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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量												厂商																											操作温度	包装	系列	零件状态	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	周边设备	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量	座位高度-最大	可编程逻辑类型	产品类别	主要属性	逻辑单元数
AGFB027R24C2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			744	Tray	-40°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.7M Logic Elements			-
1SX040HH3F35E1VG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	Intel	活跃			374	Tray	0°C ~ 100°C (TJ)		Stratix® 10 SX																	1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						FPGA - 400K Logic Elements			-
AGIB027R31B2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			720	Tray	-40°C ~ 100°C (TJ)		Agilex I																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.7M Logic Elements			-
XC7Z020-1CLG484CES	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-LFBGA, CSPBGA	484-CSPBGA (19x19)	AMD	Tray	Obsolete	XC7Z020			130	0°C ~ 85°C (TJ)		Zynq®-7000																	667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Artix™-7 FPGA, 85K Logic Cells			-
AGFB022R24C3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			744	Tray	0°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.2M Logic Elements			-
XCVM1302-2MLINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思	活跃			+ 110 C	- 40 C	1	Xilinx	Xilinx	316	Tray	-40°C ~ 100°C (TJ)		Versal™ Prime			SOC - Systems on a Chip											800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells			-	SoC FPGA
XCVM1402-2MLENBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思	活跃			Xilinx	Xilinx	1	0 C	+ 110 C	424	Tray	0°C ~ 100°C (TJ)		Versal™ Prime			SOC - Systems on a Chip											800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					System-On-Modules - SOM	Versal™ Prime FPGA, 1.2M Logic Cells			-	SoC FPGA
XCVM1302-2MLENBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思	活跃			+ 110 C	0 C	1	Xilinx	Xilinx	316	Tray	0°C ~ 100°C (TJ)		Versal™ Prime			SOC - Systems on a Chip											800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells			-	SoC FPGA
XCVM1802-2LSEVFVC1760-5189	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 110 C	0 C		1	Xilinx	Xilinx									SOC - Systems on a Chip											700 mV														System-On-Modules - SOM					SoC FPGA
XCVM1302-2MSINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思	活跃			+ 110 C	- 40 C	1	Xilinx	Xilinx	316	Tray	-40°C ~ 100°C (TJ)		Versal™ Prime			SOC - Systems on a Chip											800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells			-	SoC FPGA
MPFS250TS-FCS536M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-LFBGA	微芯片技术	活跃			MCU - 136, FPGA - 372	Tray			PolarFire™																	-	2.2MB	RISC-V	DMA, PCI, PWM		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 254K Logic Modules			128kB
AGFA022R24C2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			744	Tray	-40°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.2M Logic Elements			-
M2S060T-1VFG784	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-FBGA	784-VFBGA (23x23)	微芯片技术	活跃			+ 85 C	0 C	SMD/SMT	56500 LE	Tray	0°C ~ 85°C (TJ)		SmartFusion®2																	166MHz		ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 60K Logic Modules
10AS032H2F35E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	973486	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032H2F35E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	0°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃	8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant		S-PBGA-B1152	384	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.5 mm	现场可编程门阵列	SoC FPGA	FPGA - 320K Logic Elements	320000	2 Core	--	SoC FPGA	35 mm	35 mm
10AS066K3F40E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	660000 LE	21	SMD/SMT	82500 LAB	973541	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS066K3F40E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46	696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	0°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃	8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant		S-PBGA-B1517	696	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	696	3.5 mm	现场可编程门阵列	SoC FPGA	FPGA - 660K Logic Elements	660000	2 Core	--	SoC FPGA	40 mm	40 mm
AGFB019R25A2E4F	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			480	Tray	0°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 1.9M Logic Elements			-
AGIB027R29A2E2VR3	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			720	Tray	0°C ~ 100°C (TJ)		Agilex I																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.7M Logic Elements			-
XCVP1202-2MSEVSVA2785	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2785-BFBGA	2785-BGA (50x50)	AMD	活跃			780	Tray	0°C ~ 100°C (TJ)		Versal® Premium																	600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Premium FPGA, 2M Logic Cells			-
5CSXFC6D6F31I7	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BGA	YES	896-FBGA (31x31)	896	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V	未说明	1.07 V	无	5CSXFC6D6F31I7	BGA		SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.57	MCU - 181, FPGA - 288	BGA, BGA896,30X30,40	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SX	活跃		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	1 mm	compliant		S-PBGA-B896	288	不合格		1.1,1.2/3.3,2.5 V		800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		288	2 mm	现场可编程门阵列		FPGA - 110K Logic Elements	110000		--		31 mm	31 mm
5CSEBA6U23I7SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	有	5CSEBA6U23I7SN	FBGA		SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.57	MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE	活跃		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant	5CSEBA6	S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V		800MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	1.85 mm	现场可编程门阵列		FPGA - 110K Logic Elements	110000		--		23 mm	23 mm
5CSEBA2U23A7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)				MCU - 181, FPGA - 145	-40°C ~ 125°C (TJ)	Tray	Automotive, AEC-Q100, Cyclone® V SE	活跃																700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						FPGA - 25K Logic Elements			--
TDA4AL88TGAALZRQ1	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	770-BFBGA, FCBGA	770-FCBGA (23x23)	德州仪器	- 40 C	SMD/SMT	155	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	活跃			32 kB	48 kB	12.5 MHz	+ 125 C	-40°C ~ 125°C (TJ)		Automotive, AEC-Q100														1.71 V to 1.89 V			2GHz, 1GHz, 1GHz	1.5MB	ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x	DMA, PWM, WDT		MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB	DSP, MCU, MPU	64 bit					-		3 Core	-
XCVM1402-1LSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	活跃			424	Tray	0°C ~ 100°C (TJ)		Versal™ Prime																	400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVM1302-1LLINSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	活跃			316	Tray	-40°C ~ 100°C (TJ)		Versal™ Prime																	400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVM1402-2MLIVFVC1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD 赛灵思	活跃	+ 110 C	- 40 C			748	Tray	-40°C ~ 100°C (TJ)		Versal™ Prime														800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-