类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 供应商器件包装 | 材料 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 类型 | 颜色 | 电容量 | 子类别 | 屏蔽/屏蔽 | Reach合规守则 | 引脚数量 | ESR(等效串联电阻) | 失败率 | 引线间距 | 线规 | 配置 | 界面 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 制造商的尺寸代码 | 建筑学 | 可编程逻辑类型 | 产品类别 | 密度 | 规格说明 | EEPROM 大小 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 核数量 | 闪光大小 | 特征 | 产品类别 | 座位高度(最大) | 长度 | 器件厚度 | 材料可燃性等级 | 评级结果 | ||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XCZU3CG-L1UBVA530I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-2SBVA484E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-1LSENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QLS1046MN1T144AFN3 | Teledyne LeCroy | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-1UBVA530E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MLEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-2FSVE1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC4C6U23I7LN | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1206 (3216 Metric) | Cal-Chip Electronics, Inc. | 活跃 | 10 V | 2000 Hrs @ 125°C | 5CSXFC4C6U23I7LN | Intel Corporation | 活跃 | INTEL CORP | 5.79 | Tape & Reel (TR) | -55°C ~ 125°C | Tray | TC | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±20% | 活跃 | Molded | 47 µF | compliant | 3Ohm | - | - | A | 现场可编程门阵列 | 通用型 | 0.071 (1.80mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E4F29E3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-780 | Polyurethane | Arria 10 SoC | Aearo Technologies LLC, a 3M company | Details | 2 x 32 kB | - | Bag | 活跃 | 360 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964927 | Intel | Intel / Altera | 0°C ~ 100°C (TJ) | Tray | ISOLOSS | 10.00 L x 10.00 W (254.00mm x 254.00mm) | 活跃 | Black | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 160 kg/m³ | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | 0.060 (1.52mm) | UL94 HBF | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-2FFVG1517E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 561 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z014S-2CLG484E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | Amphenol Socapex | Box | USBFTVX7 | 活跃 | 1.0000 V | 0.95 V | 1.05 V | 200 | 0 to 100 °C | USBF TVX | - | Shielded | 24 AWG, 28 AWG | A Female to A Male (Circular Coupling) | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | USB 2.0 | 2 | Artix™-7 FPGA, 65K Logic Cells | - | Data Transfer and Charge, Extension Cable, Industrial Environments - IP68, Panel Mount | 3.28 (1.00m) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-2FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | 64-LQFP (10x10) | Infineon Technologies | 0.892 V | 51 | Tray | CY9AF312 | A/D 9x12b SAR | 活跃 | 0.8500 V | 0.808 V | -40°C ~ 105°C (TA) | FM3 CY9A310 | External, Internal | 40MHz | 16K x 8 | 2.7V ~ 5.5V | ARM® Cortex®-M3 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 128KB (128K x 8) | CSIO, I²C, LINbus, SPI, UART/USART | MCU, FPGA | - | 2 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-2FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU9 | 活跃 | 0.808 V | 0.892 V | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-3FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU4 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-1FFVC1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 0.8500 V | 0.808 V | 0.892 V | 360 | Tray | XCZU11 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-L1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | Tray | XCZU3 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-2SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 192,150 | FCBGA | 0.8500 V | 0.808 V | 0.892 V | 252 | Tray | XCZU4 | 活跃 | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 784 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-1FFVF1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 0.8500 V | 0.808 V | 0.892 V | 464 | Tray | XCZU7 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-3SFVC784E | AMD | 数据表 | 476 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 0.9000 V | 0.873 V | 0.927 V | 252 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | MCU - 25, FPGA - 66 | Tray | A2F200 | 活跃 | -40°C ~ 100°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-2SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU4 | 活跃 | 192,150 | 0.8500 V | 252 | 表面贴装 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 784 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-3FFVC1760E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 653100 | 0.9000 V | 512 | 512 | Tray | XCZU11 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 1760 | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 3 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | 597120 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-L2SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - |
XCZU3CG-L1UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
XCZU1CG-2SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
XCVC1702-1LSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
XCVC1802-2MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
QLS1046MN1T144AFN3
Teledyne LeCroy
分类:Embedded - System On Chip (SoC)
XCVC1902-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCZU2EG-1UBVA530E
AMD
分类:Embedded - System On Chip (SoC)
XCVC1902-2MLEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
XCZU42DR-2FSVE1156E
AMD
分类:Embedded - System On Chip (SoC)
5CSXFC4C6U23I7LN
ALTERA
分类:Embedded - System On Chip (SoC)
10AS027E4F29E3SG
ALTERA
分类:Embedded - System On Chip (SoC)
XCZU47DR-2FFVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z014S-2CLG484E
AMD
分类:Embedded - System On Chip (SoC)
XCZU15EG-2FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
XCZU9CG-2FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EV-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU11EG-1FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU3CG-L1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EV-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
XCZU7CG-1FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
XCZU5EV-3SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
A2F200M3F-1FG256I
Microchip
分类:Embedded - System On Chip (SoC)
XCZU4EV-2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
XCZU11EG-3FFVC1760E
AMD
分类:Embedded - System On Chip (SoC)
XCZU5EG-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
