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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 主要属性 | 逻辑单元数 | 闪光大小 | 长度 | 宽度 | |||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 5CSXFC6C6U23C7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSXFC6C6U23C7N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.56 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSXFC6 | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | ||||||
| XCVM1802-2LLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | AMD | Tray | 活跃 | 500 | -40°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2SBG485I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | 活跃 | 130 | Tray | XC7Z030 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
| XCVP1802-2MSELSVC4072 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 780 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal® Premium | - | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||
| AGFB014R24C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 744 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | 活跃 | XCZU3 | Bulk | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
| XA7Z020-1CLG484Q | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | AMD | 活跃 | 130 | Tray | XA7Z020 | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, Zynq®-7000 XA | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
| AGFD023R25A2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-2MSEVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA014R24B1E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 768 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||
| AGFA027R31C2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 720 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||
| 10AS057 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Intel | Bulk | 活跃 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-2MSIVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 活跃 | Tray | 478 | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-1MSEVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1LLIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | Tray | 活跃 | 726 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1LSIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | Tray | 活跃 | 726 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1LSEVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | Tray | 活跃 | 770 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-2LLEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | Tray | 活跃 | 692 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-2LSEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 692 | 0°C ~ 100°C (TJ) | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||
| AGFA008R16A3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 384 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-2MLIVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFD019R25A2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-3SFVA625E | AMD | 数据表 | 536 In Stock | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | Tray | Obsolete | 180 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| AGFB014R24C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 744 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||
| AGFA008R24C2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 576 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - |
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5CSXFC6C6U23C7N
ALTERA
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2LLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z030-2SBG485I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVP1802-2MSELSVC4072
AMD
分类:Embedded - System On Chip (SoC)
-
AGFB014R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU3CG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
-
XA7Z020-1CLG484Q
AMD
分类:Embedded - System On Chip (SoC)
-
AGFD023R25A2E4F
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1502-2MSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA014R24B1E1V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA027R31C2E2V
Intel
分类:Embedded - System On Chip (SoC)
-
10AS057
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1502-2MSIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVE1752-1MSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1LLIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1LSIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1LSEVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVC1802-2LLEVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVC1802-2LSEVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
AGFA008R16A3E3E
Intel
分类:Embedded - System On Chip (SoC)
-
XCVE1752-2MLIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
AGFD019R25A2E4X
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU2EG-3SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
-
AGFB014R24C2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA008R24C2E3E
Intel
分类:Embedded - System On Chip (SoC)