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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 供应商器件包装 | 本体材质 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 类型 | 引脚数量 | 工作电源电压 | 端口的数量 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 数据总线宽度 | 地址总线宽度 | 密度 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 螺柱尺寸 | 闪光大小 | 产品长度 | 设备核心 | RoHS状态 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 1SX280LU2F50E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 704 | 0°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | 活跃 | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||
| 10AS048E2F29E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | 360 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||
| AGFC023R25A2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||
| XCZU47DR-1FSVG1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||
 | 10AS048H2F34I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1152-BBGA, FCBGA | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| XC7Z030-L2FBG484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 163 | AMD | 1.05 V | 表面贴装 | 130 | Tray | XC7Z030 | 活跃 | Industrial grade | 125,000 | FCBGA | 1.0000 V | 0.95 V | -40 to 100 °C | Zynq®-7000 | 484 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2L | Kintex™-7 FPGA, 125K Logic Cells | 157,200 | - | |||||||||||||||||||||||
| XC7Z010-L1CLG400I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | 130 | AMD | 1.05 V | 表面贴装 | 130 | Tray | XC7Z010 | 活跃 | Industrial grade | 28,000 | CSBGA | 1.0000 V | 0.95 V | -40 to 100 °C | Zynq®-7000 | 400 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1L | Artix™-7 FPGA, 28K Logic Cells | 35,200 | - | |||||||||||||||||||||||
| XC7Z035-3FFG900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Brass | AMD | 1.05 V | 130 | Tray | XC7Z035 | 活跃 | 18 to 14, 18 AWG | 0.95 V | 0°C ~ 100°C (TJ) | Zynq®-7000 | 环形舌片端子 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Kintex™-7 FPGA, 275K Logic Cells | 3.5 mm | - | 18.64 mm | |||||||||||||||||||||||||||
| XC7Z100-L2FFG1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 1.0000 V | AMD | FCBGA | 444,000 | 130 | Tray | XC7Z100 | 活跃 | Industrial grade | 表面贴装 | 1.05 V | 400 | 0.95 V | -40 to 100 °C | Zynq®-7000 | 1156 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2L | Kintex™-7 FPGA, 444K Logic Cells | 554,800 | - | |||||||||||||||||||||||
| XC7Z030-2FBG484E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | AMD | 1.2, 3.3 V | FCBGA | 2 | 表面贴装 | 130 | Tray | XC7Z030 | 活跃 | 0 to 100 °C | Zynq®-7000 | 484 | 1 V | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 125K Logic Cells | - | ARM Cortex A9 | |||||||||||||||||||||||||||
| XC7Z035-1FFG900C | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 5.0000 V | Asynchronous | 32 kWords | 8 Bit | AMD | 表面贴装 | 275,000 | 0.95 V | 130 | 1.05 V | 130 | Tray | XC7Z035 | 活跃 | Industrial grade | SOIC N | -40 to 85 °C | Zynq®-7000 | 28 | 1 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 15 Bit | 256 Kb | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||||
| AGIB027R31A1E1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | ||||||||||||||||||||||||||||||||||||||
| AGIB022R31A1I2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | ||||||||||||||||||||||||||||||||||||||
| A2F500M3G-FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | MCU - 25, FPGA - 66 | Tray | A2F500 | 活跃 | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||
| MPFS460T-1FCG1152IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | MCU - 136, FPGA - 468 | Tray | 活跃 | -40°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||
 | AMA3B2KK-KBR | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 108-BGA | 108-BGA (5.3x4.3) | 74 | AMA3B2KK | -40°C ~ 85°C | Tape & Reel (TR) | Apollo3 Blue Plus | 活跃 | 96MHz | 768KB | ARM? Cortex?-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | GPIO, I2C, SPI, UART/USART, USB OTG | MCU | 2MB | |||||||||||||||||||||||||||||||||||||
| SOM-2533BN0C-U0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.6GHz | 4GB | Intel® N97 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | ||||||||||||||||||||||||||||||||||||||||
| SOM-2533BN0C-S0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.7GHz | 4GB | Intel® N200 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | ||||||||||||||||||||||||||||||||||||||||
| SOM-2533DNCC-S8A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.8GHz | 16GB | Intel® i3-N305 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | 64GB | |||||||||||||||||||||||||||||||||||||||
| SOM-2533CCBC-S5A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.4GHz | 8GB | Intel® Atom® x7425E | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | 32GB | |||||||||||||||||||||||||||||||||||||||
| XA7Z010-1CLG225Q | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | AMD | 86 | Tray | XA7Z010 | 活跃 | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, Zynq®-7000 XA | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | |||||||||||||||||||||||||||||||||||
| XCVC1802-2LSEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||
| AGFC019R31C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||||||||||
| AGIC040R39A1E2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 4.047M Logic Elements | ||||||||||||||||||||||||||||||||||||||
| AGFA019R31C2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements |
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1SX280LU2F50E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
-
10AS048E2F29E1SG
ALTERA
分类:Embedded - System On Chip (SoC)
-
AGFC023R25A2I3V
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-1FSVG1517E
AMD
分类:Embedded - System On Chip (SoC)
-
10AS048H2F34I1HG
Intel
分类:Embedded - System On Chip (SoC)
-
XC7Z030-L2FBG484I
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z010-L1CLG400I
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z035-3FFG900E
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z100-L2FFG1156I
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z030-2FBG484E
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z035-1FFG900C
AMD
分类:Embedded - System On Chip (SoC)
-
AGIB027R31A1E1VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB022R31A1I2VB
Intel
分类:Embedded - System On Chip (SoC)
-
A2F500M3G-FGG256
Microchip
分类:Embedded - System On Chip (SoC)
-
MPFS460T-1FCG1152IPP
Microchip
分类:Embedded - System On Chip (SoC)
-
AMA3B2KK-KBR
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
-
SOM-2533BN0C-U0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533BN0C-S0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533DNCC-S8A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533CCBC-S5A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
XA7Z010-1CLG225Q
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1802-2LSEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
AGFC019R31C3E3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGIC040R39A1E2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA019R31C2I3V
Intel
分类:Embedded - System On Chip (SoC)