category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量			Core																													厂商																																																			操作温度	包装	系列	JESD-609代码	无铅代码	零件状态	ECCN 代码	类型	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况
M2S090T-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	1.2000 V	267	Tray	M2S090	活跃					0 to 85 °C	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA							1			FPGA - 90K Logic Modules										1 Core			512KB
M2S090T-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	325-FCBGA (11x13.5)	ARM Cortex M3	微芯片技术	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	0°C ~ 85°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA										FPGA - 90K Logic Modules										1 Core			512KB
M2S050-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	1.14 V	1.26 V	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	85 °C	有	M2S050-1FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e1					Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	40		S-PBGA-B325	200	不合格		1.2 V	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA		200	1.01 mm	现场可编程门阵列			1			FPGA - 50K Logic Modules							56340			1 Core			256KB							11 mm	11 mm
M2S025T-1VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	有	2308 LAB	119	138	Tray	M2S025	活跃				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA										FPGA - 25K Logic Modules										1 Core			256KB
M2S050TS-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	5.87	1.26 V	MICROSEMI CORP	活跃	SQUARE	BGA	M2S050TS-1FG484	无	85 °C		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	267	Tray	M2S050	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0					Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	267	不合格			1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA		267	2.44 mm	现场可编程门阵列						FPGA - 50K Logic Modules							56340			1 Core			256KB							23 mm	23 mm
M2S050T-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S050T-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	90	207	Tray	M2S050	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0					Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	207	不合格			1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA		207	1.51 mm	现场可编程门阵列						FPGA - 50K Logic Modules							56340			1 Core			256KB							17 mm	17 mm
M2S010TS-1VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	微芯片技术	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	85 °C	无	M2S010TS-1VF256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	119	138	Tray	M2S010	活跃	VFBGA-256	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0					Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B256	138	不合格			1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA		138	1.56 mm	现场可编程门阵列						FPGA - 10K Logic Modules							12084			1 Core			256KB							14 mm	14 mm
M2S050T-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	60	1.2000 V	267	Tray	M2S050	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	85 °C	有	M2S050T-FGG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	0 to 85 °C	Tray	SmartFusion2	e1					Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B484	267	不合格			1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA		267	2.44 mm	现场可编程门阵列			STD			FPGA - 50K Logic Modules							56340			1 Core			256KB							23 mm	23 mm
M2S025TS-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	60	2308 LAB	有	27696 LE	64 kB	-	-	166 MHz	Details	This product may require additional documentation to export from the United States.	1.2000 V	1.14 V	1.26 V	267	Tray	M2S025	活跃				0 to 85 °C	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA							STD			FPGA - 25K Logic Modules										1 Core			256KB
