Bulk

512

XCR3512

Obsolete

0°C ~ 70°C (TA)

CoolRunner XPLA3

In System Programmable (min 1K program/erase cycles)

12000

3V ~ 3.6V

7 ns

32

N/A

• 1: ¥3.026427
• 10: ¥2.855119
• 100: ¥2.693510
• 500: ¥2.541046
查看所有的价格

-

表面贴装

14-UFQFN

14-STQFN (2x2.2)

Renesas Design Germany GmbH

11

Tape & Reel (TR)

26

活跃

MSL 1 - Unlimited

-40°C ~ 85°C (TA)

-

OTP

1.71V ~ 1.89V, 3V ~ 3.6V, 4.5V ~ 5.5V

N/A

-

N/A

• 1: ¥4.035322
• 10: ¥3.806907
• 100: ¥3.591423
• 500: ¥3.388133
查看所有的价格

-

表面贴装

20-UFQFN

20-STQFN (2x3)

Renesas Design Germany GmbH

16

Tape & Reel (TR)

1

活跃

MSL 1 - Unlimited

-40°C ~ 85°C (TA)

-

OTP

2

1.71V ~ 1.89V, 3V ~ 3.6V, 4.5V ~ 5.5V

N/A

-

表面贴装

48-TQFP

YES

48

INTEL CORP

5.37

36

32

QFP, QFP48(UNSPEC)

FLATPACK

PLASTIC

QFP48(UNSPEC)

未说明

无

EPM7032BTC48-7

QFP

Intel Corporation

Obsolete

0°C ~ 70°C (TA)

Bulk

MAX® 7000B

e0

Obsolete

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

未说明

compliant

不合格

1.8/3.3,2.5 V

系统内可编程

7.5 ns

EE PLD

600

32

YES

2.375 V ~ 2.625 V

7.5ns

2

YES

N/A

-

表面贴装

256-BGA

256-FBGA (17x17)

100

128

-40°C ~ 85°C (TA)

Tray

MAX® 7000B

Obsolete

EPM7128

系统内可编程

2500

2.375 V ~ 2.625 V

7.5ns

8

N/A

-

表面贴装

44-LCC (J-Lead)

44-PLCC (16.59x16.59)

AMD

34

Tube

36

XC9536XL

Obsolete

0°C ~ 70°C (TA)

XC9500XL

In System Programmable (min 10K program/erase cycles)

800

3V ~ 3.6V

10 ns

2

N/A

-

表面贴装

160-LQFP

160-TQFP (24x24)

Infineon Technologies

133

Tray

128

CY37128

Obsolete

-40°C ~ 85°C (TA)

Ultra37000™

In-System Reprogrammable™ (ISR™) CMOS

3V ~ 3.6V

10 ns

N/A

-

表面贴装

44-LCC (J-Lead)

44-PLCC (16.6x16.6)

Atmel

32

Tube

32

Obsolete

0°C ~ 70°C (TA)

ATF15xx

In System Programmable (min 100 program/erase cycles)

4.75V ~ 5.25V

10 ns

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

AMD

172

Tray

384

XCR3384

Obsolete

-40°C ~ 85°C (TA)

CoolRunner XPLA3

In System Programmable (min 1K program/erase cycles)

9000

2.7V ~ 3.6V

9 ns

24