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产品型号	品牌	数据表	库存	价格(含增值税)	数量	底架	包装/外壳	表面安装	供应商器件包装	质量	终端数量													厂商																																				操作温度	包装	系列	JESD-609代码	零件状态	类型	端子表面处理	颜色	HTS代码	子类别	螺距	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	额定电流	基本部件号	终端样式	JESD-30代码	输出的数量	资历状况	执行器类型	工作电源电压	电源	温度等级	注意	最大额定电流	速度	内存大小	核心处理器	极数	周边设备	程序内存大小	连接方式	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	正向电压	产品类别	收发器数量
XCVE2202-1MSISFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		- 40 C	1	Xilinx	Xilinx							+ 110 C										SOC - Systems on a Chip																800 mV																				System-On-Modules - SOM												SoC FPGA
XCVE2202-1MLISFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		- 40 C	1	Xilinx	Xilinx							+ 110 C										SOC - Systems on a Chip																800 mV																				System-On-Modules - SOM												SoC FPGA
XQVM1802-2MLIVFQC1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		- 40 C	1	Xilinx	Xilinx							+ 110 C										SOC - Systems on a Chip																800 mV																				System-On-Modules - SOM												SoC FPGA
XCVE2002-3HSESFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		0 C	1	Xilinx	Xilinx							+ 100 C										SOC - Systems on a Chip																880 mV																				System-On-Modules - SOM												SoC FPGA
XCVE1752-2HSIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装		+ 110 C	- 40 C	1	Xilinx	Xilinx						Compliant								White		SOC - Systems on a Chip																880 mV				300 mA					100 °							175 mA			3 V	System-On-Modules - SOM										90		SoC FPGA
XCVE2002-1MSISFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1					Non-Compliant	+ 110 C	- 40 C	1	Xilinx	Xilinx													SOC - Systems on a Chip																800 mV																				System-On-Modules - SOM												SoC FPGA
XCVC1702-2HSIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		- 40 C	1	Xilinx	Xilinx							+ 110 C										SOC - Systems on a Chip																880 mV																				System-On-Modules - SOM												SoC FPGA
XCZU43DR-1FFVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思			561	Tray	活跃			0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																												500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™			DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells							-
XCZU47DR-2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思			366	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																												533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™			DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells							-
5CSEBA4U23C7SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Box	672-FBGA	672-UBGA (23x23)	580 g	Compliant	MCU - 181, FPGA - 145				0°C ~ 85°C (TJ)	Tray	Cyclone® V SE		活跃																										800MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									FPGA - 40K Logic Elements							--							Unknown
5ASTMD3E3F31I5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	BGA896,30X30,40	-40 °C	1.1 V	未说明	1.07 V	100 °C	有	5ASTMD3E3F31I5N		BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.29			MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	Arria V ST	e1	活跃		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	现场可编程门阵列			BOTTOM	BALL	未说明	1 mm		compliant		5ASTMD3		S-PBGA-B896	540	不合格			1.1,1.2/3.3,2.5 V	INDUSTRIAL			800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS		2.7 mm	现场可编程门阵列				FPGA - 350K Logic Elements		13207	350000				--					31 mm	31 mm
5ASTFD5K3F40I5NES	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FBGA (40x40)					MCU - 208, FPGA - 540		-40°C ~ 100°C (TJ)	Tray	Arria V ST		Obsolete															5ASTFD5											800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									FPGA - 462K Logic Elements							--
10AS022E4F29E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780		Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS022E4F29E3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46				288	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	220000 LE	1	SMD/SMT	27500 LAB	973476	Intel	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃				8542.39.00.01	SOC - Systems on a Chip		CMOS	BOTTOM	BALL	未说明	1 mm		compliant				S-PBGA-B780	288	不合格			0.9 V	OTHER			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288			3.35 mm	现场可编程门阵列		SoC FPGA		FPGA - 220K Logic Elements	3/8 in	220000	2 Core	Square	76 mm	--		SoC FPGA		29 mm	29 mm
AGFB022R31C2I1VAA	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			720	Tray	活跃			-40°C ~ 100°C (TJ)		Agilex F																												1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 2.2M Logic Elements							-
