category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	供应商器件包装	材料	形状	终端数量														厂商																												Voltage Rating AC		操作温度	系列	JESD-609代码	无铅代码	零件状态	类型	定位的数量	端子表面处理	组成	附加功能	HTS代码	子类别	技术	电压 - 供电	端子位置	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	额定电流	引脚数量	触点表面处理	终端样式	JESD-30代码	输出的数量	资历状况	接头数量	执行器类型	输出类型	面板开孔尺寸	电源	温度等级	镀层	附着方法	速度	内存大小	甲板数量	建筑学	输入数量	操作力	座位高度-最大	可编程逻辑类型	大小	每层电路	面板后深度	速度等级	每个甲板的杆数	投掷角度	主要属性
XCZU17EG-2FFVE1924E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1924-BBGA, FCBGA	1924-FCBGA (45x45)	AMD	0.8500 V	668	Tray	XCZU17	活跃							ACH580-BCR-088A-2+B058+F267+K452		ABB	0 to 100 °C	Zynq® UltraScale+™ MPSoC EG																				1924														533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											2			Zynq®UltraScale+™ FPGA, 926K+ Logic Cells			-
XCZU2EG-L1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	活跃							ACH580-BCR-088A-2+B058+J429+K454	ABB	82	Tray		XCZU2	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG																																		500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA														Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
XCZU7CG-2FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD		PDG52P1200D3WN	CE, CSA, UL	Cutler Hammer, Div of Eaton Corp	Panel	360	Tray	XCZU7	活跃							-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC CG																			1,200 A															533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA														Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			-
XCZU3CG-L1SBVA484I	AMD	数据表	815 In Stock	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD				Miscellaneous	82	Tray	XCZU3	活跃					-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC CG																																		500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA														Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			-
M2S050T-1VFG400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术	207	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB							02466	Greenlee		1.2000 V	-40 to 100 °C	SmartFusion®2																																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB				MCU, FPGA											1			FPGA - 50K Logic Modules		1 Core	256KB
XCZU2CG-L1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	0.8500 V	252	Tray	XCZU2	活跃							DH227NRKV		Cutler Hammer, Div of Eaton Corp	-40 to 100 °C	Zynq® UltraScale+™ MPSoC CG																																		500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											1L			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
XCZU3CG-2SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	Tray	XCZU3	活跃	Industrial grade							154,350	FCBGA	0.8500 V	0.808 V	82	0.892 V		82	-40 to 100 °C	Zynq® UltraScale+™ MPSoC CG																				484														533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA							Industrial				2			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			-
M2S060-FGG676	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	676-FBGA (27x27)	微芯片技术	-	64 kB						1.2000 V	Non-Compliant	387	Tray	M2S060	活跃	-	166 MHz		56520 LE	0 to 85 °C	SmartFusion®2																																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB				MCU, FPGA											STD			FPGA - 60K Logic Modules		1 Core	256KB
XCZU11EG-2FFVF1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	Tray	XCZU11	活跃								464	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG																																		533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA														Zynq®UltraScale+™ FPGA, 653K+ Logic Cells			-
M2S010TS-1FGG484T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术	40	有	M2S010TS-1FGG484T2	Microsemi Corporation	活跃	MICROSEMI CORP	5.81							1.2000 V	233	Tray	M2S010		活跃	0 to 85 °C	Automotive, AEC-Q100, SmartFusion®2	e1	有				Tin/Silver/Copper (Sn/Ag/Cu)										250		compliant																166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB				MCU, FPGA				现场可编程门阵列							1			FPGA - 10K Logic Modules			256KB
M2S090TS-1FGG676T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	676-FBGA (27x27)	微芯片技术				1.2000 V	425	Tray	M2S090	活跃					0 to 85 °C	Automotive, AEC-Q100, SmartFusion®2																																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB				MCU, FPGA											1			FPGA - 90K Logic Modules			512KB
XCZU11EG-1FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	0.8500 V	464	Tray	XCZU11	活跃							139394		Schneider	-40 to 100 °C	Zynq® UltraScale+™ MPSoC EG																																		500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											1			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells			-		Inverted Flare
XAZU2EG-1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	活跃							31004	Greenlee	128	Tray		XAZU2	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG																																		500MHz, 1.2GHz	1.2MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, I²C, SPI, UART/USART, USB				MPU, FPGA														Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
