类别是'category.PLDs(可编程逻辑器件)' (2797)

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图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

产品条款数量

长度

宽度

PLUS20L8DA
PLUS20L8DA
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

PLASTIC/EPOXY

QCCJ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

NXP SEMICONDUCTORS

QCCJ,

6

75 °C

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J28

不合格

商业扩展

10 ns

14 DEDICATED INPUTS, 6 I/O

4.57 mm

OT PLD

COMBINATORIAL

14

11.505 mm

11.505 mm

XC95108F-15PCG84I
XC95108F-15PCG84I
AMD Xilinx 数据表

463 In Stock

-

最小起订量: 1

最小包装量: 1

YES

84

Obsolete

XILINX INC

LCC

QCCJ,

56 MHz

3

69

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

e3

哑光锡

8542.39.00.01

QUAD

J BEND

1.27 mm

compliant

84

S-PQCC-J84

不合格

INDUSTRIAL

15 ns

0 DEDICATED INPUTS, 69 I/O

5.08 mm

闪存 PLD

MACROCELL

29.3116 mm

29.3116 mm

PZ3064-12A68
PZ3064-12A68
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

68

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

3.3 V

Transferred

飞利浦半导体

QCCJ, LDCC68,1.0SQ

70 °C

PLASTIC/EPOXY

QCCJ

e0

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J68

不合格

COMMERCIAL

14.5 ns

EE PLD

64

NO

NO

PZ3064-12A68
PZ3064-12A68
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

68

CHIP CARRIER

SQUARE

LDCC68,1.0SQ

QCCJ

PLASTIC/EPOXY

70 °C

48

67 MHz

PEDESTAL, PLASTIC, SOT-188-3, LCC-68

LCC

NXP SEMICONDUCTORS

Obsolete

3.3 V

2.97 V

3.63 V

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

68

S-PQCC-J68

不合格

COMMERCIAL

14.5 ns

2 DEDICATED INPUTS, 48 I/O

4.57 mm

EE PLD

MACROCELL

2

24.2316 mm

24.2316 mm

PZ3064-12A68
PZ3064-12A68
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

68

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

QCCJ, LDCC68,1.0SQ

3

70 °C

e0

Tin/Lead (Sn85Pb15)

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J68

不合格

COMMERCIAL

14.5 ns

EE PLD

64

NO

NO

PAL22V10C-10JC
PAL22V10C-10JC
Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

CYPRESS SEMICONDUCTOR CORP

QLCC

PLASTIC, LCC-28

90 MHz

10

70 °C

PLASTIC/EPOXY

QCCJ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

e0

锡铅

10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

28

S-PQCC-J28

10

不合格

COMMERCIAL

10 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

4.57 mm

OT PLD

MACROCELL

11

132

11.5316 mm

11.5316 mm

XCR3064-12PC44C
XCR3064-12PC44C
AMD Xilinx 数据表

636 In Stock

-

最小起订量: 1

最小包装量: 1

YES

44

Obsolete

XILINX INC

LCC

PLASTIC, LCC-44

67 MHz

3

32

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.6 V

2.97 V

3.3 V

e0

锡铅

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

44

S-PQCC-J44

不合格

COMMERCIAL

12 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

64

NO

2

NO

16.5862 mm

16.5862 mm

PLUS173BN
PLUS173BN
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

IN-LINE

5 V

Transferred

飞利浦半导体

70 °C

PLASTIC/EPOXY

DIP

DIP24,.3

RECTANGULAR

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T24

10

不合格

COMMERCIAL

15 ns

PLA-TYPE

22

OT PLD

42

PLUS173BN
PLUS173BN
YAGEO Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

飞利浦组件

,

10

75 °C

PLASTIC/EPOXY

RECTANGULAR

8542.39.00.01

DUAL

THROUGH-HOLE

unknown

R-PDIP-T24

不合格

商业扩展

15 ns

12 DEDICATED INPUTS, 10 I/O

OT PLD

COMBINATORIAL

12

XC95144-7PQG100
XC95144-7PQG100
AMD Xilinx 数据表

359 In Stock

-

最小起订量: 1

最小包装量: 1

YES

100

81

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

5 V

Obsolete

XILINX INC

QFP

QFP,

3

e3

哑光锡

CONFIGURABLE 3.3V OR 5V I/O OPERATION; INSYSTEM PROGRAMMABLE

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

100

R-PQFP-G100

不合格

0 DEDICATED INPUTS, 81 I/O

3.4 mm

闪存 PLD

MACROCELL

20 mm

14 mm

XC95108F-7PCG84C
XC95108F-7PCG84C
AMD Xilinx 数据表

742 In Stock

-

最小起订量: 1

最小包装量: 1

YES

84

XILINX INC

LCC

QCCJ,

83 MHz

3

69

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

e3

哑光锡

8542.39.00.01

QUAD

J BEND

245

1.27 mm

compliant

30

84

S-PQCC-J84

不合格

COMMERCIAL

7.5 ns

0 DEDICATED INPUTS, 69 I/O

5.08 mm

闪存 PLD

MACROCELL

29.3116 mm

29.3116 mm

PEEL18CV8ZJI-25
PEEL18CV8ZJI-25
Anachip Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

