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类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	触点镀层	底架	安装类型	包装/外壳	引脚数	供应商器件包装	房屋材料			厂商						操作温度	包装	系列	尺寸/尺寸	零件状态	终端	连接器类型	类型	定位的数量	最高工作温度	最小工作温度	性别	紧固类型	额定功率	电压 - 供电	频率	频率稳定性	输出量	功能	基本谐振器	最大电流源	接头数量	ESR（等效串联电阻）	电流 - 电源（禁用）（最大值）	负载电容	速度	内存大小	操作模式	核心处理器	频率容差	周边设备	扩频带宽	连接方式	建筑学	逻辑元件/单元数	轴承类型	总 RAM 位数	LABs数量/ CLBs数量	速度等级	绝对牵引范围 (APR)	主要属性	闪光大小	高度	座位高度(最大)	长度	宽度	无铅
XCZU17EG-1FFVC1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)		512	Tray	AMD	活跃					-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	-
XCVC1902-2MLIVIVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)		500	Tray	AMD	活跃					-40°C ~ 100°C (TJ)		Versal™ AI Core																							600MHz, 1.4GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.9M Logic Cells	-
XCVC1802-1MLIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)		692	Tray	AMD	活跃					-40°C ~ 100°C (TJ)		Versal™ AI Core																							600MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.5M Logic Cells	-
XAZU11EG-1FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)		464	Tray	AMD	活跃					-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	-
XCZU2EG-1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA		484-FCBGA (19x19)		82	Tray	AMD	XCZU2	活跃				-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	-
XC7Z030-1FB484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Gold	自由悬挂	484-BBGA, FCBGA	66	484-FCBGA (23x23)	Non-Compliant	130	AMD	Bulk	XC7Z030	活跃			-40°C ~ 100°C (TJ)	Bulk	Zynq®-7000			Crimp	Plug		66	175 °C	-65 °C	Male	Threaded									66				667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Kintex™-7 FPGA, 125K Logic Cells	-	Shielded					抗环境干扰
XC7Z007S-2CLG225I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	225-LFBGA, CSPBGA		225-CSPBGA (13x13)		54	Tray	AMD	XC7Z007	活跃				-40°C ~ 100°C (TJ)		Zynq®-7000																							766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Artix™-7 FPGA, 23K Logic Cells	-
XCZU3EG-2SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1		625-BFBGA, FCBGA		625-FCBGA (21x21)		Non-Compliant	180	AMD	Tray	XCZU3	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	-
XCZU9CG-1FFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	1156-FCBGA (35x35)		328	Tray	AMD	XCZU9	活跃				-20°C ~ 70°C	Tape & Reel (TR)	SiT8208	0.106 L x 0.094 W (2.70mm x 2.40mm)	活跃			XO (Standard)							3.3V	16MHz	±10ppm	LVCMOS, LVTTL	Enable/Disable	MEMS	33mA			31mA		500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					1	--	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	-			0.032 (0.80mm)			--
AGFA012R24C2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-		744	Tray	Intel	活跃					-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 1.2M Logic Elements	-
AGFB006R24C3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-		576	Tray	Intel	活跃					0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 573K Logic Elements	-
XCZU6EG-2FFVC900I	AMD	数据表	536 In Stock	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA		900-FCBGA (31x31)		204	Tray	AMD	XCZU6	活跃				-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					2		Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	-
XCZU6CG-L2FFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA		900-FCBGA (31x31)		204	Tray	AMD	XCZU6	活跃				0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																							533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	-
XCVC1802-1LSEVIVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)		500	Tray	AMD	活跃					0°C ~ 100°C (TJ)		Versal™ AI Core																							400MHz, 1GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.5M Logic Cells	-
XCZU9CG-L1FFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA		1156-FCBGA (35x35)		328	Bulk	AMD	XCZU9	活跃				-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																							500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	-
M2S010-1VFG400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA		400-VFBGA (17x17)		195	Tray	微芯片技术	M2S010	活跃				-40°C ~ 100°C (TJ)		SmartFusion®2																							166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1		FPGA - 10K Logic Modules	256KB
AGFA006R16A3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-		Bulk	活跃	PEI-Genesis	384					0°C ~ 100°C (TJ)		*																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 573K Logic Elements	-
XCVP1802-1MSELSVC4072	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	2-SMD, No Lead		活跃	435F	CTS-Frequency Controls	Tape & Reel (TR)					-40°C ~ 85°C		435	0.197 L x 0.126 W (5.00mm x 3.20mm)				兆赫晶体								25 MHz	±30ppm						40 Ohms		18pF			Fundamental		±25ppm															0.043 (1.10mm)			-
XCZU4EG-1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1				900-BBGA, FCBGA		900-FCBGA (31x31)	Plastic	12 V	Compliant	AMD	55.62 CFM	204	Tray	XCZU4	活跃	-40°C ~ 100°C (TJ)	Box	Zynq® UltraScale+™ MPSoC EG			电线引线								10.2 W												500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Ball					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	-	60 mm		60 mm	38 mm	无铅
AGFB012R24C2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-		744	Tray	Intel	活跃					-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 1.2M Logic Elements	-
AGFA023R25A2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-		480	Tray	Intel	活跃					-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 2.3M Logic Elements	-
XCVC1502-2MSIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	676-BGA	676-FBGA (27x27)		396	Tray	AMD	XC6SLX150	活跃				-40°C ~ 100°C (TJ)		Spartan®-6 LXT												1.14V ~ 1.26V											600MHz, 1.4GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	147443		4939776	11519			Versal™ AI Core FPGA, 800k Logic Cells	-
AGFB014R24C2E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-		744	Tray	Intel	活跃					0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 1.4M Logic Elements	-
XCZU15EG-3FFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA		900-FCBGA (31x31)		零售包装	活跃	Glenair	204	XCZU15				0°C ~ 100°C (TJ)		*																							600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					3		Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	-
XCZU19EG-1FFVE1924E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	1924-FCBGA (45x45)		Tape & Reel (TR)	SG-8101	EPSON	活跃	668				-40°C ~ 105°C		SG-8101	0.276 L x 0.197 W (7.00mm x 5.00mm)				XO (Standard)							1.8V ~ 3.3V	14.125 MHz	±20ppm	CMOS	Enable/Disable	Crystal	6.8mA (Typ)			3.5mA		500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT	-	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						-	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	-			0.055 (1.40mm)			-