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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量												厂商																												操作温度	包装	系列	零件状态	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	输入数量	座位高度-最大	可编程逻辑类型	产品类别	收发器数量	主要属性	逻辑单元数
MPFS250TS-FC1152M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	微芯片技术			MCU - 136, FPGA - 372	Tray	活跃			PolarFire™																-	2.2MB	RISC-V	DMA, PCI, PWM		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 254K Logic Modules			128kB
XCVM1402-2LSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			424	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime																450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVC1702-1LLINSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			500	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1M Logic Cells			-
XCVC1702-1LSENSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			500	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ AI Core																400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1M Logic Cells			-
XCVM1302-2MSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			316	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime																600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
AGFA012R24C3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			744	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 1.2M Logic Elements			-
AGFB014R24C2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			744	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 1.4M Logic Elements			-
XCVM1302-1MSIVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1			+ 110 C	- 40 C																			800 mV
XCVM1302-2HSIVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1			+ 110 C	- 40 C																			880 mV
XCVM1402-2HSIVFVC1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD 赛灵思	Tray	活跃			+ 110 C	- 40 C	748	-40°C ~ 100°C (TJ)		Versal™ Prime													880 mV			800MHz, 1.65GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVM1402-1LLINSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			424	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ Prime																400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVM1302-2HSIVFVC1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD 赛灵思	+ 110 C	- 40 C			532	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ Prime													880 mV			800MHz, 1.65GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVM1302-2LLENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			316	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime																450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVM1402-1MSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			424	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime																600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVM1402-2MSINSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			424	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ Prime																600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
1SX250LH3F55I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-2912	4 x 32 kB	-				1160	有	This product may require additional documentation to export from the United States.	4 x 32 kB	1 GHz	2500000 LE	+ 100 C	- 40 C	10	SMD/SMT	312500 LAB		956204	Intel	Intel / Altera	Stratix	Details	-40°C ~ 100°C (TJ)	Tray	Stratix® 10 SX	活跃		SOC - Systems on a Chip										0.85 V			1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				SoC FPGA	24 Transceiver	FPGA - 2500K Logic Elements		4 Core	--	SoC FPGA
10AS066N1F40I1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FBGA (40x40)	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	有	10AS066N1F40I1HG	活跃	INTEL CORP	5.66			588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	+ 100 C	- 40 C	21	SMD/SMT	82500 LAB		965029	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃		SOC - Systems on a Chip						unknown				950 mV			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				SoC FPGA		FPGA - 660K Logic Elements		2 Core	--	SoC FPGA
10AS066N2F40I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	660000 LE	21	SMD/SMT	82500 LAB	965319	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS066N2F40I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.44	588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃	8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B1517	588	不合格		0.9 V	INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	588	3.5 mm	现场可编程门阵列	SoC FPGA	FPGA - 660K Logic Elements	660000	2 Core	--	SoC FPGA	40 mm	40 mm
XC7Z020-1CLG400C	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA, CSPBGA	400-CSPBGA (17x17)	AMD	XC7Z020	活跃			130	Tray	0°C ~ 85°C (TJ)		Zynq®-7000																667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Artix™-7 FPGA, 85K Logic Cells			-
AGFA006R16A2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			384	Tray	活跃	-40°C ~ 100°C (TJ)		Agilex F																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 573K Logic Elements			-
AGFB027R25A2E4F	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			624	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.7M Logic Elements			-
XCVE1752-1MSENSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD					Tray	活跃			*
XCZU4EG-2SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	XCZU4	活跃			252	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
AGFA012R24B2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			活跃	Tray	768	0°C ~ 100°C (TJ)		Agilex F																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 1.2M Logic Elements			-
AGFB006R16A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			384	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 573K Logic Elements			-