类别是'category.片上系统(SoC)' (7695)

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图片

产品型号

品牌

数据表

库存

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数量

Rohs

安装类型

包装/外壳

表面安装

越来越多的功能

触点形状

外壳材料

供应商器件包装

插入材料

终端数量

后壳材料,电镀

第一种连接器安装类型

第二个连接器安装类型

厂商

Voltage-Input

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

终端

温度系数

连接器类型

类型

电阻

定位的数量

组成

颜色

应用

功率(瓦特)

HTS代码

电容量

紧固类型

子类别

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额定电流

技术

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

样式

Reach合规守则

外壳完成

外壳尺寸-插入

JESD-30代码

输出的数量

资历状况

房屋颜色

失败率

引线间距

电源

温度等级

注意

振荡器类型

速度

内存大小

反向泄漏电流@ Vr

外壳尺寸,MIL

不同 If 时电压 - 正向 (Vf)

引线样式

电压 - 供电 (Vcc/Vdd)

输出电流

核心处理器

周边设备

程序存储器类型

芯尺寸

程序内存大小

连接方式

功率 - 最大

电缆开口

电压 - 输出

建筑学

频率开关

输入数量

座位高度-最大

使用的 IC/零件

提供的内容

可编程逻辑类型

电压 - 齐纳(标准值)(Vz)

产品类别

包括

第一个连接器

第二个连接器

EEPROM 大小

板型

主要目的

主要属性

输出和类型

调节器拓扑

逻辑单元数

核数量

闪光大小

特征

产品类别

座位高度(最大)

长度

宽度

厚度(最大)

触点表面处理厚度 - 配套

材料可燃性等级

评级结果

10AS022E3F27I2SG
10AS022E3F27I2SG
ALTERA 数据表

824 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

FBGA-672

YES

Flange

Circular

铝合金

-

672

220000 LE

1

SMD/SMT

27500 LAB

964738

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

Conesys

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS022E3F27I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Box

D38999/20FJ

20 (2), 10 Power (9)

活跃

240

Non-Compliant

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

-65°C ~ 200°C

Tray

Military, MIL-DTL-38999 Series III, Tri-Start™ TV

活跃

插座外壳

用于内螺纹插座

11 (2 + 9 Power)

8542.39.00.01

Threaded

SOC - Systems on a Chip

Crimp

CMOS

BOTTOM

E

BALL

Shielded

未说明

抗环境干扰

1 mm

compliant

化学镍

25-11

S-PBGA-B672

240

不合格

Silver

0.9 V

INDUSTRIAL

不包括触点

1.5GHz

256KB

J

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

-

FPGA - 220K Logic Elements

220000

2 Core

--

-

SoC FPGA

27 mm

27 mm

-

10AS032E2F27I2SG
10AS032E2F27I2SG
ALTERA 数据表

683 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-672

YES

672

320000 LE

1

SMD/SMT

40000 LAB

964963

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

Vishay Sfernice

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS032E2F27I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Tape & Reel (TR)

最后一次购买

240

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

27 mm

27 mm

10AS022E3F29E2LG
10AS022E3F29E2LG
ALTERA 数据表

741 In Stock

-

最小起订量: 1

最小包装量: 1

0603 (1608 Metric)

YES

0603

780

1.2 GHz

220000 LE

1

SMD/SMT

27500 LAB

964739

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

KOA Speer Electronics, Inc.

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

10AS022E3F29E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Tape & Reel (TR)

RN731J

Obsolete

288

Non-Compliant

This product may require additional documentation to export from the United States.

2 x 32 kB

-55°C ~ 155°C

Tray

RN73

0.063 L x 0.031 W (1.60mm x 0.80mm)

±0.5%

活跃

2

±10ppm/°C

517 Ohms

Thin Film

0.063W, 1/16W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

现场可编程门阵列

SoC FPGA

FPGA - 220K Logic Elements

220000

2 Core

--

Moisture Resistant

SoC FPGA

0.022 (0.55mm)

29 mm

29 mm

10AS057K3F35E2SG
10AS057K3F35E2SG
ALTERA 数据表

895 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

1152-BBGA, FCBGA

YES

Bulkhead - Front Side Nut

Composite

1152-FCBGA (35x35)

Thermoplastic

1152

-

TE Connectivity Deutsch 连接器

0.93 V

5.45

-

Bulk

Composite

ACT94

Discontinued at Digi-Key

Copper Alloy

Gold

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

10AS057K3F35E2SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

-65°C ~ 175°C

Tray

MIL-DTL-38999 Series III, ACT

活跃

Crimp

Receptacle, Female Sockets

32

橄榄色

Aerospace, Military

8542.39.00.01

Threaded

现场可编程门阵列

7.5A

CMOS

BOTTOM

A

BALL

Shielded

未说明

抗环境干扰

1 mm

compliant

橄榄色镉

19-32

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

F

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

--

-

35 mm

35 mm

-

-

10AS066K4F40E3LG
10AS066K4F40E3LG
ALTERA 数据表

627 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

SMD/SMT

82500 LAB

978967

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA,

网格排列

PLASTIC/EPOXY

Analog Devices Inc./Maxim Integrated

0.9 V

0.87 V

100 °C

10AS066K4F40E3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Bulk

MAX150

Obsolete

696

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

4.5V ~ 40V

21

0°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

SOC - Systems on a Chip

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

OTHER

1.5GHz

256KB

1A, 50mA

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

3.3V, 5V

MCU, FPGA

500kHz

3.5 mm

MAX15015A

Board(s)

现场可编程门阵列

SoC FPGA

Fully Populated

DC/DC, Step Down with LDO

FPGA - 660K Logic Elements

2, Non-Isolated

巴克

2 Core

--

SoC FPGA

40 mm

40 mm

10AS048K3F35E2LG
10AS048K3F35E2LG
ALTERA 数据表

626 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

FBGA-1152

YES

Bulkhead - Front Side Nut

Aluminum

Thermoplastic

1152

-

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965009

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

Corsair

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

10AS048K3F35E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

-

Bag

Metal

D38999/24ZD

活跃

Copper Alloy

Gold

396

-65°C ~ 200°C

Tray

Military, MIL-DTL-38999 Series III

活跃

Crimp

Receptacle, Female Sockets

19

Black

Aviation, Marine, Military

8542.39.00.01

Threaded

SOC - Systems on a Chip

7.5A

CMOS

BOTTOM

C

BALL

Shielded

未说明

IP67 - Dust Tight, Waterproof

1 mm

compliant

黑锌镍

15-19

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

D

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 480K Logic Elements

480000

2 Core

--

-

SoC FPGA

35 mm

35 mm

50.0µin (1.27µm)

-

10AS066K2F35I2LG
10AS066K2F35I2LG
ALTERA 数据表

723 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Diodes Incorporated

Tape & Reel (TR)

Obsolete

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS066K2F35I2LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.46

-40°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

660000

--

35 mm

35 mm

10AS027E4F27E3LG
10AS027E4F27E3LG
ALTERA 数据表

947 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-672

YES

672

1

SMD/SMT

33750 LAB

965282

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

1.92

0.93 V

INTEL CORP

活跃

Intel

SQUARE

BGA

10AS027E4F27E3LG

100 °C

0.87 V

未说明

0.9 V

BGA672,26X26,40

PLASTIC/EPOXY

网格排列

BGA, BGA672,26X26,40

Tray

Obsolete

240

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

0°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

27 mm

27 mm

10AS057K2F35I2SG
10AS057K2F35I2SG
ALTERA 数据表

964 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial, Disc

YES

1152-FCBGA (35x35)

1152

KYOCERA AVX

Tape & Reel (TR)

Obsolete

100V

396

BGA, BGA1152,34X34,40

网格排列

5.45

0.93 V

INTEL CORP

活跃

Intel Corporation

SQUARE

BGA

10AS057K2F35I2SG

100 °C

0.87 V

未说明

0.9 V

-40 °C

BGA1152,34X34,40

PLASTIC/EPOXY

-30°C ~ 85°C

Tray

-

0.197 Dia (5.00mm)

±5%

活跃

C0G, NP0

通用型

8542.39.00.01

22 pF

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

-

0.197 (5.00mm)