M2S150TS-FC1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	微芯片技术	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	30	1.14 V	无	M2S150TS-FC1152I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	574	Tray	M2S150	活跃	BGA, BGA1152,34X34,40	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0					Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B1152	574	不合格			1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA		574	2.9 mm	现场可编程门阵列						FPGA - 150K Logic Modules							146124			1 Core			512KB							35 mm	35 mm
M2S060T-1FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	- 55 C	+ 125 C	1314 kbit	4710 LAB	60	SmartFusion2	Tray	M2S060	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	-55 °C	1.2 V	30	1.14 V	125 °C	无	M2S060T-1FG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	SMD/SMT	166 MHz	-	-	64 kB	56520 LE	267 I/O	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	有		3A001.A.2.C		Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484				1.2 V		MILITARY	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA			2.44 mm	现场可编程门阵列						FPGA - 60K Logic Modules										1 Core			256KB							23 mm	23 mm
M2S060T-1FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	SmartFusion2	Tray	M2S060	活跃					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56520 LE	387 I/O	0 C	+ 85 C	1314 kbit	4710 LAB	40	0°C ~ 85°C (TJ)	Tray	SmartFusion2																							1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA										FPGA - 60K Logic Modules										1 Core			256KB
M2S010S-1TQG144	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	84 I/O	0 C	+ 85 C	400 kbit	1007 LAB	60	Tray	M2S010	活跃					0°C ~ 85°C (TJ)	Tray	SmartFusion2																							1.2 V			166MHz	64KB	ARM® Cortex®-M3	-		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA										FPGA - 10K Logic Modules										1 Core			256KB
EM05CEFA-512-SGA	Quectel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	250	无线通信模块	0.222931 oz	USB	Socket Mount	Industrial grade							Details		有		-40 to 85 °C	Tray						LTE Cat 4 M.2 Module																		2.5 V											150 Mbps							Industrial			-102.7/-110/-109 dBm
EM20GRA-512-SGAS	Quectel	数据表	N/A	-	最小起订量: 1 最小包装量: 1								Details	有		100	无线通信模块	0.222931 oz		Tray
EFR32MG1P231F256GM48-C0R	Silicon Labs	数据表	N/A	-	最小起订量: 1 最小包装量: 1	QFN-48	ARM Cortex M4	SLWRB4154A	I2C, I2S, SMBus, SPI, UART, USART	40 MHz	有	SMD/SMT	EFR32MG1	2500	EFR32	3.3 V						Details	1 Mbps	3.3 V	8.7 mA, 9.8 mA	8.2 mA	- 40 C	+ 85 C		32 kB	RAM		Reel	EFR32MG1					Bluetooth, Zigbee																	2.4 GHz								Flash	256 kB		19.5 dBm			32 bit								- 94 dBm									2 Timer										12 bit		0.85 mm	7 mm	7 mm
MCIMX6U8DVM10AD	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	i.MX 6DualLite	1000	32	Microprocessor	2	0	95	CAN/Ethernet/I2C/I2S/SPI/SSI/UART/USB	4	3	5	32KB	32KB	0	1	有	10Mbps/100Mbps/1000Mbps	表面贴装	1.06	21	21	624	BGA	LFBGA	Ball								Compliant	5A992C		8542.31.00.01	无	无		Tray				活跃		应用处理器													624									128KB			ROM	96KB									ARM						1				4										4	2	4		ARM Cortex A9
i.MX 6Quad \| MCIMX6Q5EYM10AE	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	5	0	有	10Mbps/100Mbps/1000Mbps	表面贴装	1.05	21	21	624	FCBGA								Compliant	5A992C		8542.31.00.01	无	无	i.MX 6Quad	1000	32	Microprocessor	2	-20	105	CAN/Ethernet/I2C/I2S/SPI/SSI/UART/USB	3	3						活跃		应用处理器													624									272KB			ROM	96KB									ARM						1				1										5	2	4		ARM Cortex A9
MSCMMX6QZCK08AB1G0A	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1		8542.31.00.01	无		无	i.MX 6Quad	800	32	Microprocessor	-40	105	CAN/Ethernet/I2C/I2S/SPI/UART/USB	3	3	5	0	1	有	16MB							供应商未确认	5A992c.						Unconfirmed		应用处理器																						256KB			ROM	96KB									ARM						1				2										5	2			ARM Cortex A9
i.MX 7Dual \| MCIMX7D5EVM10SD	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1	-20	105	CAN/Ethernet/I2C/SPI/UART/USB	4	0	7	0	0	有	10Mbps/100Mbps/1000Mbps	表面贴装	1.23(Max)	19	19	541	BGA	LFBGA	Ball								供应商未确认	5A992C		8542.31.00.01	无	无	i.MX 7Dual	1000	32	Microprocessor						活跃		应用处理器													541									256KB			ROM	96KB									ARM						2				1										4	2	4		ARM Cortex A7
