类别是'category.片上系统(SoC)' (7695)

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M2S005-1VFG400I
M2S005-1VFG400I
Microchip Technology 数据表

112 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

169

微芯片技术

Tray

M2S005

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

M2S005-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.79

6060 LE

505 LAB

90

64 kB

-

-

166 MHz

SMD/SMT

Details

This product may require additional documentation to export from the United States.

1.2000 V

1.14 V

1.26 V

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

现场可编程门阵列

1

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

M2S060T-FGG676I
M2S060T-FGG676I
Microchip Technology 数据表

2478 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S050TS-1FGG484
M2S050TS-1FGG484
Microchip Technology 数据表

2359 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

60

267

Tray

M2S050

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S150TS-FCG1152
M2S150TS-FCG1152
Microchip Technology 数据表

2626 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

ARM Cortex M3

微芯片技术

BGA1152,34X34,40

1.2 V

1.14 V

85 °C

M2S150TS-FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

12177 LAB

24

574

Tray

M2S150

活跃

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CMOS

BOTTOM

BALL

250

1 mm

compliant

40

S-PBGA-B1152

574

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

STD

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

M2S050T-1FCS325I
M2S050T-1FCS325I
Microchip Technology 数据表

2974 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

1.2 V

30

1.14 V

M2S050T-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

176

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S010TS-1VF400
M2S010TS-1VF400
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

M2S010TS-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

90

195

Tray

M2S010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

M2S025T-FCS325I
M2S025T-FCS325I
Microchip Technology 数据表

2056 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

M2S025T-FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

MSL 3 - 168 hours

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

592Kbit

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S050-FCSG325I
M2S050-FCSG325I
Microchip Technology 数据表

2671 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

M2S050-FCSG325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

176

1.2000 V

200

Tray

M2S050

活跃

FBGA-325

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S005-1VFG400
M2S005-1VFG400
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

M2S005

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

505 LAB

90

169

Tray

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S050TS-1VFG400I
M2S050TS-1VFG400I
Microchip Technology 数据表

2101 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

M2S050TS-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

90

207

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

56340

1 Core

256KB

17 mm

17 mm

M2S150TS-FCSG536I
M2S150TS-FCSG536I
Microchip Technology 数据表

2928 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

ARM Cortex M3

1

293

微芯片技术

Tray

M2S150

活跃

FBGA-536

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

40

1.14 V

100 °C

M2S150TS-FCSG536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

Industrial grade

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

12177 LAB

90

RISC

1.2, 1.5, 1.8, 2.5, 3.3 V

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

compliant

536

S-PBGA-B536

1.2 V

INDUSTRIAL

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

现场可编程门阵列

Industrial

FPGA - 150K Logic Modules

1 Core

512KB

ARM Cortex-M3

M2S050T-1VF400
M2S050T-1VF400
Microchip Technology 数据表

2633 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

56340 LE

4695 LAB

90

1.2000 V

1.14 V

1.26 V

207

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

M2S090TS-FCSG325
M2S090TS-FCSG325
Microchip Technology 数据表

2805 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

M2S090TS-FCSG325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.8

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

1.2000 V

180

Tray

M2S090

活跃

FBGA-325

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S025T-1FCS325
M2S025T-1FCS325
Microchip Technology 数据表

2107 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

180

Tray

M2S025

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S025-FGG484I
M2S025-FGG484I
Microchip Technology 数据表

2380 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

2308 LAB

60

0.314524 oz

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 25K Logic Modules

1 Core

256KB

M2S060TS-1FG676
M2S060TS-1FG676
Microchip Technology 数据表

2583 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S050TS-VFG400I
M2S050TS-VFG400I
Microchip Technology 数据表

2663 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

M2S050TS-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

90

207

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

17 mm

17 mm

M2S025-FG484
M2S025-FG484
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

60

23988

FBGA

1.2000 V

267

表面贴装

267

Tray

M2S025

活跃

Commercial grade

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

Commercial

STD

FPGA - 25K Logic Modules

1 Core

256KB

M2S150-FCV484
M2S150-FCV484
Microchip Technology 数据表

2903 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

YES

484-FBGA (19x19)

484

ARM Cortex M3

微芯片技术

1.2 V

30

1.14 V

85 °C

M2S150-FCV484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

12177 LAB

84

273

Tray

M2S150

活跃

VFBGA-484

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA484,22X22,32

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B484

273

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

273

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

19 mm

19 mm

M2S060TS-VF400I
M2S060TS-VF400I
Microchip Technology 数据表

2133 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

90

SmartFusion2

207

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S010-1TQG144
M2S010-1TQG144
Microchip Technology 数据表

2684 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-144

YES

144-TQFP (20x20)

144

ARM Cortex M3

12084 LE

1007 LAB

60

0.046530 oz

RISC

1.2, 1.5, 1.8, 2.5, 3.3 V

TQFP

微芯片技术

1

CAN/Ethernet/Serial I2C/SPI/UART/USB

表面贴装

84

Tray

M2S010

活跃

TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.2 V

40

1.14 V

85 °C

M2S010-1TQG144

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

Commercial grade

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

0 to 85 °C

Tray

SmartFusion2

Pure Matte Tin (Sn)

8542.39.00.01

CMOS

QUAD

鸥翼

250

0.5 mm

compliant

144

S-PQFP-G144

84

不合格

0.95, 1.05 V

1.2 V

OTHER

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

84

1.6 mm

现场可编程门阵列

Commercial

FPGA - 10K Logic Modules

12084

1 Core

256KB

ARM Cortex-M3

20 mm

20 mm

M2S010TS-1VFG400I
M2S010TS-1VFG400I
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

M2S010TS-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

90

1.2000 V

195

Tray

M2S010

活跃

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

M2S060TS-FCS325
M2S060TS-FCS325
Microchip Technology 数据表

2863 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

M2S060TS-FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

M2S060T-FG676
M2S060T-FG676
Microchip Technology 数据表

2889 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

40

SmartFusion2

387

Tray

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S050-1FGG484I
M2S050-1FGG484I
Microchip Technology 数据表

2243 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

1.2000 V

267

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

60

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB