类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 插入材料 | 终端数量 | 后壳材料,电镀 | 第一种连接器安装类型 | 第二个连接器安装类型 | 厂商 | Voltage-Input | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 组成 | 颜色 | 应用 | 功率(瓦特) | HTS代码 | 电容量 | 紧固类型 | 子类别 | 触点类型 | 额定电流 | 技术 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | 样式 | Reach合规守则 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 房屋颜色 | 失败率 | 引线间距 | 电源 | 温度等级 | 注意 | 振荡器类型 | 速度 | 内存大小 | 反向泄漏电流@ Vr | 外壳尺寸,MIL | 不同 If 时电压 - 正向 (Vf) | 引线样式 | 电压 - 供电 (Vcc/Vdd) | 输出电流 | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 功率 - 最大 | 电缆开口 | 电压 - 输出 | 建筑学 | 频率开关 | 输入数量 | 座位高度-最大 | 使用的 IC/零件 | 提供的内容 | 可编程逻辑类型 | 电压 - 齐纳(标准值)(Vz) | 产品类别 | 包括 | 第一个连接器 | 第二个连接器 | EEPROM 大小 | 板型 | 主要目的 | 主要属性 | 输出和类型 | 调节器拓扑 | 逻辑单元数 | 核数量 | 闪光大小 | 特征 | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 触点表面处理厚度 - 配套 | 材料可燃性等级 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | 10AS022E3F27I2SG | ALTERA | 数据表 | 824 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 面板安装 | FBGA-672 | YES | Flange | Circular | 铝合金 | - | 672 | 220000 LE | 1 | SMD/SMT | 27500 LAB | 964738 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | Conesys | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS022E3F27I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | Box | D38999/20FJ | 20 (2), 10 Power (9) | 活跃 | 240 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | -65°C ~ 200°C | Tray | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | 活跃 | 插座外壳 | 用于内螺纹插座 | 11 (2 + 9 Power) | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | Crimp | CMOS | BOTTOM | E | BALL | Shielded | 未说明 | 抗环境干扰 | 1 mm | compliant | 化学镍 | 25-11 | S-PBGA-B672 | 240 | 不合格 | Silver | 0.9 V | INDUSTRIAL | 不包括触点 | 1.5GHz | 256KB | J | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | - | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | - | SoC FPGA | 27 mm | 27 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E2F27I2SG | ALTERA | 数据表 | 683 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-672 | YES | 672 | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964963 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | Vishay Sfernice | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E2F27I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Tape & Reel (TR) | 最后一次购买 | 240 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F29E2LG | ALTERA | 数据表 | 741 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 0603 (1608 Metric) | YES | 0603 | 780 | 1.2 GHz | 220000 LE | 1 | SMD/SMT | 27500 LAB | 964739 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | KOA Speer Electronics, Inc. | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS022E3F29E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | Tape & Reel (TR) | RN731J | Obsolete | 288 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.5% | 活跃 | 2 | ±10ppm/°C | 517 Ohms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 288 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.022 (0.55mm) | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K3F35E2SG | ALTERA | 数据表 | 895 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 面板安装 | 1152-BBGA, FCBGA | YES | Bulkhead - Front Side Nut | Composite | 1152-FCBGA (35x35) | Thermoplastic | 1152 | - | TE Connectivity Deutsch 连接器 | 0.93 V | 5.45 | - | Bulk | Composite | ACT94 | Discontinued at Digi-Key | Copper Alloy | Gold | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057K3F35E2SG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | -65°C ~ 175°C | Tray | MIL-DTL-38999 Series III, ACT | 活跃 | Crimp | Receptacle, Female Sockets | 32 | 橄榄色 | Aerospace, Military | 8542.39.00.01 | Threaded | 现场可编程门阵列 | 7.5A | CMOS | BOTTOM | A | BALL | Shielded | 未说明 | 抗环境干扰 | 1 mm | compliant | 橄榄色镉 | 19-32 | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | F | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | -- | - | 35 mm | 35 mm | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K4F40E3LG | ALTERA | 数据表 | 627 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | SMD/SMT | 82500 LAB | 978967 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, | 网格排列 | PLASTIC/EPOXY | Analog Devices Inc./Maxim Integrated | 0.9 V | 0.87 V | 100 °C | 有 | 10AS066K4F40E3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | Bulk | MAX150 | Obsolete | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 4.5V ~ 40V | 21 | 0°C ~ 100°C (TJ) | Tray | - | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | 1.5GHz | 256KB | 1A, 50mA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.3V, 5V | MCU, FPGA | 500kHz | 3.5 mm | MAX15015A | Board(s) | 现场可编程门阵列 | SoC FPGA | Fully Populated | DC/DC, Step Down with LDO | FPGA - 660K Logic Elements | 2, Non-Isolated | 巴克 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K3F35E2LG | ALTERA | 数据表 | 626 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 面板安装 | FBGA-1152 | YES | Bulkhead - Front Side Nut | Aluminum | Thermoplastic | 1152 | - | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 480000 LE | 1 | SMD/SMT | 60000 LAB | 965009 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Corsair | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K3F35E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | - | Bag | Metal | D38999/24ZD | 活跃 | Copper Alloy | Gold | 396 | -65°C ~ 200°C | Tray | Military, MIL-DTL-38999 Series III | 活跃 | Crimp | Receptacle, Female Sockets | 19 | Black | Aviation, Marine, Military | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | 7.5A | CMOS | BOTTOM | C | BALL | Shielded | 未说明 | IP67 - Dust Tight, Waterproof | 1 mm | compliant | 黑锌镍 | 15-19 | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | D | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | - | SoC FPGA | 35 mm | 35 mm | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F35I2LG | ALTERA | 数据表 | 723 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | Diodes Incorporated | Tape & Reel (TR) | Obsolete | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K2F35I2LG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.46 | -40°C ~ 100°C (TJ) | Tray | - | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E4F27E3LG | ALTERA | 数据表 | 947 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-672 | YES | 672 | 1 | SMD/SMT | 33750 LAB | 965282 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 1.92 | 0.93 V | INTEL CORP | 活跃 | Intel | SQUARE | BGA | 10AS027E4F27E3LG | 有 | 100 °C | 0.87 V | 未说明 | 0.9 V | BGA672,26X26,40 | PLASTIC/EPOXY | 网格排列 | BGA, BGA672,26X26,40 | Tray | Obsolete | 240 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 0°C ~ 100°C (TJ) | Tray | - | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K2F35I2SG | ALTERA | 数据表 | 964 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial, Disc | YES | 1152-FCBGA (35x35) | 1152 | KYOCERA AVX | Tape & Reel (TR) | Obsolete | 100V | 396 | BGA, BGA1152,34X34,40 | 网格排列 | 5.45 | 0.93 V | INTEL CORP | 活跃 | Intel Corporation | SQUARE | BGA | 10AS057K2F35I2SG | 有 | 100 °C | 0.87 V | 未说明 | 0.9 V | -40 °C | BGA1152,34X34,40 | PLASTIC/EPOXY | -30°C ~ 85°C | Tray | - | 0.197 Dia (5.00mm) | ±5% | 活跃 | C0G, NP0 | 通用型 | 8542.39.00.01 | 22 pF | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | 0.197 (5.00mm) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Straight | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | -- | - | 0.157 (4.00mm) | 35 mm | 35 mm | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048E1F29E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-213AB, MELF (Glass) | YES | DO-213AB (MELF, LL41) | 780 | 微芯片技术 | Bulk | 1N3027 | 22 Ohms | 活跃 | 360 | 网格排列 | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | PLASTIC/EPOXY | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048E1F29E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.68 | -55°C ~ 175°C | Tray | Military, MIL-PRF-19500/115 | ±2% | Discontinued at Digi-Key | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 360 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | 10 µA @ 15.2 V | 1.2 V @ 200 mA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1 W | MCU, FPGA | 360 | 3.35 mm | 现场可编程门阵列 | 20 V | FPGA - 480K Logic Elements | 480000 | -- | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048E2F29E2SG | ALTERA | 数据表 | 745 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | 780 | 有 | Corsair | Bag | MS27497E12B | 活跃 | 360 | 10AS048E2F29E2SG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.47 | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 360 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | -- | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K4F35E3SG | ALTERA | 数据表 | 872 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | 660000 LE | 24 | SMD/SMT | 82500 LAB | 973546 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | Molex | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K4F35E3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | Bulk | 121065 | 活跃 | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H1F35E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-LQFP (14x20) | 1152 | Renesas Electronics America Inc | 82 | Tray | R5F100 | A/D 20x8/10b | 活跃 | Non-Compliant | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | 0.9 V | 0.87 V | 100 °C | 有 | 10AS032H1F35E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.66 | -40°C ~ 85°C (TA) | Tray | RL78/G13 | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | OTHER | Internal | 32MHz | 20K x 8 | 1.6V ~ 5.5V | RL78 | DMA, LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB (256K x 8) | CSI, I²C, LINbus, UART/USART | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | 8K x 8 | FPGA - 320K Logic Elements | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C2I3V | Intel | 数据表 | 726 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Free Hanging (In-Line) | Free Hanging (In-Line) | Hirose Electric Co Ltd | Female | Bulk | 50 Ohms | UFL-2HF | - | 活跃 | Female | 6 GHz | - | 1.13mm OD Coaxial Cable | 720 | -40°C ~ 90°C | U.FL | Gray | - | U.FL (UMCC) to U.FL (UMCC) | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | U.FL (UMCC) Plug, Right Angle | U.FL (UMCC) Plug, Right Angle | FPGA - 2.7M Logic Elements | - | - | 2.756 (70.00mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-2MLIVSVA2197 | AMD | 数据表 | 879 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | 活跃 | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R31C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R24C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1LSEVIVA1596 | AMD | 数据表 | 533 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R25A1E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-2FFVC900E | AMD | 数据表 | 932 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU15 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5CG-1SFVC784I | AMD | 数据表 | 659 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU5 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB023R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB014R24B2E4F | Intel | 数据表 | 794 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 768 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB022R31B2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-1SFVA625I | AMD | 数据表 | 2700 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | Tray | XCZU2 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - |
10AS022E3F27I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
8,936.304882
10AS032E2F27I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
14,790.600774
10AS022E3F29E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10,301.672373
10AS057K3F35E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
31,432.542885
10AS066K4F40E3LG
ALTERA
分类:Embedded - System On Chip (SoC)
35,248.985964
10AS048K3F35E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
35,124.874524
10AS066K2F35I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
54,652.580484
10AS027E4F27E3LG
ALTERA
分类:Embedded - System On Chip (SoC)
8,884.613230
10AS057K2F35I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
39,996.537813
10AS048E1F29E1SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS048E2F29E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
20,644.684505
10AS066K4F35E3SG
ALTERA
分类:Embedded - System On Chip (SoC)
26,023.191503
10AS032H1F35E1SG
ALTERA
分类:Embedded - System On Chip (SoC)
AGFB027R31C2I3V
Intel
分类:Embedded - System On Chip (SoC)
199,673.587166
XCVM1502-2MLIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
95,532.778319
AGFA022R31C2I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFB008R24C3I3E
Intel
分类:Embedded - System On Chip (SoC)
XCVC1902-1LSEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
187,603.126246
AGFB027R25A1E1V
Intel
分类:Embedded - System On Chip (SoC)
XCZU15EG-2FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
37,605.083093
XCZU5CG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
12,130.417705
AGFB023R25A2I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFB014R24B2E4F
Intel
分类:Embedded - System On Chip (SoC)
75,057.899575
AGIB022R31B2I3V
Intel
分类:Embedded - System On Chip (SoC)
XCZU2CG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
2,542.800449
