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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量												厂商																												操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	温度系数	电阻	最高工作温度	最小工作温度	组成	功率(瓦特)	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	JESD-30代码	输出的数量	资历状况	工作电源电压	失败率	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	产品类别	速度等级	收发器数量	主要属性	寄存器数量	逻辑单元数	核数量	闪光大小	特征	产品类别
10AS048K1F35I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	PEI-Genesis	396				Bulk	活跃	-40°C ~ 100°C (TJ)	Tray	*			Discontinued at Digi-Key																							1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							FPGA - 480K Logic Elements				--
10AS027H2F34E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	KYOCERA AVX	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.64		Tape & Reel (TR)	活跃	384	Non-Compliant	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS027H2F34E1SG	BGA	SQUARE	0°C ~ 100°C (TJ)	Tray	*			Discontinued at Digi-Key								8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B1152	384	不合格			0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.65 mm	现场可编程门阵列				FPGA - 270K Logic Elements		270000		--				35 mm	35 mm
XCZU6EG-3FFVC900E	AMD	数据表	995 In Stock	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	活跃				204	Tray	XCZU6	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																										600MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					3		Zynq®UltraScale+™ FPGA, 469K+ Logic Cells				-
10AS016C4U19I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	YES	484	Axial	484	2 x 32 kB	1.2 GHz	160000 LE	+ 100 C	0.423288 oz	- 40 C	1	SMD/SMT		20000 LAB	964681	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS016C4U19I3SG	FBGA	SQUARE	活跃	INTEL CORP	0.93 V	1.96	192	Compliant	有	-65°C ~ 175°C	Bulk	Military, MIL-PRF-55182/01, RNC55	0.094 Dia x 0.250 L (2.39mm x 6.35mm)	±0.1%	活跃	2	±50ppm/°C	22.6 kOhms	100 °C	-40 °C	Metal Film	0.125W, 1/8W	8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant	S-PBGA-B484	192	不合格	1.8 V	P (0.1%)	0.9 V	INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	192	3.25 mm	现场可编程门阵列	SoC FPGA	3	6 Transceiver	FPGA - 160K Logic Elements	246040	160000	2 Core	--	Military, Moisture Resistant, Weldable	SoC FPGA	--	19 mm	19 mm
XCVM1802-1MLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	活跃				726	Tray	-40°C ~ 100°C (TJ)		Versal™ Prime																										600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ Prime FPGA, 1.9M Logic Cells				-
MPFS250TS-1FCSG536I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-LFBGA	微芯片技术	活跃				MCU - 136, FPGA - 372	Tray	-40°C ~ 100°C		PolarFire™																										-	2.2MB	RISC-V	DMA, PCI, PWM		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 254K Logic Modules				128kB
BCM53575B0KFSBG	Broadcom	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Broadcom Limited			189	Broadcom Limited	Broadcom / Avago	Details	活跃	Tray	-		-		-												Wireless & RF Integrated Circuits	Si													1.25GHz	-	ARM® Cortex®-A9, ARM® Cortex®-R5	SERDES		ACL, MAC, QSGMII	MPU				RF System on a Chip - SoC			-				-		RF System on a Chip - SoC
AGIB022R31B3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				720	Tray	-40°C ~ 100°C (TJ)		Agilex I																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 2.2M Logic Elements				-
AGFA027R25A2E4F	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				624	Tray	0°C ~ 100°C (TJ)		Agilex F																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 2.7M Logic Elements				-
XCVC1902-1LSIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	活跃				692	Tray	-40°C ~ 100°C (TJ)		Versal™ AI Core																										400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.9M Logic Cells				-
XCZU5EV-L1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	活跃				252	Tray	XCZU5	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																										500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				-
XCZU49DR-2FFVF1760I	Xilinx	数据表	585 In Stock	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思	活跃				622	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																										533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCVC1902-2LLEVIVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD 赛灵思			500	活跃		0°C ~ 100°C (TJ)																												450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.9M Logic Cells				-
AGFA008R24C2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				576	Tray	-40°C ~ 100°C (TJ)		Agilex F																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 764K Logic Elements				-
XCVC1802-1LSEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	活跃				692	Tray	0°C ~ 100°C (TJ)		Versal™ AI Core																										400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.5M Logic Cells				-
AGFA008R24C3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				576	Tray	0°C ~ 100°C (TJ)		Agilex F																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 764K Logic Elements				-
XCVC1902-2LLEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	活跃				770	Tray	0°C ~ 100°C (TJ)		Versal™ AI Core																										450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.9M Logic Cells				-
AGFA012R24B1E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				768	Tray	0°C ~ 100°C (TJ)		Agilex F																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 1.2M Logic Elements				-
XCZU5EV-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	活跃				252	Tray	XCZU5	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																										500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				-
XCVM1502-1MSENFVB1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD			478	Tray	活跃				0°C ~ 100°C (TJ)		Versal™ Prime																										600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ Prime FPGA, 1M Logic Cells				-
XCVC1902-2LLEVIVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD	活跃				500	Tray	0°C ~ 100°C (TJ)		Versal™ AI Core																										450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.9M Logic Cells				-
AGFA006R16A2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				384	Tray	-40°C ~ 100°C (TJ)		Agilex F																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 573K Logic Elements				-
XCVC1502-1MSENSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD			478	Tray	活跃				0°C ~ 100°C (TJ)		Versal™ AI Core																										600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 800k Logic Cells				-
AGFA008R24C2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				576	Tray	0°C ~ 100°C (TJ)		Agilex F																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 764K Logic Elements				-
AGFB012R24C2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				744	Tray	0°C ~ 100°C (TJ)		Agilex F																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 1.2M Logic Elements				-