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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量																					厂商																															Voltage-Input	操作温度	包装	系列	JESD-609代码	无铅代码	零件状态	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	基本部件号	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	速度	内存大小	输出电流	核心处理器	周边设备	程序内存大小	连接方式	电压 - 输出	建筑学	数据总线宽度	频率开关	输入数量	组织结构	座位高度-最大	使用的 IC/零件	提供的内容
A2F500M3G-FGG256I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LBGA	256-FPBGA (17x17)	微芯片技术	A2F500	活跃					MCU - 25, FPGA - 66	Tray		-40°C ~ 100°C (TJ)		SmartFusion®																										80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART		MCU, FPGA												STD		ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops								512KB
IMX8XMIPI4CAM	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1
PIMX8UX6AVLFZAB	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCZU6CG-2FFVB1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	活跃					0.8500 V	0.808 V	0.892 V	328	Bulk	XCZU6		0 to 100 °C		*			活跃																							533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA												2		Zynq®UltraScale+™ FPGA, 469K+ Logic Cells								-
XC7Z014S-2CLG484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-LFBGA, CSPBGA	484-CSPBGA (19x19)	AMD	活跃					1.0000 V	0.95 V	1.05 V	200	Tray	XC7Z014	5 V ~ 15 V	-40 to 100 °C		--			活跃														LT1425									766MHz	256KB	--	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	±15V	MCU, FPGA		--				LT1425	Board(s)				Fully Populated	2	DC/DC Converter	Artix™-7 FPGA, 65K Logic Cells	2, Isolated		反激式					-
XCZU43DR-L1FSVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	Tray	活跃					561		-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																										500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA														Zynq®UltraScale+™ FPGA, 930K+ Logic Cells								-
XCZU49DR-2FSVF1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD	有	表面贴装	622	Tray	活跃	Industrial grade					RISC	1.8/2.5/3.3 V	FCBGA	6	CAN/Serial I2C/SPI/UART/USB		-40 to 100 °C		Zynq® UltraScale+™ RFSoC																						0.85 V			CAN/Serial I2C/SPI/U	533MHz, 1.333GHz	256 KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	64 Bit									Industrial				Zynq®UltraScale+™ FPGA, 930K+ Logic Cells								-		ARM Cortex-A53/Arm Cortex-R5
M2S150-1FCVG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	微芯片技术	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.77			273	Tray	M2S150	活跃	-	166 MHz	146124 LE	-	64 kB	VFBGA-484	GRID ARRAY, FINE PITCH	4	PLASTIC/EPOXY	BGA484,22X22,32	1.2 V	40	1.14 V	85 °C	有	M2S150-1FCVG484	FBGA		0°C ~ 85°C (TJ)		SmartFusion®2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B484	273	不合格		1.2 V	OTHER		166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA			273		3.15 mm			现场可编程门阵列						FPGA - 150K Logic Modules					146124	1 Core		512KB			19 mm	19 mm
M2S060T-1VFG400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400	400-VFBGA (17x17)	400	微芯片技术	1.14 V	有	M2S060T-1VFG400I	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81	1.2000 V	1.14 V	1.26 V	Compliant	207	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40		-40 to 100 °C		SmartFusion®2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B400	207	不合格	1.2 V	1.2 V			166MHz	164.3 kB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA			207		1.51 mm			现场可编程门阵列				1		FPGA - 60K Logic Modules					56520	1 Core		256KB			17 mm	17 mm
M2S150T-FCG1152I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	微芯片技术	有	M2S150T-FCG1152I	BGA	SQUARE	Microsemi Corporation	5.77	1.26 V	MICROSEMI CORP	活跃		Non-Compliant	574	Tray	M2S150	活跃	-	166 MHz	146124 LE	+ 100 C	- 40 C	SMD/SMT	-	64 kB	BGA, BGA1152,34X34,40	网格排列	4	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	1.14 V		-40°C ~ 100°C (TJ)		SmartFusion®2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm	compliant	40			S-PBGA-B1152	574	不合格	1.2 V	1.2 V			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA			574		2.9 mm			现场可编程门阵列						FPGA - 150K Logic Modules					146124	1 Core		512KB			35 mm	35 mm
M2S025T-FGG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	微芯片技术	1.2000 V	1.14 V	1.26 V	有	-	166 MHz	27696 LE	273 I/O	+ 85 C	0 C	60	SMD/SMT	2308 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB	Tray	M2S025	活跃						0 to 85 °C	Tray	SmartFusion2									SOC - Systems on a Chip													1.2 V				166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA									SoC FPGA			STD		FPGA - 25K Logic Modules						1 Core		256KB	SoC FPGA
XAZU4EV-L1SFVC784I	AMD	数据表	86 In Stock	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	活跃					0.7200 V	0.698 V	0.742 V	252	Tray	XAZU4		-40 to 100 °C		Zynq® UltraScale+™ MPSoC EV																										500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA												1L		Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								-
M2S010T-1FG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	BGA484,22X22,40	1.2 V	30	微芯片技术	1.14 V	85 °C	无	M2S010T-1FG484	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.3			1.2000 V	1.14 V	1.26 V	233	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY		0 to 85 °C		SmartFusion®2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484	233	不合格		1.2 V	OTHER		166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA			233		2.44 mm			现场可编程门阵列				1		FPGA - 10K Logic Modules					9744	1 Core		256KB			23 mm	23 mm
M2S150T-1FCV484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	微芯片技术	1.26 V	273	Tray	M2S150	活跃	-	166 MHz	146124 LE	-	64 kB					1.2000 V	1.14 V		-40 to 100 °C		SmartFusion®2																										166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA												1		FPGA - 150K Logic Modules						1 Core		512KB
M2S010T-1VF400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	活跃	微芯片技术	MICROSEMI CORP	1.26 V	5.3	-	166 MHz	12084 LE	SMD/SMT	-	64 kB			1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S010T-1VF400I	LFBGA	SQUARE	Microsemi Corporation		-40 to 100 °C		SmartFusion®2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	160	不合格		1.2 V			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA			160		1.51 mm			现场可编程门阵列				1		FPGA - 10K Logic Modules					9744	1 Core		256KB			17 mm	17 mm
XCZU7EG-1FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	0.808 V	0.892 V	360	Tray	XCZU7	活跃						-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																										500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA												1		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells								-
M2S090T-1FGG676I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	微芯片技术	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	1.14 V	有	M2S090T-1FGG676I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.78			1.2000 V	425	Tray	M2S090		-40 to 100 °C		SmartFusion®2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm	compliant	40			S-PBGA-B676	425	不合格		1.2 V			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA			425		2.44 mm			现场可编程门阵列				1		FPGA - 90K Logic Modules					86316			512KB			27 mm	27 mm
M2S150-1FCG1152I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	微芯片技术	-	166 MHz	146124 LE	SMD/SMT	-	64 kB					1.2000 V	574	Tray	M2S150	活跃		-40 to 100 °C		SmartFusion®2																										166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA												1		FPGA - 150K Logic Modules						1 Core		512KB
M2S010TS-1VFG400T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术		1.2000 V	195	Tray	M2S010	活跃	,	40	有	M2S010TS-1VFG400T2	Microsemi Corporation	活跃	MICROSEMI CORP	5.8					0 to 85 °C		Automotive, AEC-Q100, SmartFusion®2	e1	有		Tin/Silver/Copper (Sn/Ag/Cu)									250		compliant											166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA								现场可编程门阵列				1		FPGA - 10K Logic Modules								256KB
XCZU11EG-2FFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	XCZU11	活跃					488	Tray		0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																										533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA														Zynq®UltraScale+™ FPGA, 653K+ Logic Cells								-
A2F200M3F-CSG288	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	288-TFBGA, CSPBGA	YES	288-CSP (11x11)	288	微芯片技术	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.575 V	5.23			1.5000 V	1.425 V	200000	1.575 V	MCU - 31, FPGA - 78	Tray	A2F200	活跃	11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA288,21X21,20	1.5 V	未说明	1.425 V	85 °C	有	A2F200M3F-CSG288	80 MHz	TFBGA		0 to 85 °C		SmartFusion®	e1			Tin/Silver/Copper (Sn/Ag/Cu)					现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.5 mm	compliant				S-PBGA-B288	78	不合格		1.5,1.8,2.5,3.3 V	OTHER		80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART		MCU, FPGA			78	4608 CLBS, 200000 GATES	1.05 mm			现场可编程门阵列				STD		ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops				4608	4608		200000	256KB			11 mm	11 mm
A2F200M3F-PQG208I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	208-BFQFP	YES	208-PQFP (28x28)	208	微芯片技术	活跃	MICROSEMI CORP	1.575 V	1.51			1.5000 V	1.425 V	200000	1.575 V	MCU - 22, FPGA - 66	Tray	A2F200	活跃	FQFP, QFP208,1.2SQ,20	FLATPACK, FINE PITCH	3	PLASTIC/EPOXY	QFP208,1.2SQ,20	1.5 V	30	1.425 V	有	A2F200M3F-PQG208I	80 MHz	FQFP	SQUARE	Microsemi Corporation		-40 to 100 °C		SmartFusion®				Pure Matte Tin (Sn)				8542.39.00.01	现场可编程门阵列	CMOS	QUAD	鸥翼	245	0.5 mm	compliant				S-PQFP-G208	66	不合格		1.5,1.8,2.5,3.3 V			80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART		MCU, FPGA			66	4608 CLBS, 200000 GATES	4.1 mm			现场可编程门阵列				STD		ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops				4608	4608		200000	256KB			28 mm	28 mm
XCZU17EG-2FFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	XCZU17	活跃					644	Tray		-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																										533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA														Zynq®UltraScale+™ FPGA, 926K+ Logic Cells								-
XCZU17EG-1FFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	XCZU17	活跃					644	Tray		-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																										500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA														Zynq®UltraScale+™ FPGA, 926K+ Logic Cells								-
XCZU4EV-2FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	活跃	Industrial grade					192,150	0.8500 V	0.808 V	204	0.892 V	204	Tray	XCZU4		-40 to 100 °C		Zynq® UltraScale+™ MPSoC EV																		900								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA										Industrial		2		Zynq®UltraScale+™ FPGA, 192K+ Logic Cells		175,680						-