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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数	Core																			操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	工作电源电流	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	时钟频率	程序内存大小	传播延迟	连接方式	建筑学	数据总线宽度	输入数量	可编程逻辑类型	核心架构	内存(字)	主要属性
XC7Z035-2FBG676I	Xilinx Inc.	数据表	970 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA			130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY		BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明			S-PBGA-B676							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES	2		Kintex™-7 FPGA, 275K Logic Cells	343800									ROHS3 Compliant
XC7Z010-2CLG225I	Xilinx Inc.	数据表	2848 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	225-LFBGA, CSPBGA	YES	225	86			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	225	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	766MHz	30	XC7Z010					1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-2	256000	Artix™-7 FPGA, 28K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.5mm	13mm		无	无SVHC	ROHS3 Compliant
XC7Z045-1FFG900I	Xilinx Inc.	数据表	644 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	900-BBGA, FCBGA	YES			ROMless	130		-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z045		S-PBGA-B900			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm		无		ROHS3 Compliant
XC7Z020-3CLG400E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	400-LFBGA, CSPBGA	YES	400	130			0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	866MHz	30	XC7Z020					1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-3	256000	Artix™-7 FPGA, 85K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm		无		ROHS3 Compliant
A2F500M3G-1FGG484	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484			ARM Cortex M3	Details	SMD/SMT	100 MHz	-	-	64 kB	6000 LE	204 I/O	0 C	+ 85 C	有	-	60	SmartFusion	0.534969 oz					Tray		A2F500																					1.5 V							16.5 mA							512 kB							500000				1 Core
XC7Z030-1SBG485I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-FBGA, FCBGA	485	130			-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	485	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm	667MHz	未说明					不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES		256000	Kintex™-7 FPGA, 125K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB	N	2.44mm	19mm				ROHS3 Compliant
XC7Z035-1FFG900I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	YES	900			130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900		Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM	BALL	245	1V		667MHz	30						1V				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			130 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES	1	256000	Kintex™-7 FPGA, 275K Logic Cells	343800		CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm					ROHS3 Compliant
XA7Z020-1CLG484Q	Xilinx Inc.	数据表	395 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	484			130	Automotive grade	-40°C~125°C TJ	Tray	2009	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	3 (168 Hours)	484	3A991.D	锡银铜		8542.39.00.01	BOTTOM	BALL	未说明		0.8mm	667MHz	未说明					不合格	1V		11.8V		CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM					Artix™-7 FPGA, 85K Logic Cells				N	1.6mm	19mm				ROHS3 Compliant
XC7Z007S-2CLG400I	Xilinx Inc.	数据表	960 In Stock	1: ¥201.823087 10: ¥190.399138 100: ¥179.621828 500: ¥169.454555 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES			100			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明			S-PBGA-B400				1.05V		0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES		256000	Artix™-7 FPGA, 23K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm			ROHS3 Compliant
XC7Z100-1FFG900I	Xilinx Inc.	数据表	980 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	YES			212			-40°C~100°C TJ	Tube	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z100		S-PBGA-B900				1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES		256000	Kintex™-7 FPGA, 444K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm	31mm	无		ROHS3 Compliant
XC7Z035-1FBG676I	Xilinx Inc.	数据表	990 In Stock	1: ¥5,630.870025 10: ¥5,445.715691 25: ¥5,407.860666 50: ¥5,370.268785 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES			130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	667MHz	未说明			S-PBGA-B676				1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES		256000	Kintex™-7 FPGA, 275K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm			ROHS3 Compliant
XC7Z035-1FBG676C	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA			130		0°C~85°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM	BALL	未说明	1V		667MHz	未说明			S-PBGA-B676							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES	1	256000	Kintex™-7 FPGA, 275K Logic Cells	343800		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm			ROHS3 Compliant
5CSEBA2U19I7N	Intel	数据表	680 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES			MCU - 151, FPGA - 66			-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	484				8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA2		S-PBGA-B484	66	不合格		1.13V	1.11.2/3.32.5V	1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66	现场可编程门阵列						FPGA - 25K Logic Elements		25000			1.9mm	19mm	19mm			符合RoHS标准
XC7Z030-2FBG676E	Xilinx Inc.	数据表	2451 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130			0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z030					1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm		无		ROHS3 Compliant
XC7Z010-3CLG225E	Xilinx Inc.	数据表	1500 In Stock	1: ¥713.378859 10: ¥672.998925 100: ¥634.904643 500: ¥598.966646 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	225-LFBGA, CSPBGA	YES	225			86		0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	225	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	866MHz	30	XC7Z010						1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-3	256000	Artix™-7 FPGA, 28K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.5mm	13mm		无		ROHS3 Compliant
M2S010-TQG144I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144			ARM Cortex M3	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	84 I/O	- 40 C	+ 100 C	400 kbit	有	1007 LAB	60	0.035380 oz					Tray		SmartFusion2																					1.2 V														256 kB											1 Core
XC7Z020-3CLG484E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-LFBGA, CSPBGA	YES	484	130			0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	484	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	866MHz	30	XC7Z020					1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-3	256000	Artix™-7 FPGA, 85K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	19mm		无		ROHS3 Compliant
XC7Z035-2FFG900E	Xilinx Inc.	数据表	20 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA			130		0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY		BOTTOM	BALL	245	1V	1mm	800MHz	30			S-PBGA-B900							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES	2		Kintex™-7 FPGA, 275K Logic Cells	343800				3.35mm	31mm	31mm			ROHS3 Compliant
XC7Z010-3CLG400E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	400-LFBGA, CSPBGA	YES	400	130			0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	866MHz	30	XC7Z010					1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-3	256000	Artix™-7 FPGA, 28K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm		无		ROHS3 Compliant
XC7Z035-2FFG676E	Xilinx Inc.	数据表	600 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA			130		0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY		BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明			S-PBGA-B676							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			110 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES	2		Kintex™-7 FPGA, 275K Logic Cells	343800				3.37mm					ROHS3 Compliant
XC7Z030-3FBG484E	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484	130			0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	250	1V	1mm	1GHz	30	XC7Z030					1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-3	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm		无		ROHS3 Compliant
XC7Z045-1FFG676I	Xilinx Inc.	数据表	631 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES			ROMless	130		-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1	yes	活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z045	676	S-PBGA-B676			1V	1.05V	11.8V		CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB	N	3.37mm	27mm		无		ROHS3 Compliant
M2S010-TQG144	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144			ARM Cortex M3	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	84 I/O	0 C	+ 85 C	400 kbit	有	1007 LAB	60	0.035380 oz					Tray		SmartFusion2																					1.2 V														256 kB											1 Core
XC7Z035-L2FBG676I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES			130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明			S-PBGA-B676				1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES		256000	Kintex™-7 FPGA, 275K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm			ROHS3 Compliant
M2S005-VFG256I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256		ARM Cortex M3	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	161 I/O	- 40 C	+ 100 C	191 kbit	有	505 LAB	119						Tray		SmartFusion2																					1.2 V														128 kB											1 Core