类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | 终端 | 温度系数 | 类型 | 电阻 | 应用 | 电容量 | 子类别 | 额定功率 | 技术 | 屏蔽/屏蔽 | 样式 | 额定电流 | 频率 | 频率稳定性 | 终端样式 | 工作电源电压 | 引线间距 | 铅直径 | 电压 | 电感,电感 | 测试频率 | 负载电容 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 驱动电平 | 产品类别 | 工作温度范围 | 等效串联电阻 | 增益 | 输出格式 | 主要属性 | 频带数量 | 芯类型 | 闪光大小 | 产品 | 饱和电流 | 特征 | 产品类别 | 直径 | 高度 | 长度 | 宽度 | ||||||||||||||||||||||||||||||
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![]() | XCZU49DR-L1FFVF1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, no accessories | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 622 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-L1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-1FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, w/Stud Can | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-L1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Combos: 2, 3 or 4, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-L2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Term: ¼in Solder Lug Quick-Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | ±3% | 405uF | 370VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 3000 | KYOCERA AVX | KYOCERA AVX | Accu-L | Details | 480 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Reel | 0603, 0805 | Inductors, Chokes & Coils | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 固定电感器 | FPGA - 1.9M Logic Elements | - | 射频电感器 | RF Inductors - SMD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R24C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 1 | ITT Cannon | ITT Cannon | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | KPT | D-Sub Connectors | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | D-Sub Connectors - Standard Density | FPGA - 764K Logic Elements | - | D-Sub Standard Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB006R24C2E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Welwyn Components / TT Electronics | 576 | Tray | 活跃 | 2512 | 6432 | 0.001429 oz | 1800 | PCB 安装 | TT Electronics | 0°C ~ 100°C (TJ) | Reel | PWC | Resistors | 厚膜 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 厚膜电阻器 | FPGA - 573K Logic Elements | - | - | Thick Film Resistors - SMD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-2CLG225E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | AMD | - | - | Whip | 1 | 磁性安装 | 460 MHz | TE Connectivity | TE Connectivity / Laird External Antennas | UHF | - | 54 | Tray | XC7Z007 | 活跃 | 0°C ~ 100°C (TJ) | QW | 无源天线 | Mobile Antennas | Antennas | 带底座的直线型 | - | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | GPS Antennas - GNSS, GLONASS, Galileo, Beidou | Unity | Artix™-7 FPGA, 23K Logic Cells | 1 Band | - | 室外天线 | Antennas | 6 in | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU2EG-1SFVA625Q | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 0402 | 1005 | + 155 C | 0.000023 oz | - 55 C | 10000 | PCB 安装 | Vishay | Vishay / Dale | Details | 128 | Tray | XAZU2 | 活跃 | -40°C ~ 125°C (TJ) | Reel | RCWE | 1 % | 2 Terminal | 200 PPM / C | 厚膜表面贴装片式电阻器 | 80.6 mOhms | 电流感应 | Resistors | 125 mW (1/8 W) | 厚膜 | SMD/SMT | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 电流检测电阻器 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | 厚膜电阻器 | Current Sense Resistors - SMD | 0.35 mm | 1.05 mm | 0.55 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-L1FFVB1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 活跃 | 25 | 132041-0864 | ITT Cannon | ITT Cannon | Details | 328 | Tray | XCZU15 | -40°C ~ 100°C (TJ) | PL | Circular Connectors | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 圆形推拽连接器 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | 圆形推拽连接器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB012R24B2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Cable | - | - | Intel | Intel | Non-Compliant | 768 | Tray | 活跃 | 3 | Intel | 0°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | Intel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R25A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM2502-1LSEVSVC2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 100 V | 0603 | 1608 | + 155 C | 0.000071 oz | - 55 C | 1000 | PCB 安装 | 6-1879134-0 | TE Connectivity | TE Connectivity / Holsworthy | Details | MouseReel | RN73 | 0.1 % | 10 PPM / C | 贴片大功率精密电阻器 | 41.2 kOhms | Resistors | 62.5 mW (1/16 W) | Thin Film | SMD/SMT | 700 mV | 薄膜电阻器 | - 55 C to + 155 C | 精密薄膜贴片电阻器 | - | Thin Film Resistors - SMD | 0.45 mm | 1.55 mm | 0.8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE2202-1MSESFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5 mm x 3.2 mm | Details | + 60 C | 0.001764 oz | - 10 C | 1000 | SMD/SMT | CTS | CTS电子元件 | MouseReel | 445 | 30 PPM | SMD石英 | Crystals | 24.576 MHz | SMD/SMT | 800 mV | 12 pF | 100 uW | Crystals | 40 Ohms | Crystals | 1.35 mm | 5 mm | 3.