category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量				Core												厂商																																操作温度	包装	系列	JESD-609代码	无铅代码	零件状态	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	基本部件号	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	内存大小	工作电源电流	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	数据率	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	逻辑元件/单元数	产品类别	阀门数量	最高频率
AGFA014R24C3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			744	Tray	活跃				-40°C ~ 100°C (TJ)		Agilex F																											1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA												FPGA - 1.4M Logic Elements					-
AGFA027R24C3I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			744	Tray	活跃				-40°C ~ 100°C (TJ)		Agilex F																											1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA												FPGA - 2.7M Logic Elements					-
AGFB022R25A3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			624	Tray	活跃				0°C ~ 100°C (TJ)		Agilex F																											1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA												FPGA - 2.2M Logic Elements					-
AGFA012R24B2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			768	Tray	活跃				0°C ~ 100°C (TJ)		Agilex F																											1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA												FPGA - 1.2M Logic Elements					-
5CSXFC5C6U23C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672	672-UBGA (23x23)	672	Compliant	FBGA, BGA672,28X28,32		GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	85 °C	有	5CSXFC5C6U23C6N	FBGA	SQUARE		Intel Corporation	活跃	FPGA - Field Programmable Gate Array Cyclone V SX dual -core ARM Cortex-A9	INTEL CORP	1.13 V	2.07		MCU - 181, FPGA - 145	0°C ~ 85°C (TJ)	Tray	Cyclone® V SX			活跃			85 °C	0 °C			现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		5CSXFC5		S-PBGA-B672	145	不合格	1.13 V	1.1,1.2/3.3,2.5 V	OTHER	556.3 kB		925MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	3.125 Gbps	MCU, FPGA	145		1.85 mm	现场可编程门阵列	85000			800 MHz	32075	6	6	FPGA - 85K Logic Elements		85000			--		23 mm	23 mm
AGFA027R31C2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			720	Tray	活跃				-40°C ~ 100°C (TJ)		Agilex F																											1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA												FPGA - 2.7M Logic Elements					-
XCVM2202-1LSEVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1					+ 100 C	0 C	1			Xilinx	Xilinx															SOC - Systems on a Chip													700 mV																		System-On-Modules - SOM												SoC FPGA
XCVM1402-1LSINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思	Tray	活跃					+ 110 C	- 40 C	1		Xilinx	Xilinx	424	-40°C ~ 100°C (TJ)		Versal™ Prime										SOC - Systems on a Chip													700 mV				400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA						System-On-Modules - SOM						Versal™ Prime FPGA, 1.2M Logic Cells					-	SoC FPGA
XCVM1402-2MSENBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思	Tray	活跃					+ 110 C	0 C	1		Xilinx	Xilinx	424	0°C ~ 100°C (TJ)		Versal™ Prime										SOC - Systems on a Chip													800 mV				600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA						System-On-Modules - SOM						Versal™ Prime FPGA, 1.2M Logic Cells					-	SoC FPGA
XCVM1402-2HSINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思	Tray	活跃					+ 110 C	- 40 C	1		Xilinx	Xilinx	424	-40°C ~ 100°C (TJ)		Versal™ Prime										SOC - Systems on a Chip													880 mV				800MHz, 1.65GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA						System-On-Modules - SOM						Versal™ Prime FPGA, 1.2M Logic Cells					-	SoC FPGA
A2F200M3F-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	-	-	64 kB	2000 LE	161 I/O	0 C	+ 85 C	有	-	60	SmartFusion	Tray	A2F200	活跃					N	SMD/SMT	100 MHz	0°C ~ 85°C (TJ)	Tray	A2F200																										1 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	256 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART		MCU, FPGA							200000					ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops			1 Core		256KB
A2F200M3F-1CSG288	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	288-TFBGA, CSPBGA	YES	288-CSP (11x11)	288	ARM Cortex M3	Tray	A2F200	活跃	微芯片技术	TFBGA, BGA288,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA288,21X21,20	1.5 V	未说明	1.425 V	85 °C	有	A2F200M3F-1CSG288	100 MHz	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.575 V	5.24			Details	100 MHz	-	-	64 kB	2000 LE	有	-	176	SmartFusion	MCU - 31, FPGA - 78	0°C ~ 85°C (TJ)	Tray	A2F200	e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		CMOS	BOTTOM	BALL	未说明	0.5 mm	compliant				S-PBGA-B288	78	不合格		1.5,1.8,2.5,3.3 V	OTHER		100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	256 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART		MCU, FPGA	78	4608 CLBS, 200000 GATES	1.05 mm	现场可编程门阵列								ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608	1 Core	200000	256KB		11 mm	11 mm
M2S090-FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	425	Tray	M2S090	微芯片技术	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S090-FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e0				Tin/Lead (Sn/Pb)				8542.39.00.01		CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B676	425	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	425		2.44 mm	现场可编程门阵列						STD		FPGA - 90K Logic Modules		86316	1 Core		512KB		27 mm	27 mm
