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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装	供应商器件包装		Core							厂商										操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量	边界扫描	内存(字)	主要属性	逻辑单元数	核数量	总线兼容性
M2S050TS-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484		484-FPBGA (23x23)	This product may require additional documentation to export from the United States.	ARM Cortex M3	Details	SMD/SMT	166 MHz	-	-	64 kB	微芯片技术	56340 LE	有	4695 LAB	60	267	Tray	M2S050	活跃		-40°C ~ 100°C (TJ)	Tray		SmartFusion2																											166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 50K Logic Modules		1 Core		256KB
XCZU15EG-1FFVB1156E	Xilinx Inc.	数据表	995 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 747K+ Logic Cells								ROHS3 Compliant
5CSEBA6U23C8N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672							BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA6	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 110K Logic Elements	110000				1.85mm	23mm	23mm	符合RoHS标准
XCZU2EG-1SBVA484I	Xilinx Inc.	数据表	520 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA		82				-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								ROHS3 Compliant
5CSEBA4U23C7N	Intel	数据表	13 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672						8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm		未说明		S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 40K Logic Elements	40000				1.85mm	23mm	23mm	符合RoHS标准
5CSEBA6U19A7N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES	MCU - 151, FPGA - 66				-40°C~125°C TJ	Tray	2018	Automotive, AEC-Q100, Cyclone® V SE			活跃	3 (168 Hours)	484							BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA6	S-PBGA-B484	66	不合格	1.13V	1.11.2/3.32.5V	1.07V		700MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66	现场可编程门阵列					FPGA - 110K Logic Elements	110000				1.9mm	19mm	19mm	符合RoHS标准
XC7Z045-2FF676I	Xilinx Inc.	数据表	617 In Stock	1: ¥11,056.027977 10: ¥10,692.483537 25: ¥10,618.156444 50: ¥10,544.346020 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES		ROMless		130		-40°C~100°C TJ	Tray	2010	Zynq®-7000		no	活跃	4 (72 Hours)	676						8542.39.00.01	BOTTOM	BALL				800MHz			S-PBGA-B676						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN, ETHERNET, I2C, PCI, SPI, UART, USB					Non-RoHS Compliant
XC7Z100-1FF900I	Xilinx Inc.	数据表	677 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	900-FCBGA (31x31)	130				-40°C~100°C TJ	Tray	2010	Zynq®-7000			活跃	4 (72 Hours)				100°C	-40°C								667MHz									CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM	667MHz			Kintex™-7 FPGA, 444K Logic Cells								Non-RoHS Compliant
5CSEBA6U23I7SN	Intel	数据表	113 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672							BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA6	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		800MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 110K Logic Elements	110000				1.85mm	23mm	23mm	符合RoHS标准
5CSEMA5U23C8N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672							BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEMA5	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 85K Logic Elements	85000				1.85mm	23mm	23mm	符合RoHS标准
5CSXFC5C6U23C7N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				0°C~85°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	672							BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSXFC5	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 85K Logic Elements	85000				1.85mm	23mm	23mm	符合RoHS标准
XCZU9CG-2FFVB1156I	Xilinx Inc.	数据表	95 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328				-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)																							533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant
XCZU19EG-2FFVC1760E	Xilinx Inc.	数据表	200 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		512				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells								ROHS3 Compliant
5CSXFC4C6U23C8N	Intel	数据表	2842 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				0°C~85°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	672							BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSXFC4	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 40K Logic Elements	40000				1.85mm	23mm	23mm	符合RoHS标准
XCZU5EV-1SFVC784E	Xilinx Inc.	数据表	644 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	784-FCBGA (23x23)	252				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)																							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells								ROHS3 Compliant
XCZU5CG-2SFVC784E	Xilinx Inc.	数据表	450 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明									533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells								ROHS3 Compliant
M2S150TS-FCVG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	This product may require additional documentation to export from the United States.	ARM Cortex M3	Details	166 MHz	-	-	64 kB	146124 LE	微芯片技术	有	12177 LAB	84	273	Tray	M2S150	活跃			0°C ~ 85°C (TJ)	Tray		SmartFusion2																											166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 150K Logic Modules		1 Core		512KB
M2S150T-FCS536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	This product may require additional documentation to export from the United States.	ARM Cortex M3	N	166 MHz	-	-	64 kB	146124 LE	微芯片技术	有	12177 LAB	90	293	Tray	M2S150	活跃			0°C ~ 85°C (TJ)	Tray		SmartFusion2																											166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 150K Logic Modules		1 Core		512KB
M2S150TS-1FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	This product may require additional documentation to export from the United States.	ARM Cortex M3	Details	166 MHz	-	-	64 kB	146124 LE	微芯片技术	有	12177 LAB	84	273	Tray	M2S150	活跃			-40°C ~ 100°C (TJ)	Tray		SmartFusion2																											166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 150K Logic Modules		1 Core		512KB
M2S005S-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484		484-FPBGA (23x23)	This product may require additional documentation to export from the United States.	ARM Cortex M3	N	SMD/SMT	166 MHz	-	-	64 kB	微芯片技术	6060 LE	有	505 LAB	60	209	Tray	M2S005	活跃		-40°C ~ 100°C (TJ)	Tray		SmartFusion2																											166MHz	64KB		ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 5K Logic Modules		1 Core		128KB
XCZU3EG-2SFVA625I	Xilinx Inc.	数据表	127 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	625						8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		R-PBGA-B625			0.876V		0.825V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								ROHS3 Compliant
XC7Z045-L2FBG676I	Xilinx Inc.	数据表	590 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES	130				-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明		S-PBGA-B676			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm	ROHS3 Compliant
5CSEMA5U23I7N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672						8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEMA5	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 85K Logic Elements	85000				1.85mm	23mm	23mm	符合RoHS标准
XC7Z035-2FBG676E	Xilinx Inc.	数据表	575 In Stock	1: ¥10,826.883187 10: ¥10,470.873485 25: ¥10,398.086883 50: ¥10,325.806236 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES	130				0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明		S-PBGA-B676			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES	256000	Kintex™-7 FPGA, 275K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm	ROHS3 Compliant
XCZU9EG-3FFVB1156E	Xilinx Inc.	数据表	2063 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328				0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明									600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant