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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	生命周期状态	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量			Core									厂商																													操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	温度等级	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	程序内存大小	传播延迟	连接方式	建筑学	数据总线宽度	组织结构	座位高度-最大	可编程逻辑类型	核心架构	边界扫描	速度等级	内存(字)	主要属性	寄存器数量	逻辑单元数	核数量	总线兼容性	等效门数	闪光大小
XCZU6CG-1FFVB1156I	Xilinx Inc.	数据表	815 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA										328	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 469K+ Logic Cells													ROHS3 Compliant
XA7Z020-1CLG400Q	Xilinx Inc.	数据表	2430 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	400-LFBGA, CSPBGA	400	Automotive grade							130	-40°C~125°C TJ	Tray	2010	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		BOTTOM	BALL	未说明		0.8mm		667MHz	未说明				不合格	1V		11.8V			CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b					ARM				Artix™-7 FPGA, 85K Logic Cells								N	1.6mm	17mm			ROHS3 Compliant
XC7Z010-L1CLG400I	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	400-LFBGA, CSPBGA								130	-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	未说明	1V	0.8mm		667MHz	未说明		S-PBGA-B400								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						ARM	YES		256000	Artix™-7 FPGA, 28K Logic Cells	35200				CAN; ETHERNET; I2C; SPI; UART; USB				1.6mm	17mm	17mm		ROHS3 Compliant
M2S025TS-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	微芯片技术	60	267	Tray	M2S025	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	85 °C	有	M2S025TS-1FGG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8					This product may require additional documentation to export from the United States.	Details	0°C ~ 85°C (TJ)	Tray		SmartFusion2	e1						Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250		1 mm	compliant				S-PBGA-B484	267	不合格			1.2 V	OTHER					166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267		2.44 mm	现场可编程门阵列				FPGA - 25K Logic Modules			27696	1 Core			256KB		23 mm	23 mm
XC7Z035-3FFG900E	Xilinx Inc.	数据表	956 In Stock	1: ¥20,206.366908 10: ¥19,541.940920 25: ¥19,406.098227 50: ¥19,271.199831 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA								130	0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900		Tin/Silver/Copper (Sn/Ag/Cu)				BOTTOM	BALL	245	1V	1mm		800MHz	30		S-PBGA-B900								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			90 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						ARM	YES	3	256000	Kintex™-7 FPGA, 275K Logic Cells	343800				CAN; ETHERNET; I2C; SPI; UART; USB								ROHS3 Compliant
XCZU9EG-2FFVB1156E	Xilinx Inc.	数据表	826 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA										328	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 599K+ Logic Cells													ROHS3 Compliant
5CSEBA5U23I7N	Intel	数据表	720 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES					MCU - 181, FPGA - 145					-40°C~100°C TJ	Tray	2018	Cyclone® V SE	e1		活跃	3 (168 Hours)	672	3A991	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明	5CSEBA5	S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	622MHz			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145			现场可编程门阵列					FPGA - 85K Logic Elements			85000						1.85mm	23mm	23mm		符合RoHS标准
XC7Z030-1FBG484C	Xilinx Inc.	数据表	980 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484		130						0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		BOTTOM	BALL	250	1V	1mm		667MHz	30	XC7Z030				1V	1.05V				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b					ARM	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells					CAN; ETHERNET; I2C; SPI; UART; USB				2.54mm	23mm		无	ROHS3 Compliant
5CSXFC4C6U23I7N	Intel	数据表	2158 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES					MCU - 181, FPGA - 145					-40°C~100°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明	5CSXFC4	S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145			现场可编程门阵列					FPGA - 40K Logic Elements			40000						1.85mm	23mm	23mm		符合RoHS标准
XCZU11EG-2FFVC1760I	Xilinx Inc.	数据表	60 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA										512	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 653K+ Logic Cells													ROHS3 Compliant
A2F200M3F-1CS288	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	288-TFBGA, CSPBGA	YES	288-CSP (11x11)	288	ARM Cortex M3	-	有	2000 LE	64 kB	-	-	100 MHz	N	微芯片技术	MCU - 31, FPGA - 78	Tray	A2F200	活跃	TFBGA, BGA288,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA288,21X21,20	1.5 V	未说明	1.425 V	85 °C	无	A2F200M3F-1CS288	100 MHz	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.575 V	5.24						SmartFusion	176	0°C ~ 85°C (TJ)	Tray		A2F200	e0						锡铅银		8542.39.00.01	CMOS	BOTTOM	BALL	未说明		0.5 mm	compliant				S-PBGA-B288	78	不合格			1.5,1.8,2.5,3.3 V	OTHER					100MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		256 kB		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA		78	4608 CLBS, 200000 GATES	1.05 mm	现场可编程门阵列				ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops		4608	4608	1 Core		200000	256KB		11 mm	11 mm
XC7Z007S-2CLG225I	Xilinx Inc.	数据表	1600 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	225-LFBGA, CSPBGA	YES					54					-40°C~100°C TJ	Tray	2016	Zynq®-7000	e1	yes	活跃	3 (168 Hours)	225		Tin/Silver/Copper (Sn/Ag/Cu)				BOTTOM	BALL	260	1V	0.8mm			30		S-PBGA-B225				1.05V			0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							YES		256000	Artix™-7 FPGA, 23K Logic Cells					CAN; ETHERNET; I2C; SPI; UART; USB				1.5mm	13mm	13mm		ROHS3 Compliant
M2S010TS-1VFG256I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	ARM Cortex M3		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB		119									Tray		SmartFusion2																																					256 kB																	1 Core
5CSEMA2U23I7N	Intel	数据表	1440 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES					MCU - 181, FPGA - 145					-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672						BOTTOM	BALL	未说明	1.1V	0.8mm			未说明		S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145			现场可编程门阵列					FPGA - 25K Logic Elements			25000						1.85mm	23mm	23mm		符合RoHS标准
5CSEBA2U23C7SN	Intel	数据表	13 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES					MCU - 181, FPGA - 145					0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明		S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145			现场可编程门阵列					FPGA - 25K Logic Elements			25000						1.85mm	23mm	23mm		符合RoHS标准
5CSEBA6U23I7N	Intel	数据表	2916 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES					MCU - 181, FPGA - 145					-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明	5CSEBA6	S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145			现场可编程门阵列					FPGA - 110K Logic Elements			110000						1.85mm	23mm	23mm		符合RoHS标准
5CSEBA2U19C8N	Intel	数据表	13 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES					MCU - 151, FPGA - 66					0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	484				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明	5CSEBA2	S-PBGA-B484	66	不合格		1.13V	1.11.2/3.32.5V		1.07V				600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66			现场可编程门阵列					FPGA - 25K Logic Elements			25000						1.9mm	19mm	19mm		符合RoHS标准
XCZU4EG-1SFVC784E	Xilinx Inc.	数据表	10 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA										252	0°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 192K+ Logic Cells													ROHS3 Compliant
M2S005S-VFG256I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	ARM Cortex M3	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	119										Details		Tray		SmartFusion2																																					128 kB																	1 Core
XCZU4EV-1FBVB900E	Xilinx Inc.	数据表	32 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA										204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 192K+ Logic Cells													ROHS3 Compliant
A2F500M3G-1CSG288	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	288-TFBGA, CSPBGA	288-CSP (11x11)	ARM Cortex M3	微芯片技术							This product may require additional documentation to export from the United States.	Details	100 MHz	-	-	64 kB	6000 LE	有	-	176	SmartFusion	MCU - 31, FPGA - 78	Tray	A2F500	活跃		0°C ~ 85°C (TJ)	Tray		A2F500																															100MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		512 kB		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA										ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops				1 Core			512KB
M2S010T-1VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES		400-VFBGA (17x17)	400	This product may require additional documentation to export from the United States.	Details	ARM Cortex M3	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	微芯片技术	90	2.5, 3.3 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	有	M2S010T-1VFG400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.27					-40 to 100 °C	Tray		SmartFusion2	e1						Tin/Silver/Copper (Sn/Ag/Cu)			CMOS	BOTTOM	BALL	250		0.8 mm	compliant				S-PBGA-B400	195	不合格			1.2 V						166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		195		1.51 mm	现场可编程门阵列		1		FPGA - 10K Logic Modules			12084	1 Core		256KB			17 mm	17 mm
M2S050-FG484I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	ARM Cortex M3		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB		60									Tray		SmartFusion2																																					256 kB																	1 Core
10AS066H3F34I2SG	Intel	数据表	5650 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	YES					492					-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)					8542.39.00.01		BOTTOM	BALL	未说明	0.9V	1mm			未说明		S-PBGA-B1152	492	不合格		0.93V	0.9V		0.87V				1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		492			现场可编程门阵列					FPGA - 660K Logic Elements			660000						3.65mm	35mm	35mm		符合RoHS标准
XCZU3CG-1SFVC784I	Xilinx Inc.	数据表	648 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA										252	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明													500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 154K+ Logic Cells													ROHS3 Compliant