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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	生命周期状态	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量		Core									厂商																													操作温度	包装	已出版	系列	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	核心处理器	时钟频率	传播延迟	连接方式	接通延迟时间	建筑学	座位高度-最大	核心架构	边界扫描	内存(字)	主要属性	逻辑单元数	总线兼容性	闪光大小
5CSXFC6C6U23A7N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES						MCU - 181, FPGA - 145				-40°C~125°C TJ	Tray	2018	Automotive, AEC-Q100, Cyclone® V SE			活跃	3 (168 Hours)	672						BOTTOM	BALL	未说明	1.1V	0.8mm			未说明	5CSXFC6	S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V				700MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	145		现场可编程门阵列						FPGA - 110K Logic Elements		110000				1.85mm	23mm	23mm	符合RoHS标准
M2S025TS-1VFG400I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	ARM Cortex M3			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有		2308 LAB	90								Tray		SmartFusion2																																				256 kB													1 Core
5CSXFC5D6F31C6N	Intel	数据表	2983 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BGA	YES						MCU - 181, FPGA - 288				0°C~85°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	896				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	1mm			未说明	5CSXFC5	S-PBGA-B896	288	不合格		1.13V	1.11.2/3.32.5V		1.07V				925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	288		现场可编程门阵列						FPGA - 85K Logic Elements		85000				2mm	31mm	31mm	符合RoHS标准
10AS066H3F34E2LG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	YES						492				0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)					8542.39.00.01		BOTTOM	BALL	未说明	0.9V	1mm			未说明		S-PBGA-B1152	492	不合格		0.93V	0.9V		0.87V				1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	492		现场可编程门阵列						FPGA - 660K Logic Elements		660000				3.65mm	35mm	35mm	符合RoHS标准
XC7Z100-L2FFG900I	Xilinx Inc.	数据表	990 In Stock	1: ¥2,172.987694 10: ¥2,101.535487 25: ¥2,086.926998 50: ¥2,072.420058 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA	900			130					-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	245	1V	1mm		800MHz	30										CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	120 ps	MCU, FPGA				ARM		YES		256000	Kintex™-7 FPGA, 444K Logic Cells	554800			CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm	31mm	ROHS3 Compliant
XCZU5EG-1SFVC784I	Xilinx Inc.	数据表	782 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	252										-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 256K+ Logic Cells									ROHS3 Compliant
XC7Z014S-2CLG484I	Xilinx Inc.	数据表	2789 In Stock	1: ¥1,063.363053 10: ¥1,003.172695 100: ¥946.389335 500: ¥892.820124 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	484-LFBGA, CSPBGA	YES						200				-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	484		Matte Tin (Sn)		8542.31.00.01		BOTTOM	BALL	未说明	1V	0.8mm			未说明		S-PBGA-B484				1.05V			0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						YES		256000	Artix™-7 FPGA, 65K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	19mm	19mm	ROHS3 Compliant
M2S025T-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES		325-FCBGA (11x11)	325	This product may require additional documentation to export from the United States.	ARM Cortex M3	Details	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	微芯片技术	176	0.111027 oz	2.5, 3.3 V	MSL 3 - 168 hours	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S025T-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78				0 to 85 °C	Tray		SmartFusion2	e1					Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250		0.5 mm	compliant				S-PBGA-B325	180	不合格			1.2 V	OTHER		166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	现场可编程门阵列	592Kbit	STD	FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
XCZU7EG-3FFVC1156E	Xilinx Inc.	数据表	55 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	360										0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									ROHS3 Compliant
XCZU9CG-1FFVB1156I	Xilinx Inc.	数据表	824 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	328										-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 599K+ Logic Cells									ROHS3 Compliant
XCZU15EG-2FFVC900I	Xilinx Inc.	数据表	541 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	204										-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 747K+ Logic Cells									ROHS3 Compliant
5CSEMA4U23C8N	Intel	数据表	13 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES						MCU - 181, FPGA - 145				0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明		S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V				600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	145		现场可编程门阵列						FPGA - 40K Logic Elements		40000				1.85mm	23mm	23mm	符合RoHS标准