MCIMX6S6AVM08AB	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	624-LFBGA	624-MAPBGA (21x21)	飞思卡尔半导体	-40	125	CAN/Ethernet/I2C/I2S/SPI/UART/USB	4	3	5	0	有	10Mbps/100Mbps/1000Mbps	表面贴装	1.16	21	21	624	BGA	MAP-BGA	Ball	Bulk	MCIMX6	活跃					Compliant	5A992c.		8542.31.00.01	有	有	i.MX 6Solo	800	32	Microprocessor	2	-40°C ~ 125°C (TJ)	Tray	i.MX6S			NRND		应用处理器													624								800MHz	128KB	ARM® Cortex®-A9		ROM	96KB									ARM			1.8V, 2.5V, 2.8V, 3.3V			1	1 Core, 32-Bit	有	LPDDR2, LVDDR3, DDR3	4	CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART			Multimedia; NEON™ SIMD		ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	Keypad, LCD		-	4	2	4		ARM Cortex A9
i.MX 7Dual \| MCIMX7D3EVK10SD	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1	-20	105	Ethernet/I2C/SPI/UART/USB	4	0	7	0	0	有	10Mbps/100Mbps/1000Mbps	表面贴装	0.87(Max)	12	12	488	BGA	TFBGA	Ball								供应商未确认	5A992C		8542.31.00.01	无	无	i.MX 7Dual	1000	32	Microprocessor						活跃		应用处理器													488									256KB			ROM	96KB									ARM						2				1										4	0	4		ARM Cortex A7
i.MX 8MQuad \| MIMX8MQ6DVAJZAA	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	32KB	0	2	有	表面贴装	1.68(Min)	17	17	621	FBGA								Compliant	5A992		8542.31.00.01	无	无	1500	32	Microcontroller	0	95	Ethernet/I2C/SPI/UART/USB	4	0	4	32KB								应用处理器													621									160KB			ROM	128KB									ARM						1				2										3	0			ARM Cortex A53\|ARM Cortex M4
MSCMMX6XYDM08AA	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	32	Microprocessor	0	85	CAN/Ethernet/I2C/I2S/SPI/UART/USB	4	1	6	16KB\|32KB	32KB\|16KB	0	0	有	MMPF0100	表面贴装	0.73(Max)	13	13	265	BGA	BGA	Ball								Compliant	5A992		8542.31.00.01	无	无	i.MX 6SoloX	800						Obsolete		应用处理器													265													96KB									ARM						1				2										5	2			ARM Cortex A9\|ARM Cortex M4
i.MX RT1050 \| MIMXRT1052DVL6B	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	32KB	0	0	有	表面贴装	1.27(Max)	10	10	196	MAP-BGA								Compliant	5A992C		8542.31.00.01	无	无	600	32	Microprocessor	0	95	CAN/Ethernet/I2C/SPI/UART/USB	4	0	8	32KB		Tray				Preliminary		应用处理器													196									512KB			ROM	96KB									ARM						1				2										4	2			ARM Cortex M7

M2S090T-1FGG484

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S090T-1FCSG325

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S050-1FCSG325

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S025T-1VF256

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S050TS-1FG484

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S050T-VF400I

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S010TS-1VF256

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S050T-FGG484

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S025TS-FGG484

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S150TS-FC1152I

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S060T-1FG484M

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S060T-1FGG676

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S010S-1TQG144

Microchip Technology

分类:Embedded - System On Chip (SoC)
EM05CEFA-512-SGA

Quectel

分类:Embedded - System On Chip (SoC)
EM20GRA-512-SGAS

Quectel

分类:Embedded - System On Chip (SoC)
EFR32MG1P231F256GM48-C0R

Silicon Labs

分类:Embedded - System On Chip (SoC)
MCIMX6U8DVM10AD

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
i.MX 6Quad | MCIMX6Q5EYM10AE

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
MSCMMX6QZCK08AB1G0A

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
i.MX 7Dual | MCIMX7D5EVM10SD

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
MCIMX6S6AVM08AB

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
i.MX 7Dual | MCIMX7D3EVK10SD

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
i.MX 8MQuad | MIMX8MQ6DVAJZAA

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
MSCMMX6XYDM08AA

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
i.MX RT1050 | MIMXRT1052DVL6B

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)