类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||
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![]() | XCVC1802-2LLIVSVA2197 | AMD | 数据表 | 872 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | AMD | Tray | 活跃 | 770 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-1LSIVSVA2197 | Xilinx | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 770 | 活跃 | -40°C ~ 100°C (TJ) | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGID019R18A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 480 | 活跃 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R24C2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 744 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH3F35E2LG | Intel | 数据表 | 805 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | Tray | 活跃 | 374 | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R31C2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 720 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H2F34E2LG | ALTERA | 数据表 | 695 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964970 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H2F34E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | 384 | 有 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||
![]() | AGFA008R24C2E3V | Intel | 数据表 | 522 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 576 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Tray | 活跃 | - | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R25A2I2V | Intel | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 624 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-2FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU5 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH1F35I1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 活跃 | Tray | 392 | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E2F27E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | INTEL CORP | 0.93 V | 5.66 | 240 | Non-Compliant | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E2F27E1SG | BGA | SQUARE | Intel Corporation | Obsolete | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | FPGA - 320K Logic Elements | 320000 | -- | 27 mm | 27 mm | ||||||||||||||||||||||||
![]() | XCVC1702-2MSENSVG1369 | AMD | 数据表 | 728 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2LSEVSVD1760 | AMD | 数据表 | 885 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 692 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2LLIVFVC1760 | AMD | 数据表 | 830 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 378 | -40°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | MCU - 22, FPGA - 66 | Tray | A2F200 | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R24C3E4X | Intel | 数据表 | 740 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 744 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1MLINSVG1369 | AMD | 数据表 | 942 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | 500 | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H4F35I3LG | ALTERA | 数据表 | 918 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 973480 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H4F35I3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | 384 | 有 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||
![]() | AGFB027R31C2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 720 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R25A2E2V | Intel | 数据表 | 655 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 624 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Intel | Bulk | 活跃 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCSG536T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 536-LFBGA | 536-BGA (16x16) | 微芯片技术 | Tray | 活跃 | MCU - 136, FPGA - 168 | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R25A2I3V | Intel | 数据表 | 612 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 624 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - |
XCVC1802-2LLIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
344,545.105304
XCVC1802-1LSIVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
AGID019R18A2E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFB022R24C2E4X
Intel
分类:Embedded - System On Chip (SoC)
1SX040HH3F35E2LG
Intel
分类:Embedded - System On Chip (SoC)
18,973.813281
AGFB022R31C2I2V
Intel
分类:Embedded - System On Chip (SoC)
10AS027H2F34E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
15,476.182367
AGFA008R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
67,811.720855
XCZU1EG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
AGFB027R25A2I2V
Intel
分类:Embedded - System On Chip (SoC)
XCZU5EG-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
1SX065HH1F35I1VG
Intel
分类:Embedded - System On Chip (SoC)
10AS032E2F27E1SG
ALTERA
分类:Embedded - System On Chip (SoC)
XCVC1702-2MSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
133,608.278970
XCVC1902-2LSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
216,803.987682
XCVM1802-2LLIVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
137,724.682578
A2F200M3F-PQ208
Microchip
分类:Embedded - System On Chip (SoC)
AGFA022R24C3E4X
Intel
分类:Embedded - System On Chip (SoC)
157,395.014645
XCVE1752-1MLINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
143,279.228757
10AS027H4F35I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
14,560.338206
AGFB027R31C2E2V
Intel
分类:Embedded - System On Chip (SoC)
AGFB022R25A2E2V
Intel
分类:Embedded - System On Chip (SoC)
121,263.190590
10AS066
Intel
分类:Embedded - System On Chip (SoC)
MPFS250T-1FCSG536T2
Microchip
分类:Embedded - System On Chip (SoC)
AGFA022R25A2I3V
Intel
分类:Embedded - System On Chip (SoC)
124,599.609662
