N/A

-

BGA-484

484-FPBGA (23x23)

Polyester

微芯片技术

4695 LAB

Microchip Technology / Atmel

Details

-

64 kB

Tray

M2S050

活跃

125819

Brady

1.2000 V

1.14 V

1.26 V

有

This product may require additional documentation to export from the United States.

-

1.314 Mbit

166 MHz

56340 LE

267 I/O

64 kB

+ 85 C

0 C

60

SMD/SMT

0 to 85 °C

Tray

SmartFusion2

Warning Signs

SOC - Systems on a Chip

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

STD

Vinyl Chloride May Cause Cancer Authorized Personnel Only

FPGA - 50K Logic Modules

1 Core

White

256KB

English

SoC FPGA

N/A

-

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

活跃

3EU30

CE, CSA, UL

Altech

DIN Rail

308

Tray

XCZU19

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

30 A

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Motor

MCU, FPGA

Screw

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

BGA484,26X26,40

1.5 V

微芯片技术

40

1.425 V

85 °C

有

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.36

E57LBL30T110

10 mm

Cutler Hammer, Div of Eaton Co

1.5000 V

1.425 V

200000

1.575 V

MCU - 41, FPGA - 94

Tray

A2F200

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

0 to 85 °C

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

Shielded

250

1 mm

compliant

S-PBGA-B484

94

不合格

NC NPN

1.5,1.8,2.5,3.3 V

OTHER

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

Cable Connection

DC

30 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 1 month ago)

256-LBGA

YES

256-FPBGA (17x17)

256

3

PLASTIC/EPOXY

微芯片技术

BGA256,16X16,32

1.2 V

40

1.14 V

有

M2S010T-VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

GE - General Electric

1.2000 V

Non-Compliant

138

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

N/A

-

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU5

活跃

VH7441CS+3801D

Johnson Controls

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

N/A

-

676-BGA

676-FBGA (27x27)

Plastic

微芯片技术

64 kB

109252

Brady

1.2000 V

425

Tray

M2S090

活跃

-

166 MHz

86316 LE

SMD/SMT

-

-40 to 100 °C

SmartFusion®2

Pipe & Valve Marking

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

有

STD

热水回水

FPGA - 90K Logic Modules

1 Core

Green

512KB

White

English

N/A

-

676-BGA

YES

676-FBGA (27x27)

676

85 °C

有

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

-

166 MHz

86316 LE

-

64 kB

VH7441GT+3008E

Johnson Controls

1.2000 V

425

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

40

1.14 V

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

Tray

XCZU17

活跃

644

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

N/A

-

208-BFQFP

208-PQFP (28x28)

微芯片技术

Tray

A2F500M3G

Obsolete

MCU - 22, FPGA - 66

0°C ~ 85°C (TJ)

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

0.8500 V

0.808 V

0.892 V

464

Tray

XCZU7

活跃

0 to 110 °C

Zynq® UltraScale+™ MPSoC EV

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

N/A

-

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.8500 V

0.808 V

0.892 V

204

Tray

XCZU5

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

N/A

-

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

1.0000 V

212

Tray

XC7Z100

活跃

-40 to 100 °C

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Kintex™-7 FPGA, 444K Logic Cells

-

N/A

-

484-BFBGA, FCBGA

484-FCBGA (19x19)

微芯片技术

Johnson Controls

VG7844GT+423BGA

MCU - 136, FPGA - 108

Tray

活跃

-40°C ~ 125°C (TJ)

-

-

2.2MB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128KB

Threaded

N/A

-

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

402

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

N/A

-

N/A

-

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

N/A

-

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

478

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 80k Logic Cells

-

N/A

-

1369-BFBGA

1369-BGA (35x35)

AMD

478

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 80k Logic Cells

-

N/A

-

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

N/A

-

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

AMD

82

Tray

活跃

-40°C ~ 100°C (TJ)

-

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

N/A

-

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

AMD

82

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

N/A

-

1369-BFBGA

1369-BGA (35x35)

AMD

316

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

800MHz, 1.65GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

-

Tray

活跃

-40°C ~ 100°C (TJ)

Bag

Zynq® UltraScale+™ RFSoC DR

533MHz, 1.3GHz

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq® UltraScale+™ RFSoC

-

N/A

-

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

402

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

800MHz, 1.65GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

-

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-