category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装		操作温度	包装	已出版	系列	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	输入数量	可编程逻辑类型	主要属性	逻辑单元数	座位高度(最大)	长度	宽度	RoHS状态
XCZU5EG-L2FBVB900E	Xilinx Inc.	数据表	1463 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	900	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					ROHS3 Compliant
XCZU6CG-2FFVB1156E	Xilinx Inc.	数据表	1100 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328	0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 469K+ Logic Cells					ROHS3 Compliant
5CSXFC4C6U23C6N	Intel	数据表	2017 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145	0°C~85°C TJ	Tray	2018	Cyclone® V SX		活跃	3 (168 Hours)	672			BOTTOM	BALL	未说明	1.1V	0.8mm	未说明	5CSXFC4	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V	925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列	FPGA - 40K Logic Elements	40000	1.85mm	23mm	23mm	符合RoHS标准
XCZU3EG-2SFVA625E	Xilinx Inc.	数据表	80 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA		180	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU15EG-3FFVB1156E	Xilinx Inc.	数据表	2000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 747K+ Logic Cells					ROHS3 Compliant
XCZU7EG-L2FFVC1156E	Xilinx Inc.	数据表	52 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1156			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU11EG-3FFVC1760E	Xilinx Inc.	数据表	698 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		512	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
XCZU2EG-2SFVA625I	Xilinx Inc.	数据表	143 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	625		8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明		R-PBGA-B625			0.876V		0.825V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU3EG-2SBVA484E	Xilinx Inc.	数据表	446 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA		82	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU5EG-L1SFVC784I	Xilinx Inc.	数据表	818 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	784	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B784			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					ROHS3 Compliant
XCZU5EG-3SFVC784E	Xilinx Inc.	数据表	328 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					ROHS3 Compliant
XCZU11EG-3FFVC1156E	Xilinx Inc.	数据表	30 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
XCZU3EG-1SBVA484I	Xilinx Inc.	数据表	569 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA		82	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU5EV-2FBVB900I	Xilinx Inc.	数据表	815 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					ROHS3 Compliant
XCZU7EV-3FFVF1517E	Xilinx Inc.	数据表	135 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		464	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU17EG-1FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		644	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					ROHS3 Compliant
5CSEBA2U23I7	Intel	数据表	2700 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145	-40°C~100°C TJ	Tray	2018	Cyclone® V SE		活跃	3 (168 Hours)	672			BOTTOM	BALL	未说明	1.1V	0.8mm	未说明	5CSEBA2	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V	800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列	FPGA - 25K Logic Elements	25000	1.85mm	23mm	23mm	Non-RoHS Compliant
XCZU5EV-L1SFVC784I	Xilinx Inc.	数据表	5000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)	784	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B784			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					ROHS3 Compliant
XCZU7EG-2FFVC1156E	Xilinx Inc.	数据表	70 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
10AS066N3F40E2SG	Intel	数据表	677 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	1517-BBGA, FCBGA	YES	588	0°C~100°C TJ	Tray		Arria 10 SX		活跃	3 (168 Hours)			8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1517	588	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	588	现场可编程门阵列	FPGA - 660K Logic Elements	660000	3.5mm	40mm	40mm	符合RoHS标准
XCZU3CG-2SFVC784I	Xilinx Inc.	数据表	773 In Stock	1: ¥5,379.017737 10: ¥5,074.545034 100: ¥4,787.306639 500: ¥4,516.327013 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	784		8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明		S-PBGA-B784						533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU6EG-1FFVC900I	Xilinx Inc.	数据表	445 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 469K+ Logic Cells					ROHS3 Compliant
XCZU9CG-1FFVB1156E	Xilinx Inc.	数据表	814 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 599K+ Logic Cells					ROHS3 Compliant
XCZU7EV-L1FFVC1156I	Xilinx Inc.	数据表	350 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1156			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU9CG-2FFVB1156E	Xilinx Inc.	数据表	827 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明								533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 599K+ Logic Cells					ROHS3 Compliant