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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量												厂商																												操作温度	包装	系列	JESD-609代码	无铅代码	零件状态	端子表面处理	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	产品类别	速度等级	主要属性	逻辑单元数
XCVC1702-2MLEVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	AMD	活跃				500	Tray			Versal™ AI Core																			600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1M Logic Cells			-
AGFB006R16A2E4F	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			384	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 573K Logic Elements			-
AGFA014R24C2E4F	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			744	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 1.4M Logic Elements			-
LH7A404N0F000B2，55	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1
10AS032E3F29E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780	320000 LE	1	SMD/SMT	40000 LAB	964974	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032E3F29E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	0°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B780	360	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	360	3.35 mm	现场可编程门阵列	SoC FPGA		FPGA - 320K Logic Elements	320000	2 Core	--	SoC FPGA	29 mm	29 mm
10AS032H2F34E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	320000 LE	1	SMD/SMT	40000 LAB	965002	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032H2F34E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	0°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B1152	384	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.65 mm	现场可编程门阵列	SoC FPGA		FPGA - 320K Logic Elements	320000	2 Core	--	SoC FPGA	35 mm	35 mm
10AS032H4F35E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	320000 LE	1	SMD/SMT	40000 LAB	964979	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032H4F35E3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	0°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B1152	384	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.5 mm	现场可编程门阵列	SoC FPGA		FPGA - 320K Logic Elements	320000	2 Core	--	SoC FPGA	35 mm	35 mm
AGIB022R31B2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			720	Tray	活跃	-40°C ~ 100°C (TJ)		Agilex I																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.2M Logic Elements			-
XCZU3EG-1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	XCZU3	活跃			82	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			-
1SX065HH2F35I2VG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	Intel			392	Tray	活跃	-40°C ~ 100°C (TJ)		Stratix® 10 SX																			1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						FPGA - 650K Logic Elements			-
XCZU2EG-L1UBVA530I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	AMD 赛灵思	活跃	2 x 32 kB, 4 x 32 kB	103320 LE	+ 100 C	- 40 C	SMD/SMT	2 x 32 kB, 4 x 32 kB	256 kB			82	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																850 mV			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells		7 Core	-
10AS032E2F29I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965056	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	5.45	0.93 V	INTEL CORP	活跃	SQUARE	BGA	10AS032E2F29I2SG		360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B780	360	不合格		0.9 V	INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	360	3.35 mm	现场可编程门阵列	SoC FPGA		FPGA - 320K Logic Elements	320000	2 Core	--	SoC FPGA	29 mm	29 mm
XC7Z015-2CLG485E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	485-LFBGA, CSPBGA	485-CSPBGA (19x19)	AMD	XC7Z015	活跃			130	Tray	0°C ~ 100°C (TJ)		Zynq®-7000																			766MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Artix™-7 FPGA, 74K Logic Cells			-
XCVC1702-2MLINSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD					500	Tray	活跃			Versal™ AI Core																			600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1M Logic Cells			-
AGFA014R24C3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			744	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 1.4M Logic Elements			-
XCZU2CG-1UBVA530I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	AMD			82	Tray	活跃	-40°C ~ 100°C (TJ)		-																			500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
AGFD023R25A3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			480	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.3M Logic Elements			-
AGFA027R25A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			624	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.7M Logic Elements			-
XCVC1802-2LSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思			770	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ AI Core																			450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVM1802-2LLEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思			770	活跃	0°C ~ 100°C (TJ)																					450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.9M Logic Cells			-
XCZU9CG-1FFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	XCZU9	活跃			204	Tray	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																			500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					1	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells			-
M2S005S-1VFG256T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LBGA	256-FPBGA (17x17)	微芯片技术	MICROSEMI CORP	5.8			161	Tray	M2S005	活跃	,	40	有	M2S005S-1VFG256T2	Microsemi Corporation	活跃	-40°C ~ 125°C (TJ)		Automotive, AEC-Q100, SmartFusion®2	e1	有		Tin/Silver/Copper (Sn/Ag/Cu)						250		compliant							166MHz	64KB	ARM® Cortex®-M3	-		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			现场可编程门阵列		1	FPGA - 5K Logic Modules			128KB
A2F500M3G-1PQG208	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	208-BFQFP	208-PQFP (28x28)	微芯片技术	A2F500	活跃			MCU - 22, FPGA - 66	Tray	0°C ~ 85°C (TJ)		SmartFusion®																			100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		Ethernet, I²C, SPI, UART/USART	MCU, FPGA					1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops			512KB
XCZU4CG-L2SFVC784E	AMD	数据表	333 In Stock	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	XCZU4	活跃			252	Tray	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																			500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					2L	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
XCZU17EG-1FFVD1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD			308	Tray	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 926K+ Logic Cells			-