类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | JESD-609代码 | 零件状态 | ECCN 代码 | 温度系数 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 应用 | HTS代码 | 子类别 | 额定功率 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 核心架构 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 特征 | 产品类别 | 高度 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 10AS016E3F29E1SG | ALTERA | 数据表 | 46 In Stock | - | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | 200 V | 1210 | 3225 | + 155 C | 0.000564 oz | - 55 C | 5000 | PCB 安装 | Royalohm | Royalohm | Details | 288 | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS016E3F29E1SG | BGA | SQUARE | Obsolete | INTEL CORP | 0.93 V | 5.67 | 0°C ~ 100°C (TJ) | Reel | General Purpose Thick Film | 1 % | Discontinued at Digi-Key | 100 PPM / C | 16.5 Ohms | 通用型 | 8542.39.00.01 | Resistors | 500 mW (1/2 W) | 厚膜 | BOTTOM | BALL | 未说明 | 1 mm | compliant | SMD/SMT | S-PBGA-B780 | 288 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | 现场可编程门阵列 | 厚膜电阻器 | FPGA - 160K Logic Elements | 160000 | -- | Wrap-Around Termination | Thick Film Resistors - SMD | 0.55 mm | 3.1 mm | 2.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24B2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 768 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-L1FBVB900I | AMD | 数据表 | 827 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM47622LA1KFEBG | AVAGO | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 200 V | 500 mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA2U23C8SN | ALTERA | 数据表 | 960 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 484 | 672-UBGA (23x23) | 672 | 活跃 | FPGA - Field Programmable Gate Array CycloneV SoC SE SNGL -core ARM Cortex-A9 | INTEL CORP | 1.13 V | 2.04 | Non-Compliant | MCU - 181, FPGA - 145 | 8542390000 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEBA2U23C8SN | FBGA | SQUARE | Intel Corporation | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 600 MHz | S-PBGA-B672 | 145 | 不合格 | 1.1 V | 1.1,1.2/3.3,2.5 V | OTHER | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 600MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F27E2LG | ALTERA | 数据表 | 883 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | 240 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 160000 LE | 1 | SMD/SMT | 20000 LAB | 964683 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS016E3F27E2LG | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-2FSVG1517E | Xilinx | 数据表 | 360 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | Non-Compliant | 561 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-2FFG900E | AMD | 数据表 | 607 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 130 | Tray | XC7Z045 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C2E2VAA | Intel | 数据表 | 554 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-1LLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Non-Compliant | RAM, SRAM | 692 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 85 °C | -40 °C | Parallel | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R25A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 50 V | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1 % | 100 ppm/°C | 1.93 kΩ | 155 °C | -55 °C | Thin Film | 100 mW | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | 550 µm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-1FFVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | -10 - 55 | 6.6 | 有 | 380 - 480 | Other | Grey | 10 | Other | Other | 1.5 | 无 | 无 | 有 | Other | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 50 - 60 | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 1.5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FCG1152M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | 574 | Tray | M2S150 | 活跃 | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-FCVG784E | Microchip | 数据表 | 2577 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 微芯片技术 | 100 V | MCU - 136, FPGA - 312 | Tray | 活跃 | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 161000 LE | + 100 C | 0 C | SMD/SMT | 4 x 32 kB | - | 0°C ~ 100°C | PolarFire™ | 0.1 % | 100 ppm/°C | 715 Ω | 155 °C | -55 °C | Thin Film | 125 mW | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | 650 µm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS025TS-1FCSG325I | Microchip | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA | 325-BGA (11x11) | 微芯片技术 | Tray | 活跃 | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 23000 LE | + 100 C | - 40 C | SMD/SMT | 4 x 32 kB | - | MCU - 102, FPGA - 80 | -40°C ~ 100°C | - | 1 V | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 23K Logic Modules | 5 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA2U23I7N | ALTERA | 数据表 | 2909 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 484 | 672-UBGA (23x23) | 672 | 活跃 | FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9 | INTEL CORP | 1.13 V | 2 | 有 | MCU - 181, FPGA - 145 | 8542390000 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | 3 | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 有 | 5CSEBA2U23I7N | FBGA | SQUARE | Intel Corporation | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | 活跃 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 800 MHz | S-PBGA-B672 | 145 | 不合格 | 1.1 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-1FG484M | Microchip | 数据表 | 2178 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | Non-Compliant | 267 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | M2S050TS-1FG484M | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1TQ144I | Microchip | 数据表 | 2687 In Stock | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | QFP144,.87SQ,20 | PLASTIC/EPOXY | 3 | 84 | Tray | Obsolete | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 5.88 | 1.26 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | LFQFP | M2S010-1TQ144I | 无 | 1.14 V | 30 | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | MCU - 22, FPGA - 66 | Tray | A2F200 | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-1FG484M | Microchip | 数据表 | 2558 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 5.81 | 150 V | 233 | Tray | M2S010 | 活跃 | - | 166 MHz | 12084 LE | SMD/SMT | - | 64 kB | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | M2S010T-1FG484M | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | 1 % | e0 | 3A001.A.2.C | 50 ppm/°C | 3.4 Ω | Tin/Lead (Sn/Pb) | 155 °C | -55 °C | Thin Film | 8542.39.00.01 | 现场可编程门阵列 | 250 mW | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 650 µm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1TQ144 | Microchip | 数据表 | 2686 In Stock | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH1F35E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 活跃 | Tray | 392 | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - |
10AS016E3F29E1SG
ALTERA
分类:Embedded - System On Chip (SoC)
AGFA012R24B2E4X
Intel
分类:Embedded - System On Chip (SoC)
XCZU7CG-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
25,891.936376
AGFB027R31C2I2V
Intel
分类:Embedded - System On Chip (SoC)
BCM47622LA1KFEBG
AVAGO
分类:Embedded - System On Chip (SoC)
XCZU7EV-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
5CSEBA2U23C8SN
ALTERA
分类:Embedded - System On Chip (SoC)
545.239606
10AS016E3F27E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
7,141.924667
XCZU47DR-2FSVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z045-2FFG900E
AMD
分类:Embedded - System On Chip (SoC)
18,045.957232
AGFB027R31C2E2VAA
Intel
分类:Embedded - System On Chip (SoC)
193,389.925141
XCVC1802-1LLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
AGFB027R25A2E3V
Intel
分类:Embedded - System On Chip (SoC)
XCZU48DR-1FFVE1156E
Xilinx
分类:Embedded - System On Chip (SoC)
M2S150T-1FCG1152M
Microchip
分类:Embedded - System On Chip (SoC)
MPFS160T-FCVG784E
Microchip
分类:Embedded - System On Chip (SoC)
1,920.909530
MPFS025TS-1FCSG325I
Microchip
分类:Embedded - System On Chip (SoC)
484.828611
5CSEBA2U23I7N
ALTERA
分类:Embedded - System On Chip (SoC)
1,087.432501
M2S050TS-1FG484M
Microchip
分类:Embedded - System On Chip (SoC)
2,771.340519
M2S010-1TQ144I
Microchip
分类:Embedded - System On Chip (SoC)
A2F200M3F-1PQ208
Microchip
分类:Embedded - System On Chip (SoC)
M2S010T-1FG484M
Microchip
分类:Embedded - System On Chip (SoC)
1,079.313894
M2S005S-TQ144
Microchip
分类:Embedded - System On Chip (SoC)
M2S010-1TQ144
Microchip
分类:Embedded - System On Chip (SoC)
1SX065HH1F35E2LG
Intel
分类:Embedded - System On Chip (SoC)