0.9 V

INDUSTRIAL

1.5GHz

256KB

Straight

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

--

-

0.157 (4.00mm)

35 mm

35 mm

-

-

10AS048E1F29E1SG
10AS048E1F29E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

DO-213AB, MELF (Glass)

YES

DO-213AB (MELF, LL41)

780

微芯片技术

Bulk

1N3027

22 Ohms

活跃

360

网格排列

29 X 29 MM, ROHS COMPLIANT, FBGA-780

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

10AS048E1F29E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.68

-55°C ~ 175°C

Tray

Military, MIL-PRF-19500/115

±2%

Discontinued at Digi-Key

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

10 µA @ 15.2 V

1.2 V @ 200 mA

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1 W

MCU, FPGA

360

3.35 mm

现场可编程门阵列

20 V

FPGA - 480K Logic Elements

480000

--

29 mm

29 mm

10AS048E2F29E2SG
10AS048E2F29E2SG
ALTERA 数据表

745 In Stock

-

最小起订量: 1

最小包装量: 1

YES

780

Corsair

Bag

MS27497E12B

活跃

360

10AS048E2F29E2SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

29 mm

29 mm

10AS066K4F35E3SG
10AS066K4F35E3SG
ALTERA 数据表

872 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

660000 LE

24

SMD/SMT

82500 LAB

973546

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

Molex

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

10AS066K4F35E3SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Bulk

121065

活跃

396

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 660K Logic Elements

660000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS032H1F35E1SG
10AS032H1F35E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-LQFP

YES

100-LQFP (14x20)

1152

Renesas Electronics America Inc

82

Tray

R5F100

A/D 20x8/10b

活跃

Non-Compliant

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

0.9 V

0.87 V

100 °C

10AS032H1F35E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

-40°C ~ 85°C (TA)

Tray

RL78/G13

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

OTHER

Internal

32MHz

20K x 8

1.6V ~ 5.5V

RL78

DMA, LVD, POR, PWM, WDT

FLASH

16-Bit

256KB (256K x 8)

CSI, I²C, LINbus, UART/USART

MCU, FPGA

3.5 mm

现场可编程门阵列

8K x 8

FPGA - 320K Logic Elements

--

35 mm

35 mm

AGFB027R31C2I3V
AGFB027R31C2I3V
Intel 数据表

726 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Free Hanging (In-Line)

Free Hanging (In-Line)

Hirose Electric Co Ltd

Female

Bulk

50 Ohms

UFL-2HF

-

活跃

Female

6 GHz

-

1.13mm OD Coaxial Cable

720

-40°C ~ 90°C

U.FL

Gray

-

U.FL (UMCC) to U.FL (UMCC)

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

U.FL (UMCC) Plug, Right Angle

U.FL (UMCC) Plug, Right Angle

FPGA - 2.7M Logic Elements

-

-

2.756 (70.00mm)

XCVM1502-2MLIVSVA2197
XCVM1502-2MLIVSVA2197
AMD 数据表

879 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

AGFA022R31C2I3E
AGFA022R31C2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

AGFB008R24C3I3E
AGFB008R24C3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

576

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

XCVC1902-1LSEVIVA1596
XCVC1902-1LSEVIVA1596
AMD 数据表

533 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

AGFB027R25A1E1V
AGFB027R25A1E1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

624

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCZU15EG-2FFVC900E
XCZU15EG-2FFVC900E
AMD 数据表

932 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU15

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

XCZU5CG-1SFVC784I
XCZU5CG-1SFVC784I
AMD 数据表

659 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU5

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

AGFB023R25A2I3E
AGFB023R25A2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGFB014R24B2E4F
AGFB014R24B2E4F
Intel 数据表

794 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

768

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

AGIB022R31B2I3V
AGIB022R31B2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU2CG-1SFVA625I
XCZU2CG-1SFVA625I
AMD 数据表

2700 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-