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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装	供应商器件包装		Core								厂商													操作温度	包装	已出版	系列	JESD-609代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	程序内存大小	输入数量	可编程逻辑类型	核心架构	边界扫描	速度等级	内存(字)	主要属性
XC7Z030-2FB484I	Xilinx Inc.	数据表	2715 In Stock	1: ¥3,164.584376 10: ¥2,985.456961 100: ¥2,816.468830 500: ¥2,657.046061 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	484-BBGA, FCBGA	YES	130				-40°C~100°C TJ	Tray	2009	Zynq®-7000		no	活跃	3 (168 Hours)	484				8542.39.00.01	BOTTOM	BALL				800MHz			S-PBGA-B484						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM	YES		256000	Kintex™-7 FPGA, 125K Logic Cells			CAN, ETHERNET, I2C, PCI, SPI, UART, USB					无	ROHS3 Compliant
XCZU2EG-L2SFVC784E	Xilinx Inc.	数据表	857 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252				0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B784			0.742V		0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells									ROHS3 Compliant
XCZU5EG-1SFVC784E	Xilinx Inc.	数据表	580 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells									ROHS3 Compliant
XCZU3EG-L1SBVA484I	Xilinx Inc.	数据表	943 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES	82				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	484			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B484			0.742V		0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells									ROHS3 Compliant
XCZU2EG-L1SFVA625I	Xilinx Inc.	数据表	337 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180				-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	625			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B625			0.742V		0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells									ROHS3 Compliant
XCZU7EV-L2FFVC1156E	Xilinx Inc.	数据表	390 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1156			0.742V		0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									ROHS3 Compliant
M2S090TS-1FGG484T2	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	484-FPBGA (23x23)	ARM Cortex M3	-	-	64 kB	86316 LE	267 I/O	- 40 C	微芯片技术	+ 125 C	2074 kbit	7193 LAB	60	2.110353 oz	Tray	M2S090	活跃			SMD/SMT	166 MHz	-40°C ~ 125°C (TJ)	Tray		SmartFusion2																			1.2 V					166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			1		FPGA - 90K Logic Modules		1 Core		512KB
5ASTMD3E3F31I5N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BBGA, FCBGA	YES	MCU - 208, FPGA - 250				-40°C~100°C TJ	Tray		Arria V ST	e1		活跃	3 (168 Hours)	896		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	未说明	1.1V	1mm		未说明	5ASTMD3	S-PBGA-B896	178	不合格	1.13V	1.11.2/3.32.5V	1.07V		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	622MHz	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		178	现场可编程门阵列					FPGA - 350K Logic Elements	350000				2.7mm	31mm	31mm		符合RoHS标准
5CSEBA2U23I7N	Intel	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				-40°C~100°C TJ	Tray	2018	Cyclone® V SE	e1		活跃	3 (168 Hours)	672	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm		未说明		S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 25K Logic Elements	25000				1.85mm	23mm	23mm		符合RoHS标准
5CSEMA4U23C6N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672					BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEMA4	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列					FPGA - 40K Logic Elements	40000				1.85mm	23mm	23mm		符合RoHS标准
5CSXFC6C6U23C8NES	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)		MCU - 181, FPGA - 145				0°C~85°C TJ	Tray		Cyclone® V SX			Obsolete	3 (168 Hours)													5CSXFC6								600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								FPGA - 110K Logic Elements
XCZU7EG-L1FFVC1156I	Xilinx Inc.	数据表	61 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1156			0.742V		0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									ROHS3 Compliant
XCZU7EV-1FFVC1156E	Xilinx Inc.	数据表	813 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									ROHS3 Compliant
XCZU6CG-L1FFVC900I	Xilinx Inc.	数据表	2000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B900			0.742V		0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 469K+ Logic Cells									ROHS3 Compliant
XCZU7CG-1FFVC1156E	Xilinx Inc.	数据表	7 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									ROHS3 Compliant
XCZU2EG-1SFVC784I	Xilinx Inc.	数据表	2051 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252				-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells									ROHS3 Compliant
XCZU4EG-2FBVB900I	Xilinx Inc.	数据表	2000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 192K+ Logic Cells									ROHS3 Compliant
5ASXFB5G4F35I3N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	YES	MCU - 208, FPGA - 385				-40°C~100°C TJ	Tray		Arria V SX	e1		活跃	3 (168 Hours)			锡银铜		8542.39.00.01	BOTTOM	BALL	未说明	1.15V	1mm		未说明	5ASXFB5	S-PBGA-B1152			1.18V		1.12V		1.05GHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	670MHz	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			现场可编程门阵列					FPGA - 462K Logic Elements					2.7mm	35mm	35mm		符合RoHS标准
A2F500M3G-CS288I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	288-TFBGA, CSPBGA	288-CSP (11x11)	ARM Cortex M3	-	-	64 kB	6000 LE	有	微芯片技术	-	176	SmartFusion	MCU - 31, FPGA - 78	Tray	A2F500	活跃			This product may require additional documentation to export from the United States.	N	80 MHz	-40°C ~ 100°C (TJ)	Tray		A2F500																								80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA					ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops		1 Core		512KB
XCZU9EG-3FFVC900E	Xilinx Inc.	数据表	500 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204				0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 599K+ Logic Cells									ROHS3 Compliant
XCZU4EV-L2SFVC784E	Xilinx Inc.	数据表	600 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	784-FCBGA (23x23)	252				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)																					533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 192K+ Logic Cells									ROHS3 Compliant
XCZU4EV-3SFVC784E	Xilinx Inc.	数据表	300 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 192K+ Logic Cells									ROHS3 Compliant
XCZU7EG-1FFVC1156E	Xilinx Inc.	数据表	60 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									ROHS3 Compliant
XCZU11EG-L2FFVC1156E	Xilinx Inc.	数据表	196 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1156			0.742V		0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 653K+ Logic Cells									ROHS3 Compliant
XCZU5CG-1SFVC784I	Xilinx Inc.	数据表	846 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells									ROHS3 Compliant