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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量																	厂商																																										操作温度	包装	系列	JESD-609代码	类型	端子表面处理	附加功能	HTS代码	电容量	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	频率	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	电源	温度等级	界面	内存大小	速度	内存大小	核心处理器
XC7Z030-1SB485I	AMD	数据表	2199 In Stock	1: ¥3,191.024420 10: ¥3,010.400399 100: ¥2,840.000376 500: ¥2,679.245637 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-FBGA, FCBGA	484-FCBGA (19x19)	AMD	XC7Z030	活跃	Industrial grade					125,000	FCBGA	1.0000 V	0.95 V	130	1.05 V	表面贴装	130	Bulk	-40 to 100 °C		Zynq®-7000						10 pF											485							667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Industrial		1				Kintex™-7 FPGA, 125K Logic Cells			157,200					-		2 mm	2 x 1.25 x 1.45
XCZU48DR-1FSVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	Tray	活跃					561	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																								500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells								-
M2S050TS-FGG484I	Microchip	数据表	2524 In Stock	1: ¥1,880.746441 10: ¥1,774.289093 100: ¥1,673.857635 500: ¥1,579.110975 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术	267	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	1.14 V	有	M2S050TS-FGG484I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.82		Non-Compliant	-40°C ~ 100°C (TJ)		SmartFusion®2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		现场可编程门阵列	CMOS		BOTTOM	BALL	250	1 mm	compliant		40		S-PBGA-B484	267	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列								FPGA - 50K Logic Modules				56340		1 Core	256KB				23 mm	23 mm
M2S060TS-FCSG325	Microchip	数据表	2314 In Stock	1: ¥1,309.983964 10: ¥1,235.833925 100: ¥1,165.881064 500: ¥1,099.887799 查看所有的价格 -	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	微芯片技术		200	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S060TS-FCSG325	TFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81		0°C ~ 85°C (TJ)		SmartFusion®2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01		现场可编程门阵列	CMOS		BOTTOM	BALL	250	0.5 mm	compliant				S-PBGA-B325	200	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列								FPGA - 60K Logic Modules				56520		1 Core	256KB				11 mm	11 mm
M2S050T-FG896I	Microchip	数据表	2311 In Stock	1: ¥1,525.401338 10: ¥1,439.057866 100: ¥1,357.601759 500: ¥1,280.756375 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	896-BGA	YES	896-FBGA (31x31)	896	微芯片技术		Non-Compliant	377	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB	BGA, BGA896,30X30,40	网格排列	3	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	30	1.14 V	无	M2S050T-FG896I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81	-40°C ~ 100°C (TJ)		SmartFusion®2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01		现场可编程门阵列	CMOS		BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B896	377	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	2.44 mm	现场可编程门阵列								FPGA - 50K Logic Modules				56340		1 Core	256KB				31 mm	31 mm
XCZU17EG-L2FFVC1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD	Tray	XCZU17	活跃					512	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																								533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								2L				Zynq®UltraScale+™ FPGA, 926K+ Logic Cells								-
M2S025TS-FG484I	Microchip	数据表	2239 In Stock	1: ¥1,332.693567 10: ¥1,257.258079 100: ¥1,186.092528 500: ¥1,118.955220 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	微芯片技术	267	Tray	M2S025	活跃	-	166 MHz	27696 LE	SMD/SMT	-	64 kB				Non-Compliant	-40°C ~ 100°C (TJ)		SmartFusion®2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA												FPGA - 25K Logic Modules							1 Core	256KB
BCM6750A2KFEBG	Broadcom	数据表	200 In Stock	1: ¥183.104383 10: ¥172.739987 100: ¥162.962249 500: ¥153.737973 查看所有的价格 -	最小起订量: 1 最小包装量: 1	-	-	-	Broadcom Limited	Details	Tray	活跃				420	Broadcom Limited	Broadcom / Avago	-		-		仅TxRx					Wireless & RF Modules		-						6GHz										-									WiFi模块	802.11a/b/g/-x		-		WiFi	-	-		I²S, SPI, PCI, UART, USB	-		-		1024QAM			WiFi Modules - 802.11
M2S060T-VF400I	Microchip	数据表	2923 In Stock	1: ¥1,696.389240 10: ¥1,600.367209 100: ¥1,509.780386 500: ¥1,424.321117 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	微芯片技术	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S060T-VF400I	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.88		Non-Compliant	207	Tray	-40°C ~ 100°C (TJ)		SmartFusion®2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01		现场可编程门阵列	CMOS		BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	207	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列								FPGA - 60K Logic Modules				56520		1 Core	256KB				17 mm	17 mm