M2S060-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	60	SmartFusion2	267	Tray	M2S060	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																											166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA												FPGA - 60K Logic Modules			1 Core		256KB
M2S150TS-FCS536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	微芯片技术	活跃	BGA,	网格排列	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S150TS-FCS536I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	1.2000 V	293	Tray	M2S150	-40 to 100 °C	Tray	SmartFusion2	e0	无			Tin/Lead (Sn/Pb)				8542.39.00.01			BOTTOM	BALL	240		not_compliant			536	S-PBGA-B536							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA				现场可编程门阵列						STD		FPGA - 150K Logic Modules			1 Core		512KB
M2S090T-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	活跃	微芯片技术	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S090T-FCS325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.83			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0				Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01		CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant				R-PBGA-B325	180	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	180		1.16 mm	现场可编程门阵列								FPGA - 90K Logic Modules		86316	1 Core		512KB		13.5 mm	11 mm
M2S060TS-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	Tray	M2S060	微芯片技术	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	5.87	1.26 V	MICROSEMI CORP	活跃	SQUARE	LFBGA	M2S060TS-VF400	无			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	207	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0				Tin/Lead (Sn/Pb)				8542.39.00.01		CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	207	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	207		1.51 mm	现场可编程门阵列								FPGA - 60K Logic Modules		56520	1 Core		256KB		17 mm	17 mm
M2S090TS-1FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	7193 LAB	60	0.892167 oz	267	Tray	微芯片技术	M2S090	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	30	1.14 V	125 °C	无	M2S090TS-1FG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0			3A001.A.2.C	Tin/Lead (Sn/Pb)				8542.39.00.01		CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484	267	不合格		1.2 V	MILITARY		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	267		2.44 mm	现场可编程门阵列								FPGA - 90K Logic Modules		86316	1 Core		512KB		23 mm	23 mm
M2S060-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S060-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	207	Tray	M2S060	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0				Tin/Lead (Sn/Pb)				8542.39.00.01		CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	207	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	207		1.51 mm	现场可编程门阵列								FPGA - 60K Logic Modules		56520	1 Core		256KB		17 mm	17 mm
M2S005-TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	活跃					Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	84 I/O	- 40 C	+ 100 C	191 kbit	有	505 LAB	60	0.046530 oz	1.2000 V	1.14 V	1.26 V	Tray	M2S005	-40 to 100 °C	Tray	SmartFusion2																							1.2 V				166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA										STD		FPGA - 5K Logic Modules			1 Core		128KB
M2S025TS-VFG256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	Tray	M2S025	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																											166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA												FPGA - 25K Logic Modules			1 Core		256KB
M2S010T-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	1007 LAB	90	2.5, 3.3 V	1.14 V	1.26 V	微芯片技术	195	Tray	M2S010	活跃	LFBGA	M2S010T-1VFG400	有	85 °C	1.14 V	1.2 V	BGA400,20X20,32	PLASTIC/EPOXY	3	GRID ARRAY, LOW PROFILE, FINE PITCH	VFBGA-400	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	0 to 85 °C	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		CMOS	BOTTOM	BALL	250	0.8 mm	compliant	40			S-PBGA-B400	195	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	195		1.51 mm	现场可编程门阵列						1		FPGA - 10K Logic Modules		12084	1 Core		256KB		17 mm	17 mm
M2S060T-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	SmartFusion2	1.2000 V	1.14 V	1.26 V	微芯片技术	267	Tray	M2S060	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S060T-FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	-40 to 100 °C	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B484	267	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	267		2.44 mm	现场可编程门阵列						STD		FPGA - 60K Logic Modules		56520	1 Core		256KB		23 mm	23 mm
M2S005S-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	90	169	Tray	M2S005	活跃					This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																											166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA												FPGA - 5K Logic Modules			1 Core		128KB
M2S090TS-FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	M2S090	活跃	微芯片技术	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	85 °C	有	M2S090TS-FGG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	Tray	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B676	425	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	425		2.44 mm	现场可编程门阵列								FPGA - 90K Logic Modules		86316	1 Core		512KB		27 mm	27 mm