M2S025-VFG256I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ARM Cortex M3	0.241494 oz										Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	138 I/O	- 40 C		+ 100 C	有	2308 LAB	119		Tray		SmartFusion2																							1.2 V													256 kB													1 Core
XCZU2EG-1SFVA625E	Xilinx Inc.	数据表	2645 In Stock	1: ¥2,547.275876 10: ¥2,403.090450 100: ¥2,267.066464 500: ¥2,138.741947 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	180										0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 103K+ Logic Cells									ROHS3 Compliant
10AS027E3F29E2SG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	780-BBGA, FCBGA	YES						360				0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)	780				8542.39.00.01		BOTTOM	BALL	未说明	0.9V	1mm			未说明		S-PBGA-B780	360	不合格		0.93V	0.9V		0.87V				1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	360		现场可编程门阵列						FPGA - 270K Logic Elements		270000				3.35mm	29mm	29mm	符合RoHS标准
5CSEMA5F31I7N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BGA	YES						MCU - 181, FPGA - 288				-40°C~100°C TJ	Tray	2018	Cyclone® V SE	e1		活跃	3 (168 Hours)	896		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		BOTTOM	BALL	未说明	1.1V	1mm			未说明	5CSEMA5	S-PBGA-B896	288	不合格		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	288		现场可编程门阵列						FPGA - 85K Logic Elements		85000				2mm	31mm	31mm	符合RoHS标准
XCZU2EG-L1SFVC784I	Xilinx Inc.	数据表	2729 In Stock	1: ¥3,547.388985 10: ¥3,346.593378 100: ¥3,157.163566 500: ¥2,978.456192 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES						252				-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01		BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B784				0.742V			0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 103K+ Logic Cells									ROHS3 Compliant
5CSEMA6F31C7N	Intel	数据表	2683 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BGA	YES						MCU - 181, FPGA - 288				0°C~85°C TJ	Tray	2018	Cyclone® V SE	e1		活跃	3 (168 Hours)	896		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		BOTTOM	BALL	未说明	1.1V	1mm			未说明	5CSEMA6	S-PBGA-B896	288	不合格		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	288		现场可编程门阵列						FPGA - 110K Logic Elements		110000				2mm	31mm	31mm	符合RoHS标准
XCZU7EV-1FBVB900I	Xilinx Inc.	数据表	916 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	204										-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									ROHS3 Compliant
XCZU3EG-1SFVC784E	Xilinx Inc.	数据表	1150 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	252										0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 154K+ Logic Cells									ROHS3 Compliant
XCZU9EG-L1FFVB1156I	Xilinx Inc.	数据表	226 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES						328				-40°C~100°C TJ	Bulk	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01		BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1156				0.742V			0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 599K+ Logic Cells									ROHS3 Compliant
XCZU3CG-L1SFVC784I	Xilinx Inc.	数据表	90 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES						252				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01		BOTTOM	BALL	未说明	0.72V				未说明		S-PBGA-B784											500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 154K+ Logic Cells									ROHS3 Compliant
5CSEBA5U19A7N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES						MCU - 151, FPGA - 66				-40°C~125°C TJ	Tray	2018	Automotive, AEC-Q100, Cyclone® V SE			活跃	3 (168 Hours)	484				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明	5CSEBA5	S-PBGA-B484	66	不合格		1.13V	1.11.2/3.32.5V		1.07V				700MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	66		现场可编程门阵列						FPGA - 85K Logic Elements		85000				1.9mm	19mm	19mm	符合RoHS标准
XCZU15EG-2FFVB1156E	Xilinx Inc.	数据表	710 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	328										0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 747K+ Logic Cells									ROHS3 Compliant
XC7Z014S-2CLG400E	Xilinx Inc.	数据表	2375 In Stock	1: ¥909.040365 10: ¥857.585247 100: ¥809.042689 500: ¥763.247821 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES						125				0°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01		BOTTOM	BALL	未说明	1V	0.8mm			未说明		S-PBGA-B400				1.05V			0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						YES		256000	Artix™-7 FPGA, 65K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm	ROHS3 Compliant