XCVP1502-2MLEVSVA3340	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3340-BFBGA	3340-BGA (55x55)	AMD	无	Fix mounted	486	Tray	活跃					3	无	IP65/IP67	With screws	3	0°C ~ 100°C (TJ)		Versal® Premium														56.9														600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™			DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ Premium FPGA, 3.7M Logic Cells							-				25.4		44.5
1SX280LH3F55I3VG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-2912	1160	-	4 x 32 kB	Details	Stratix	Intel / Altera	Intel	956216	350000 LAB	SMD/SMT	10	- 40 C		+ 100 C	2800000 LE	1 GHz	4 x 32 kB	This product may require additional documentation to export from the United States.	有						-40°C ~ 100°C (TJ)	Tray	Stratix® 10 SX		活跃					SOC - Systems on a Chip																0.85 V					1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™			DMA, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							SoC FPGA	24 Transceiver	FPGA - 2800K Logic Elements				4 Core			--			SoC FPGA
10AS022E4F27I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-672	YES	672	Intel		Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS022E4F27I3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.48				240	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	220000 LE	1	SMD/SMT	27500 LAB	964750	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃				8542.39.00.01	SOC - Systems on a Chip		CMOS	BOTTOM	BALL	未说明	1 mm		compliant				S-PBGA-B672	240	不合格			0.9 V	INDUSTRIAL			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240			3.25 mm	现场可编程门阵列		SoC FPGA		FPGA - 220K Logic Elements		220000	2 Core			--		SoC FPGA		27 mm	27 mm
10AS066N2F40I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517		Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS066N2F40I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46			588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	21	SMD/SMT	82500 LAB	965031	Intel	Intel / Altera	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃				8542.39.00.01	SOC - Systems on a Chip		CMOS	BOTTOM	BALL	未说明	1 mm		compliant				S-PBGA-B1517	588	不合格			0.9 V	INDUSTRIAL			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	588			3.5 mm	现场可编程门阵列		SoC FPGA		FPGA - 660K Logic Elements		660000	2 Core			--		SoC FPGA		40 mm	40 mm
10AS048E2F29I1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	780-FBGA (29x29)	INTEL CORP	5.68					360	有	2 x 32 kB	1.2 GHz	480000 LE	+ 100 C	- 40 C	1	SMD/SMT	60000 LAB	965033	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	有	10AS048E2F29I1HG	活跃	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃					SOC - Systems on a Chip								unknown								950 mV					1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							SoC FPGA	12 Transceiver	FPGA - 480K Logic Elements				2 Core			--			SoC FPGA
10AS066K4F35I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	24	SMD/SMT	82500 LAB	965078	Intel	Intel / Altera		Arria 10 SoC	Details	2 x 32 kB	-					396	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃					SOC - Systems on a Chip																					1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							SoC FPGA		FPGA - 660K Logic Elements				2 Core			--			SoC FPGA
AGFB008R16A2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	384	Tray	活跃					有	PCB	-40°C ~ 100°C (TJ)		COMBICON MKKDS								5 mm																		-		1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 764K Logic Elements							-
AGFB022R25A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		有	624	Tray	活跃				0°C ~ 100°C (TJ)		Agilex F																												1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 2.2M Logic Elements							-
XCZU43DR-2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思		有	561	Tray	活跃				-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																												533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™			DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells							-
XCZU47DR-2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思		有	366	Tray	活跃				-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																												533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™			DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells							-
MPFS250T-1FCVG484E	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCVG-484	484-FCBGA (19x19)	微芯片技术	Sensata	不发光	AIRPAX	AIRPAX	This product may require additional documentation to export from the United States.	16 kB, 4 x 32 kB	667 MHz, 667 MHz	254000 LE	372 I/O	+ 100 C	0 C	4 x 32 kB	-	Tray	活跃					6.349313 oz	3	面板安装	0°C ~ 100°C	Tray	LEL/LML			Hydraulic-Magnetic				断路器									60 A		Stud				Handle	1 V					-	2.2MB	RISC-V	2 Pole		DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							断路器		FPGA - 254K Logic Modules				5 Core			128kB		电路保护器	断路器