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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 性别 | 引脚数量 | 工作电源电压 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 数据总线宽度 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 闪光大小 | 产品长度 | 设备核心 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AGIC035R39A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | ||||||||||||||||||||||||||||||
| R8A77970LA01BA#GB | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Tray | 活跃 | ||||||||||||||||||||||||||||||||||||||||||
| AGIA035R39A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | ||||||||||||||||||||||||||||||
| AGFD019R31C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||
| XC7Z100-1FF900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 2 | CAN/I2C/SPI/UART | AMD | 130 | Tray | XC7Z100 | 活跃 | Straight | Solder | 法兰安装 | RISC | 1.5, 2, 2.5 V | FBGA | -40 to 100 °C | Zynq®-7000 | Plug | 900 | 1, 1.8 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 444K Logic Cells | - | 86.1 mm | ARM Cortex A9 | |||||||||||||
| XA7Z010-1CLG400I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | RISC | 1.8, 3.3 V | CSBGA | 1 | CAN/GPIO/SPI/UART | 表面贴装 | 130 | Tray | 活跃 | -40 to 100 °C | Automotive, AEC-Q100, Zynq®-7000 XA | 400 | 1 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Artix™-7 FPGA, 28K Logic Cells | - | ARM Cortex A9 | ||||||||||||||||||
| XC7Z035-1FFG900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 表面贴装 | 130 | AMD | Tray | XC7Z035 | 活跃 | Industrial grade | 275,000 | FCBGA | 1.0000 V | 0.95 V | 362 | 1.05 V | -40 to 100 °C | Zynq®-7000 | 900 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||
| AGIB019R18A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||
| SOM-2533AN0C-S0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.4GHz | 4GB | Intel® N50 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | ||||||||||||||||||||||||||||||||
 | AMA3B1KK-KQR-B0 | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 64-WFQFN Exposed Pad | 64-QFN (8x8) | 37 | -40°C ~ 85°C (TA) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | Apollo3 Blue | 活跃 | 96MHz | 384KB | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | I2C, SPI, UART/USART | MCU | 1MB | ||||||||||||||||||||||||||||||
| AGIC040R39A2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 4.047M Logic Elements | ||||||||||||||||||||||||||||||
| AGIA035R39A1E2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | ||||||||||||||||||||||||||||||
| AGFD023R31C2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||
| AGFC023R31C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||
| AGIC040R39A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 4.047M Logic Elements | ||||||||||||||||||||||||||||||
| AGFB014R24D1E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | |||||||||||||||||||||||||||||||
| AGID019R31B2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||
| AGFB023R31C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||
| AGIA035R39A2I1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | ||||||||||||||||||||||||||||||
| AGFA023R31C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||
| AGIA035R39A2I2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | ||||||||||||||||||||||||||||||
| AGFB008R24D1E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | |||||||||||||||||||||||||||||||
| AGIA040R39A2E2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 4.047M Logic Elements | ||||||||||||||||||||||||||||||
| AGFB019R31C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||
| AGFA023R31C2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements |
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AGIC035R39A2E3E
Intel
分类:Embedded - System On Chip (SoC)
-
R8A77970LA01BA#GB
Renesas Electronics Corporation
分类:Embedded - System On Chip (SoC)
-
AGIA035R39A2E3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFD019R31C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
XC7Z100-1FF900I
AMD
分类:Embedded - System On Chip (SoC)
-
XA7Z010-1CLG400I
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z035-1FFG900I
AMD
分类:Embedded - System On Chip (SoC)
-
AGIB019R18A2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
SOM-2533AN0C-S0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
AMA3B1KK-KQR-B0
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
-
AGIC040R39A2I3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGIA035R39A1E2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFD023R31C2E4X
Intel
分类:Embedded - System On Chip (SoC)
-
AGFC023R31C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGIC040R39A2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB014R24D1E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGID019R31B2I3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB023R31C2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGIA035R39A2I1VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA023R31C3E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGIA035R39A2I2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB008R24D1E2V
Intel
分类:Embedded - System On Chip (SoC)
-
AGIA040R39A2E2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB019R31C3I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA023R31C2E4X
Intel
分类:Embedded - System On Chip (SoC)