类别是'category.片上系统(SoC)' (7695)

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评级结果

XCZU3CG-L1UBVA530I
XCZU3CG-L1UBVA530I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

AMD

82

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU1CG-2SBVA484E
XCZU1CG-2SBVA484E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

-

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCVC1702-1LSENSVG1369
XCVC1702-1LSENSVG1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCVC1802-2MSIVSVA2197
XCVC1802-2MSIVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

QLS1046MN1T144AFN3
QLS1046MN1T144AFN3
Teledyne LeCroy 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XCVC1902-2MLEVSVD1760
XCVC1902-2MLEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU2EG-1UBVA530E
XCZU2EG-1UBVA530E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

AMD

82

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCVC1902-2MLEVIVA1596
XCVC1902-2MLEVIVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU42DR-2FSVE1156E
XCZU42DR-2FSVE1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 489K+ Logic Cells

-

5CSXFC4C6U23I7LN
5CSXFC4C6U23I7LN
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1206 (3216 Metric)

Cal-Chip Electronics, Inc.

活跃

10 V

2000 Hrs @ 125°C

5CSXFC4C6U23I7LN

Intel Corporation

活跃

INTEL CORP

5.79

Tape & Reel (TR)

-55°C ~ 125°C

Tray

TC

0.126 L x 0.063 W (3.20mm x 1.60mm)

±20%

活跃

Molded

47 µF

compliant

3Ohm

-

-

A

现场可编程门阵列

通用型

0.071 (1.80mm)

-

10AS027E4F29E3SG
10AS027E4F29E3SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-780

Polyurethane

Arria 10 SoC

Aearo Technologies LLC, a 3M company

Details

2 x 32 kB

-

Bag

活跃

360

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964927

Intel

Intel / Altera

0°C ~ 100°C (TJ)

Tray

ISOLOSS

10.00 L x 10.00 W (254.00mm x 254.00mm)

活跃

Black

SOC - Systems on a Chip

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

160 kg/m³

FPGA - 270K Logic Elements

2 Core

--

SoC FPGA

0.060 (1.52mm)

UL94 HBF

XCZU47DR-2FFVG1517E
XCZU47DR-2FFVG1517E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

561

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XC7Z014S-2CLG484E
XC7Z014S-2CLG484E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

Amphenol Socapex

Box

USBFTVX7

活跃

1.0000 V

0.95 V

1.05 V

200

0 to 100 °C

USBF TVX

-

Shielded

24 AWG, 28 AWG

A Female to A Male (Circular Coupling)

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

USB 2.0

2

Artix™-7 FPGA, 65K Logic Cells

-

Data Transfer and Charge, Extension Cable, Industrial Environments - IP68, Panel Mount

3.28 (1.00m)

XCZU15EG-2FFVC900I
XCZU15EG-2FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

64-LQFP

64-LQFP (10x10)

Infineon Technologies

0.892 V

51

Tray

CY9AF312

A/D 9x12b SAR

活跃

0.8500 V

0.808 V

-40°C ~ 105°C (TA)

FM3 CY9A310

External, Internal

40MHz

16K x 8

2.7V ~ 5.5V

ARM® Cortex®-M3

DMA, LVD, POR, PWM, WDT

FLASH

32-Bit Single-Core

128KB (128K x 8)

CSIO, I²C, LINbus, SPI, UART/USART

MCU, FPGA

-

2

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

XCZU9CG-2FFVC900I
XCZU9CG-2FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU9

活跃

0.808 V

0.892 V

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU4EV-3FBVB900E
XCZU4EV-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU4

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU11EG-1FFVC1156E
XCZU11EG-1FFVC1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.8500 V

0.808 V

0.892 V

360

Tray

XCZU11

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XCZU3CG-L1SFVA625I
XCZU3CG-L1SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

Tray

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU4EV-2SFVC784I
XCZU4EV-2SFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

192,150

FCBGA

0.8500 V

0.808 V

0.892 V

252

Tray

XCZU4

活跃

Industrial grade

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU7CG-1FFVF1517E
XCZU7CG-1FFVF1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

0.8500 V

0.808 V

0.892 V

464

Tray

XCZU7

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU5EV-3SFVC784E
XCZU5EV-3SFVC784E
AMD 数据表

476 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

0.9000 V

0.873 V

0.927 V

252

Tray

XCZU5

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

A2F200M3F-1FG256I
A2F200M3F-1FG256I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

MCU - 25, FPGA - 66

Tray

A2F200

活跃

-40°C ~ 100°C (TJ)

SmartFusion®

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

XCZU4EV-2SFVC784E
XCZU4EV-2SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU4

活跃

192,150

0.8500 V

252

表面贴装

0 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU11EG-3FFVC1760E
XCZU11EG-3FFVC1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

653100

0.9000 V

512

512

Tray

XCZU11

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

1760

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

597120

-

XCZU5EG-L2SFVC784E
XCZU5EG-L2SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU5

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-