M2S150T-FCV484I	Microchip	数据表	2600 In Stock	1: ¥1,765.291753 10: ¥1,665.369577 100: ¥1,571.103375 500: ¥1,482.172996 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	微芯片技术	活跃	-	166 MHz	146124 LE	-	64 kB	VFBGA-484	GRID ARRAY, FINE PITCH	5.81	1.26 V	MICROSEMI CORP	活跃	Microsemi Corporation	SQUARE	FBGA	M2S150T-FCV484I	无	1.14 V	30	1.2 V	BGA484,22X22,32	PLASTIC/EPOXY			273	Tray	M2S150	-40°C ~ 100°C (TJ)		SmartFusion®2	e0		Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01		现场可编程门阵列	CMOS		BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B484	273	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	273	3.15 mm	现场可编程门阵列								FPGA - 150K Logic Modules				146124		1 Core	512KB				19 mm	19 mm
M2S050-FG484I	Microchip	数据表	2847 In Stock	1: ¥936.178457 10: ¥883.187223 100: ¥833.195496 500: ¥786.033489 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	微芯片技术	56340 LE	60	SMD/SMT	4695 LAB	Microchip	Microchip Technology / Atmel	N	-	64 kB	267	Tray	M2S050	活跃					SMARTFUSION2	100C	Industrial	FPBGA	-40C to 100C	267	56340	65nm	1.26(V)	1.2(V)	无	1.14(V)	-40C	有	56340	表面贴装	有	This product may require additional documentation to export from the United States.	-	166 MHz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2							SOC - Systems on a Chip										484							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			SoC FPGA							FPGA - 50K Logic Modules							1 Core	256KB	SoC FPGA
AGFA012R24C3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃					744	0°C ~ 100°C (TJ)		Agilex F																								1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												FPGA - 1.2M Logic Elements								-
XCVC1702-2MLIVSVA2197	AMD	数据表	620 In Stock	1: ¥277,541.589404 10: ¥268,415.463637 25: ¥266,549.616325 50: ¥264,696.739149 查看所有的价格 -	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	Tray	活跃					608			Versal™ AI Core																								600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ AI Core FPGA, 1M Logic Cells								-
XCVM1302-2MSINBVB1024	AMD	数据表	871 In Stock	1: ¥36,536.355857 10: ¥35,334.966979 25: ¥35,089.341591 50: ¥34,845.423620 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD	Tray	活跃					316	-40°C ~ 100°C (TJ)		Versal™ Prime																								600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ Prime FPGA, 70k Logic Cells								-
XCVM1402-1LSINBVB1024	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD	Tray	活跃					424	-40°C ~ 100°C (TJ)		Versal™ Prime																								400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ Prime FPGA, 1.2M Logic Cells								-
XCVM1302-1LSEVSVD1760	AMD	数据表	628 In Stock	1: ¥31,427.874908 10: ¥30,394.463158 25: ¥30,183.180897 50: ¥29,973.367327 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	Tray	活跃					402	0°C ~ 100°C (TJ)		Versal™ Prime																								400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ Prime FPGA, 70k Logic Cells								-
XCVC1902-2HSIVIVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD	Tray	活跃					500	-40°C ~ 100°C (TJ)		Versal™ AI Core																								800MHz, 1.65GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ AI Core FPGA, 1.9M Logic Cells								-
QLS1046MN1T144AEQM	Teledyne LeCroy	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCZU57DR-1FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	活跃					-	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR																								500MHz, 1.2GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Zynq® UltraScale+™ RFSoC								-
XCZU1EG-L2SBVA484E	AMD	数据表	2154 In Stock	1: ¥3,019.267436 10: ¥2,848.365507 100: ¥2,687.137267 500: ¥2,535.035157 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	Tray	活跃					-	0°C ~ 100°C (TJ)		Zynq® UltraScale+™																							CAN/Serial I2C/SPI/U	533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		-	MPU, FPGA												-								-
XCZU2EG-L2UBVA530E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	AMD	Tray	活跃					82	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																								533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								-
XCVC1902-2MSIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	Tray	活跃					770	-40°C ~ 100°C (TJ)		Versal™ AI Core																								600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ AI Core FPGA, 1.9M Logic Cells								-
XCVM1302-1MSENSVF1369	AMD	数据表	801 In Stock	1: ¥23,442.877491 10: ¥22,672.028518 25: ¥22,514.427527 50: ¥22,357.922073 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD	Tray	活跃					316	0°C ~ 100°C (TJ)		Versal™ Prime																								600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ Prime FPGA, 70k Logic Cells								-
XCVC1502-2LLEVSVA2197	AMD	数据表	993 In Stock	1: ¥218,887.691440 10: ¥211,690.223829 25: ¥210,218.692979 50: ¥208,757.391243 查看所有的价格 -	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	Tray	活跃					500	0°C ~ 100°C (TJ)		Versal™ AI Core																								450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ AI Core FPGA, 800k Logic Cells								-
XCVM1802-2HSIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	500	Tray	活跃					0.906 V	-40 to 110 °C		Versal™ Prime																								800MHz, 1.65GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								2				Versal™ Prime FPGA, 1.9M Logic Cells								-