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE2002-1MSESFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 100 | Cornell Dubilier | Cornell Dubilier - CDE | Details | + 100 C | 0 C | Bulk | 381LR | 220 uF | Capacitors | 800 mV | 电解电容器 | Aluminum Electrolytic Capacitors - Snap In | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE2202-1LLISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 200 C | 1.404962 oz | - 55 C | 50 | PCB 安装 | Bourns | J.W. Miller | 5 mOhms | Details | 24.3 A | Tray | 2300HT | 15 % | Standard | Toroidal | 大电流 | Inductors, Chokes & Coils | Unshielded | Radial | 700 mV | 0.56 in | 0.066 in | 8.2 uH | 1 kHz | 固定电感器 | Toroidal | 功率感应器 | Power Inductors - Leaded | 32.512 mm | 16.51 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE2102-1MSISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1500 | B41821A7687M000 | EPCOS / TDK | 35 VDC | EPCOS / TDK | Details | + 85 C | 0.091712 oz | - 40 C | Bulk | B41821 | 20 % | 680 uF | Capacitors | Radial | 800 mV | 电解电容器 | Aluminum Electrolytic Capacitors - Radial Leaded | 10 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1502-1LLIVSVA2785-ES9780 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 40 C | 500 | PCB 安装 | TT Electronics | BI Technologies / TT Electronics | 43 mOhms | 4.1 A | AEC-Q200 | + 155 C | Reel | HA78 | 20 % | Standard | Wirewound | Inductors, Chokes & Coils | Shielded | SMD/SMT | 700 mV | 22 uH | 1 kHz | 固定电感器 | 功率感应器 | 3.6 A | Power Inductors - SMD | 8 mm | 12.5 mm | 12.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE2302-1MLISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQVC1902-2HSIVSQA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Non-Compliant | + 110 C | - 40 C | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | 880 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1MSEVSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 mm x 5 mm | + 85 C | 3.6 V | - 40 C | 1000 | 3 V | SMD/SMT | CB3LV-5I-37.1250-T CB3LV-5I-37M125000 960-0009-0352FT | CTS | CTS电子元件 | Details | 55 % | CB3LV | Oscillators | 20 mA | 37.125 MHz | 25 PPM | SMD/SMT | 800 mV | 50 pF | 标准振荡器 | HCMOS, TTL | 标准时钟振荡器 | 1.8 mm | 7 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE2202-3HSESFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Vishay | Vishay / Huntington | Details | + 350 C | 1.807791 oz | - 55 C | 1 | 底座安装 | Bulk | FSOTXX 平坦部 | 5 % | 30 PPM / C | 75 Ohms | Resistors | 55 W | Wirewound | Screw | 880 mV | 绕线电阻 | - 55 C to + 350 C | 扁平管状电阻器 | Coated Resistors, Silicone Coated | Wirewound Resistors - Chassis Mount | 14.3 mm | 89 mm | 30 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE2102-1MSESFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AEC-Q200 | 150 V | 2010 | 5025 | + 125 C | 0.001199 oz | - 55 C | 1000 | PCB 安装 | Details | Welwyn Components / TT Electronics | TT Electronics | Reel | PCF | 0.1 % | 25 PPM / C | 10.5 Ohms | Resistors | 330 mW (1/3 W) | Thin Film | 800 mV | 薄膜电阻器 | - | Thin Film Resistors - SMD | 0.65 mm | 4.9 mm | 2.4 mm |
XCZU49DR-L1FFVF1760I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU43DR-L1FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU43DR-1FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU43DR-L1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU43DR-1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU48DR-L2FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
AGFA019R25A2E2V
Intel
分类:Embedded - System On Chip (SoC)
AGFB008R24C3E4X
Intel
分类:Embedded - System On Chip (SoC)
AGFB006R24C2E1V
Intel
分类:Embedded - System On Chip (SoC)
XC7Z007S-2CLG225E
AMD
分类:Embedded - System On Chip (SoC)
XAZU2EG-1SFVA625Q
AMD
分类:Embedded - System On Chip (SoC)
XCZU15EG-L1FFVB1156I
AMD
分类:Embedded - System On Chip (SoC)
AGFB012R24B2E2V
Intel
分类:Embedded - System On Chip (SoC)
AGFA023R25A2E3V
Intel
分类:Embedded - System On Chip (SoC)
XCVM2502-1LSEVSVC2197
Xilinx
分类:Embedded - System On Chip (SoC)
XCVE2202-1MSESFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
XCVE2002-1MSESFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
XCVE2202-1LLISFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
XCVE2102-1MSISFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
XCVP1502-1LLIVSVA2785-ES9780
Xilinx
分类:Embedded - System On Chip (SoC)
XCVE2302-1MLISFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
XQVC1902-2HSIVSQA2197
Xilinx
分类:Embedded - System On Chip (SoC)
XCVE1752-1MSEVSVG1369
Xilinx
分类:Embedded - System On Chip (SoC)
XCVE2202-3HSESFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
XCVE2102-1MSESFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