CHIP CARRIER

SQUARE

LDCC20,.4SQ

QCCJ

PLASTIC/EPOXY

-40 °C

85 °C

33.3 MHz

Transferred

ANACHIP CORP

QCCJ, LDCC20,.4SQ

5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J20

8

不合格

INDUSTRIAL

25 ns

PAL-TYPE

18

EE PLD

MACROCELL

113

PEEL18CV8ZJI-25
PEEL18CV8ZJI-25
Diodes Incorporated 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

Obsolete

DIODES INC

QLCC

QCCJ, LDCC20,.4SQ

33.3 MHz

8

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

e0

EAR99

锡铅

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

20

S-PQCC-J20

8

不合格

INDUSTRIAL

25 ns

PAL-TYPE

18

9 DEDICATED INPUTS, 8 I/O

4.369 mm

EE PLD

MACROCELL

9

113

8.9662 mm

8.9662 mm

PALCE22V10-10JC/5
PALCE22V10-10JC/5
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

PALCE22V10-15PC
PALCE22V10-15PC
Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

CYPRESS SEMICONDUCTOR CORP

DIP

0.300 INCH, PLASTIC, DIP-24

55.5 MHz

10

75 °C

PLASTIC/EPOXY

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

e0

锡铅

10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

24

R-PDIP-T24

10

不合格

商业扩展

15 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

4.826 mm

闪存 PLD

MACROCELL

11

132

30.099 mm

7.62 mm

XCR5064-7PC68C
XCR5064-7PC68C
AMD Xilinx 数据表

373 In Stock

-

最小起订量: 1

最小包装量: 1

YES

68

Obsolete

XILINX INC

LCC

QCCJ, LDCC68,1.0SQ

105 MHz

1

48

70 °C

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

68

S-PQCC-J68

不合格

COMMERCIAL

7.5 ns

2 DEDICATED INPUTS, 48 I/O

5.08 mm

EE PLD

MACROCELL

64

NO

2

NO

24.2316 mm

24.2316 mm

PAL16L8J/883C
PAL16L8J/883C
Lattice Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

PZ5064N12BP
PZ5064N12BP
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

XILINX INC

67 MHz

3

64

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

Transferred

e0

锡铅

YES

8542.39.00.01

QUAD

鸥翼

240

0.5 mm

not_compliant

30

S-PQFP-G100

64

不合格

INDUSTRIAL

14.5 ns

PAL/PLA-TYPE

68

2 DEDICATED INPUTS, 64 I/O

EE PLD

64

YES

2

YES

14 mm

14 mm

PZ5064N12BP
PZ5064N12BP
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

TFQFP,

67 MHz

64

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

5.5 V

4.5 V

5 V

Obsolete

NXP SEMICONDUCTORS

QFP

64 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

100

S-PQFP-G100

不合格

INDUSTRIAL

14.5 ns

2 DEDICATED INPUTS, 64 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

PZ5064N12BP
PZ5064N12BP
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

5 V

Transferred

飞利浦半导体

QFP, TQFP100,.63SQ

85 °C

-40 °C

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G100

不合格

INDUSTRIAL

14.5 ns

EE PLD

64

YES

YES

EP900IPI-60
EP900IPI-60
Altera Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

40

85 °C

-40 °C

PLASTIC

DIP

DIP40,.6

RECTANGULAR

IN-LINE

5 V

Obsolete

ALTERA CORP

DIP, DIP40,.6

16.7 MHz

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

220

2.54 mm

unknown

R-PDIP-T40

24

不合格

INDUSTRIAL

60 ns

PAL-TYPE

36

MACROCELL

240

PZ5064C10A44
PZ5064C10A44
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

80 MHz

3

32

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Transferred

XILINX INC

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

32

不合格

COMMERCIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

16.585 mm

16.585 mm

PZ3128-S15BP-T
PZ3128-S15BP-T
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

70 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

Transferred

NXP SEMICONDUCTORS

TFQFP,

59 MHz

80

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G100

不合格

COMMERCIAL

17.5 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

PZ3064AS7A44
PZ3064AS7A44
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

70 °C

PLASTIC/EPOXY

QCCJ

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

9 ns

EE PLD

64

YES

YES

XC95576-12BGG432C
XC95576-12BGG432C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

432

LBGA,

3

232

70 °C

PLASTIC/EPOXY

LBGA

BGA432,31X31,50

SQUARE

GRID ARRAY, LOW PROFILE

5 V

Obsolete

XILINX INC

BGA

e1

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1.27 mm

compliant

未说明

432

S-PBGA-B432

不合格

COMMERCIAL

12 ns

232 I/O

1.7 mm

闪存 PLD

MACROCELL

40 mm

40 mm