XAZU3EG-1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	活跃							E57LBL30A2SP	10 mm	Cutler Hammer, Div of Eaton Co	0.8500 V	0.808 V	0.892 V	128	Tray		XAZU3	-40 to 100 °C	Zynq® UltraScale+™ MPSoC EG															Shielded					625								NC						500MHz, 1.2GHz	1.8MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, I²C, SPI, UART/USART, USB				MPU, FPGA											1			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			-		3 Pin Micro Pigtail			AC	30 mm
XCZU11EG-3FFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	ILME	488	Tray	XCZU11	活跃							TCHI-24		CE, cURus	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG							Non-Metallic																			None (Housing Only)								600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA					104mm x 27mm									Zynq®UltraScale+™ FPGA, 653K+ Logic Cells			-				-40-90 °C
XCZU4EV-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD					31008805000	Pfannenberg	0.892 V	0.808 V	0.8500 V	252	Tray	XCZU4	活跃				-40 to 100 °C	Zynq® UltraScale+™ MPSoC EV																																		500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											1			Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
XCZU17EG-2FFVE1924I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1924-BBGA, FCBGA	1924-FCBGA (45x45)	AMD					313902	PILZ	0.85 V	0.808 V	0.892 V	668	Tray	XCZU17	活跃				-40 to 100 °C	Zynq® UltraScale+™ MPSoC EG																				1924														533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											2			Zynq®UltraScale+™ FPGA, 926K+ Logic Cells			-
XCZU5CG-2FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD		PDG53K0800E2NM	CE, CSA, UL	Cutler Hammer, Div of Eaton Corp	Panel	204	Tray	XCZU5	活跃							0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC CG																			800 A															533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA														Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			-
M2S025-VF400	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	166 MHz	27696 LE	-	64 kB	VFBGA-400	微芯片技术	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S025-VF400	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.87					1.2000 V	1.14 V	1.26 V	207	Tray	M2S025	活跃		-	0 to 85 °C	SmartFusion®2	e0					Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS		BOTTOM	BALL		240	0.8 mm	not_compliant					S-PBGA-B400	160	不合格					1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB				MCU, FPGA	160		1.51 mm	现场可编程门阵列	STD			FPGA - 25K Logic Modules	23988	1 Core	256KB					17 mm	17 mm
XCZU5EG-2SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	Tray	XCZU5	活跃								252	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG																																		533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA														Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			-
XCZU17EG-3FFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	Tray	XCZU17	活跃								644	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG																																		600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA														Zynq®UltraScale+™ FPGA, 926K+ Logic Cells			-
M2S090T-FG676I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	BGA, BGA676,26X26,40	网格排列	3	微芯片技术	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	5.83	1.26 V	MICROSEMI CORP	活跃	Microsemi Corporation	SQUARE	BGA	M2S090T-FG676I	无					425	Tray	M2S090	活跃	-	166 MHz	86316 LE	SMD/SMT	-		64 kB	-40°C ~ 100°C (TJ)	1500	e0		活跃	面板安装		Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	120VAC	BOTTOM	BALL		240	1 mm	not_compliant					S-PBGA-B676	425	不合格			Terminals		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	Terminals	120VAC, 140VAC		MCU, FPGA	425		2.44 mm	现场可编程门阵列	8.810 L x 7.250 W x 13.000 H (223.77mm x 184.15mm x 330.20mm)			FPGA - 90K Logic Modules	86316	1 Core	512KB	15A (2.1kVA)				27 mm	27 mm
XCZU49DR-1FFVF1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD					622	Tray	活跃				0°C ~ 100°C (TJ)	*			活跃																															500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA														Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
M2S060TS-FCSG325I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)	Rectangle	325	微芯片技术	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S060TS-FCSG325I	TFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81			200	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3		PLASTIC/EPOXY	--	--	e1		活跃	泡沫外覆织物		Tin/Silver/Copper (Sn/Ag/Cu)		LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS		BOTTOM	BALL		250	0.5 mm	compliant					S-PBGA-B325	200	不合格					1.2 V		--	Adhesive	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB				MCU, FPGA	200		1.01 mm	现场可编程门阵列				FPGA - 60K Logic Modules	56520	1 Core	256KB				0.079 (2.00mm)	18.000 (457.20mm)	0.161 (4.10mm)	--
XCZU43DR-1FSVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	银合金	561	Tray	活跃						115V	28V	-40°C ~ 100°C (TJ)	44			活跃		2														5A (AC), 1A (DC)		--	焊片					Flatted (6.35mm Dia)		--					500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			1	MCU, FPGA		5.761 ~ 83gfm				Non-Shorting (BBM)		固定式	单刀双掷	26.04mm		1	45°	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-			轴和面板密封								11.10mm