category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量		Core															厂商																																			操作温度	包装	系列	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	程序内存大小
M2S150TS-1FC1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	574	Tray	M2S150	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	0°C ~ 85°C (TJ)	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 150K Logic Modules		1 Core	512KB
M2S090TS-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	325-FCBGA (11x13.5)	ARM Cortex M3	微芯片技术	180	Tray	M2S090	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 90K Logic Modules		1 Core	512KB
M2S090T-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	1.26 V	267	微芯片技术	Tray	M2S090	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	1.14 V	有	M2S090T-1FGG484I	BGA	SQUARE	活跃	FPGA - Field Programmable Gate Array M2S090T-1FGG484I	MICROSEMI CORP	1.26 V	5.77			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	1.2000 V	1.14 V	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	40		S-PBGA-B484	267	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列		1	FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S060T-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S060T-1FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃	FBGA-484	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	267	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列			FPGA - 60K Logic Modules	56520	1 Core	256KB	23 mm	23 mm
M2S010TS-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	M2S010	活跃				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	0°C ~ 85°C (TJ)	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 10K Logic Modules		1 Core	256KB
M2S050TS-1FGG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	M2S050	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	27	377	Tray	0°C ~ 85°C (TJ)	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules		1 Core	256KB
M2S060TS-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	176	SmartFusion2	RISC	1.2, 1.5, 1.8, 2.5, 3.3 V	1	CAN/Ethernet/Serial I2C/SPI/UART/USB	有	表面贴装	200	Tray	M2S060	活跃	Industrial grade			-40 to 100 °C	Tray	SmartFusion2																325				1.2 V			CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit				Industrial		FPGA - 60K Logic Modules		1 Core	256KB
M2S060-VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	有	4710 LAB	90	SmartFusion2	1.2000 V	1.14 V	1.26 V	207	Tray	M2S060	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	-40 to 100 °C	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						STD	FPGA - 60K Logic Modules		1 Core	256KB
M2S025-1FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S025-1FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	180	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.01 mm	现场可编程门阵列			FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S010-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	-	-	166 MHz	SMD/SMT	N	This product may require additional documentation to export from the United States.	1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃					90	1007 LAB	有	12084 LE	64 kB	0 to 85 °C	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						STD	FPGA - 10K Logic Modules		1 Core	256KB
M2S090-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	1.26 V	180	微芯片技术	Tray	M2S090	活跃	5.78	1.26 V	MICROSEMI CORP	活跃	RECTANGULAR	TFBGA	M2S090-1FCSG325I	有	1.14 V	40	1.2 V	BGA325,21X21,20	PLASTIC/EPOXY	3	GRID ARRAY, THIN PROFILE, FINE PITCH	TFBGA, BGA325,21X21,20			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	1.2000 V	1.14 V	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			R-PBGA-B325	180	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列		1	FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S050T-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	Tray	微芯片技术	M2S050	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S050T-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	2.5, 3.3 V	1.14 V	1.26 V	200	0 to 85 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	200	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列		STD	FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S005S-1TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	505 LAB	60	0.046530 oz	活跃	M2S005	Tray	84					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 5K Logic Modules		1 Core	128KB
M2S090-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S090-1FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	267	Tray	M2S090	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	267	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S005-VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	505 LAB	119	0.167354 oz	微芯片技术	Tray	M2S005	活跃	LFBGA, BGA256,16X16,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S005-VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77			Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	161 I/O	0 C	+ 85 C	191 kbit	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B256	161	不合格	1.2 V	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		161	1.56 mm	现场可编程门阵列		STD	FPGA - 5K Logic Modules	6060	1 Core	128KB	14 mm	14 mm
M2S005S-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	5.88	1.26 V	MICROSEMI CORP	活跃	SQUARE	LFBGA	M2S005S-1VF400	无	85 °C	1.14 V	30	1.2 V	BGA400,20X20,32			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	90	169	Tray	M2S005	活跃	VFBGA-400	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	171	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		171	1.51 mm	现场可编程门阵列			FPGA - 5K Logic Modules	6060	1 Core	128KB	17 mm	17 mm
M2S050TS-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S050TS-1FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	200	Tray	M2S050	活跃	FBGA-325	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	200	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列			FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S005S-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	209	Tray	M2S005	活跃					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	0°C ~ 85°C (TJ)	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 5K Logic Modules		1 Core	128KB
M2S005-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	1.26 V	169	微芯片技术	Tray	M2S005	活跃	5.86	1.26 V	MICROSEMI CORP	活跃	SQUARE	LFBGA	M2S005-1VF400	无	85 °C	1.14 V	30	1.2 V	BGA400,20X20,32	PLASTIC/EPOXY	GRID ARRAY, LOW PROFILE, FINE PITCH	LFBGA, BGA400,20X20,32			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	90	1.2000 V	1.14 V	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		160	1.51 mm	现场可编程门阵列		1	FPGA - 5K Logic Modules	4956	1 Core	128KB	17 mm	17 mm
M2S025T-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	267	Tray	M2S025	活跃					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	60	0°C ~ 85°C (TJ)	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 25K Logic Modules		1 Core	256KB
M2S060-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2					85 °C	0 °C														1.2 V				166MHz	164.3 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						1	FPGA - 60K Logic Modules		1 Core	256KB
M2S050T-1FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	267	微芯片技术	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	30	1.14 V	125 °C	无	M2S050T-1FG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	活跃	M2S050	Tray	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0		3A001.A.2.C	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	267	不合格		1.2 V	MILITARY		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列			FPGA - 50K Logic Modules	56340	1 Core	256KB	23 mm	23 mm
M2S090T-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S090T-1FCSG325I	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.78			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃	FBGA-325	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			R-PBGA-B325	180	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S150TS-FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	ARM Cortex M3	微芯片技术	1.2 V	40	1.14 V	有	M2S150TS-FCVG484I	FBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	84	273	Tray	M2S150	活跃	VFBGA-484	GRID ARRAY, FINE PITCH	4	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	有		Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01		BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B484							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			3.15 mm	现场可编程门阵列			FPGA - 150K Logic Modules		1 Core	512KB	19 mm	19 mm
M2S010-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	195	Tray	M2S010	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	90	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 10K Logic Modules		1 Core	256KB